Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount The ESP32-S3-WROOM-1U-N16R8 is a high-performance embedded module designed for IoT and edge computing applications, featuring integrated wireless connectivity and enhanced processing capabilities. Processor: Dual-core Xtensa LX7, up to 240 MHz Wireless Connectivity: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth LE 5.0 Memory Configuration (N16R8): 16 MB Flash memory 8 MB PSRAM Antenna Type: U.FL connector for external antenna (“1U” variant) Indicates support for an external antenna via U.FL connector Allows improved RF performance and flexible antenna placement #commonpartslibrary #rf #wireless #transceiver #module

Low power long range transceiver module, SPI and parallel interface, 915 MHz, spreading factor 6 to12, bandwith 7.8 to #RF #LoRa #STM32 #ARM #commonpartslibrary

BNC Connector Jack, Female Socket 50 Ohms Through Hole Solder #commonpartslibrary #connector #BNC #Coaxial #RF

IC RF TxRx + MCU Bluetooth Bluetooth v5.3 2.4GHz 48-VFQFN Exposed Pad #commonpartslibrary #transceiver #integratedcircuit #arduino-matter

RF ANTENNA Bluetooth, Wi-Fi, WLAN, Zigbee™ Ceramic Patch Solder Surface Mount The SWLP.2450.10.4.A.02 specification defines the engineering requirements for a surface-mount radio frequency antenna designed for wireless communication applications operating within the 2.4 GHz frequency band. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure efficient RF transmission and reception, stable antenna performance, and long-term operational reliability in embedded electronic systems. The antenna is intended for use in wireless communication devices supporting technologies such as Bluetooth, Wi-Fi, Zigbee, Thread, and other 2.4 GHz ISM band protocols. It is optimized for compact PCB integration while providing efficient radiation characteristics, stable impedance matching, and dependable performance in space-constrained electronic products including IoT devices, industrial controllers, consumer electronics, and smart sensing platforms. Engineering Requirements The antenna shall be manufactured using qualified conductive and dielectric materials with controlled production processes to ensure consistent RF performance, mechanical durability, and long-term reliability. The construction shall maintain stable electrical characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall provide efficient radiation efficiency, stable impedance matching, low return loss, and reliable signal transmission and reception across the intended operating frequency range. The antenna shall maintain consistent performance when integrated according to the recommended PCB layout and grounding practices. The RF structure shall minimize insertion losses and support reliable wireless communication while maintaining acceptable gain, bandwidth, and radiation pattern characteristics. The antenna shall exhibit stable performance under normal operating conditions without significant degradation caused by thermal variation or environmental exposure. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental stress without degradation of electrical or structural performance. Workmanship shall be free from defects including cracks, contamination, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, impedance matching recommendations, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFAntenna #WirelessCommunication #Antenna #Bluetooth #WiFi #IoT #EmbeddedSystems #QualityAssurance #EngineeringDocumentation

IC RF TxRx + MCU General ISM < 1GHz - 142MHz ~ 1.05GHz 20-VFQFN Exposed Pad #commonpartslibrary #RF #integratedcircuit

Linear Voltage Regulator IC Positive Fixed 1 Output 500mA SOT-23-5 The TLV75533PDBVR is a low-dropout (LDO) linear voltage regulator designed to provide a stable 3.3 V output from a higher input voltage source. It features ultra-low quiescent current and high power-supply rejection ratio (PSRR), making it ideal for battery-powered and noise-sensitive applications such as IoT devices, portable electronics, and RF circuits. The device is optimized for fast transient response and stable operation with small ceramic output capacitors. Key Features Fixed output voltage: 3.3 V Low dropout voltage (typ. ~200 mV at full load) Ultra-low quiescent current (typ. 25 µA) High PSRR for noise-sensitive applications Stable with small ceramic capacitors (≥1 µF) Thermal shutdown and overcurrent protection Available in compact SOT-23-5 package (DBV) Absolute Maximum Ratings Input voltage: –0.3 V to 6.5 V Output voltage: –0.3 V to (VIN + 0.3 V) Operating junction temperature: –40°C to +125°C Storage temperature range: –65°C to +150°C Recommended Operating Conditions Input voltage range: 1.45 V to 5.5 V Output voltage: 3.3 V (fixed) Output current: up to 500 mA Operating temperature range: –40°C to +125°C Electrical Characteristics (Typical unless otherwise noted) Output voltage accuracy: ±1% Dropout voltage: ~200 mV @ 500 mA Quiescent current: ~25 µA PSRR: up to 70 dB (at 1 kHz) Line regulation: <0.05%/V Load regulation: <0.5% Pin Configuration (SOT-23-5) Pin 1: IN – Input voltage Pin 2: GND – Ground Pin 3: EN – Enable (active high) Pin 4: NC – No connect Pin 5: OUT – Regulated output Typical Application Power management for microcontrollers and sensors Battery-powered portable devices RF and analog circuits requiring low noise supply IoT and wearable electronics Protection Features Thermal shutdown protection Overcurrent protection Undervoltage lockout (UVLO) #commonpartsLibrary #integratedcircuit #powermanagement #voltageregulator

RF Amplifier IC CATV, Cellular, DBS, MMDS, PCS, WLAN, Wireless LAN 50MHz ~ 4GHz SOT-89 #commonpartslibrary #amplifier #RF #integratedcircuit

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

802.15.4 Bluetooth, Wi-Fi Bluetooth v5.0, ZigBee® Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N4 is based on the ESP32-C6 single-core RISC-V microcontroller, integrating advanced wireless standards and secure connectivity in a small module format. It is designed for next-generation IoT devices that require Wi-Fi 6 efficiency, mesh networking, and Bluetooth Low Energy support. Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless Connectivity: Wi-Fi 6 (802.11ax, 2.4 GHz) Bluetooth LE 5.0 IEEE 802.15.4 (Thread / Zigbee support) Memory (N4 variant): 4 MB Flash Security: Secure boot Flash encryption Cryptographic hardware acceleration #commonpartslibrary #rf #wireless #transceiver #module #zigbee

Multiprotocol BLