dsPIC dsPIC™ 33CK, Functional Safety (FuSa) Microcontroller IC 16-Bit 100MHz 128KB (128K x 8) FLASH 48-UQFN (6x6) 28/36/48/64/80-Pin Digital Signal Controllers with High-Resolution PWM and CAN Flexible Data (CAN FD) perating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle Divide • LiveUpdate • Code Efficient (C and Assembly) Architecture • 40-Bit Wide Accumulators • Single-Cycle (MAC/MPY) with Dual Data Fetch • Single-Cycle, Mixed-Sign MUL Plus Hardware Divide • 32-Bit Multiply Support • Four Sets of Interrupt Context Saving Registers which Include Accumulator and STATUS for Fast Interrupt Handling • Zero Overhead Looping • RAM Memory Built-In Self-Test (MBIST) Clock Management • Internal Oscillator • Programmable PLLs and Oscillator Clock Sources • Reference Clock Output • Fail-Safe Clock Monitor (FSCM) • Fast Wake-up and Start-up • Backup Internal Oscillator Power Management • Low-Power Management Modes (Sleep, Idle, Doze) • Integrated Power-on Reset and Brown-out Reset High-Speed PWM • Eight PWM Pairs • Up to 250 ps PWM Resolution • Dead Time for Rising and Falling Edges • Dead-Time Compensation • Clock Chopping for High-Frequency Operation • PWM Support for: - DC/DC, AC/DC, inverters, PFC, lighting - BLDC, PMSM, ACIM, SRM motors • Fault and Current Limit Inputs • Flexible Trigger Configuration for ADC Triggering Timers/Output Compare/Input Capture • One General Purpose Timer • Peripheral Trigger Generator (PTG): - Up to 15 trigger sources to other peripheral modules - CPU independent state machine-based instruction sequencer • Nine MCCP/SCCP modules which Include Timer, Capture/Compare and PWM: - One MCCP - Eight SCCPs - 16 or 32-bit time base - 16 or 32-bit capture - 4-deep capture buffer • Fully Asynchronous Operation, Available in Sleep Modes

20 Position Connector Header, Center Strip Contacts Surface Mount Gold DF30FC-20DP-0.4V(81) is a 20-position, 0.4 mm pitch, surface-mount (SMT) board-to-board mezzanine connector from the Hirose DF30 series. It is the plug/header (DP) side of the connector pair and is designed for ultra-low-profile, high-density PCB stacking applications commonly found in compact embedded systems, cameras, wireless modules, industrial electronics, and portable devices. The connector features gold-plated contacts for reliable electrical performance and supports a mating height of approximately 0.9 mm when paired with the corresponding receptacle. 20 contacts / positions 0.4 mm fine pitch for high-density designs Board-to-board (mezzanine) connector Surface-mount (SMT) mounting Ultra-low mating height (~0.9 mm) Gold-plated contacts for improved reliability Straight orientation Compact footprint for space-constrained applications Rated for approximately 50 mating cycles Operating temperature range: -35°C to +85°C RoHS compliant Typical Applications Embedded computing modules Camera and imaging systems Industrial control equipment IoT devices Portable electronics Wireless communication modules #Hirose #DF30Series #BoardToBoardConnector #MezzanineConnector #SMTConnector #HighDensityConnector #0p4mmPitch #EmbeddedSystems #IoT #ElectronicsDesign #PCBDesign #CompactElectronics #ConnectorSolutions

Display Modules - LED Character and Numeric White 7-Segment 1 Character Common Anode 2.95V 5mA 0.512" H x 0.386" W x 0.148" D (13.00mm x 9.80mm x 3.75mm) 10-SMD, No Lead #commonpartslibrary #displaymodule #ledcharacter

Plugin AC-DC Power Modules ROHS #Relay #Power-relay

Isolated Module DC DC Converter 2 Output 15V -15V 170mA, 170mA 4.5V - 9V Input The REC5-0515DRW/H6/C/SMD-R specification defines the engineering requirements for an isolated DC-DC converter module designed for regulated power conversion in compact electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure stable voltage conversion, reliable isolation, and long-term operational performance. The device is intended for use in embedded systems, industrial control equipment, communication modules, and distributed power architectures where isolated power rails are required. It provides regulated output power from a DC input source while maintaining galvanic isolation between input and output stages to enhance system safety and signal integrity. Engineering Requirements The power module shall be manufactured using controlled electronic assembly processes and high-reliability components to ensure stable conversion efficiency and consistent output regulation. The internal architecture shall support isolated power transfer with stable performance under defined load and environmental conditions. Electrical characteristics shall ensure stable output regulation, low output ripple, and reliable transient response during load variation. The device shall maintain consistent performance across its intended operating temperature range and input voltage variation conditions. Isolation performance shall ensure electrical separation between input and output circuits to protect downstream electronics and maintain system safety requirements. The module shall withstand electrical stress conditions defined by applicable safety and reliability standards. Thermal performance shall support continuous operation without degradation of output regulation or reliability under rated operating conditions. The device shall be suitable for PCB mounting and shall maintain structural integrity during soldering and long-term operation. Workmanship shall be free from defects such as contamination, cracks, soldering defects, or structural irregularities that could affect electrical performance or mechanical reliability. Manufacturing and inspection shall be performed using controlled processes and calibrated equipment. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures. Documentation Supporting documentation shall include datasheets, electrical performance reports, isolation certification data, qualification test records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through the formal engineering change control system. Each revision shall undergo technical validation and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #DCDCConverter #PowerModule #IsolatedPower #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerSupply #QualityAssurance #EngineeringDocumentation

Display Modules - LED Character and Numeric Orange-Red 7-Segment 2 Character Common Anode 1.8V 5mA 0.673" H x 0.984" W x 0.315" D (17.10mm x 25.00mm x 8.00mm) 18-DIP (0.600", 15.24mm)

The NX3225GD 8.000MHz STD-CRA-3 is a surface-mount quartz crystal resonator designed to provide a stable and accurate clock reference for electronic circuits. It is housed in a compact ceramic package suitable for space-constrained applications and is optimized for low power consumption and reliable frequency generation. This crystal is commonly used in microcontrollers, wireless communication modules, industrial control systems, consumer electronics, IoT devices, and embedded systems requiring precise timing and frequency control. Features Fundamental mode quartz crystal resonator Nominal frequency of 8.000 MHz Compact surface-mount ceramic package High frequency stability and accuracy Low equivalent series resistance Suitable for low-power oscillator circuits Excellent aging characteristics RoHS-compliant construction Designed for automated SMT assembly processes Reliable operation across industrial temperature environments Electrical Characteristics Crystal type: Quartz Crystal Resonator Frequency: 8.000 MHz Oscillation mode: Fundamental Load capacitance: Standard load capacitance configuration Frequency tolerance: Standard precision grade Frequency stability: Industrial-grade stability performance Equivalent series resistance optimized for MCU and RF oscillator circuits Low drive level operation High insulation resistance Mechanical Characteristics Surface-mount package Ceramic hermetic enclosure Compact footprint suitable for high-density PCB layouts Compatible with standard reflow soldering processes Designed for automated pick-and-place assembly Applications Microcontroller clock generation Wireless communication devices Bluetooth and RF modules IoT and smart devices Industrial automation equipment Embedded control systems Consumer electronics Timing and synchronization circuits Sensor interface modules Portable battery-powered products Compliance RoHS compliant Lead-free package Environmentally friendly manufacturing standards Suitable for commercial and industrial electronic applications #commonpartslibrary #crystal #quartzcrystal #frequencycontrol #timingdevice #clocksource #oscillator #smtcomponent #embeddedsystems #wirelesscommunication #industrialelectronics #consumerelectronics #iotdevices #passivecomponents #electroniccomponents

Bluetooth Modules - 802.15.1 ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - Jedec Tray #CommonPartsLibrary #Bluetooth #module #integratedCircuit

Multiprotocol Modules Multiprotocol Module, 2,4 GHz w/PCB Antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault High, MVP(AI/ML), Certified #MCU #RF-Transceiver #arduino-matter

Multiprotocol Modules Multiprotocol Module, 2,4 GHz w/PCB Antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault Mid, Certified #MCU #RF-Transceiver #arduino-matter

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents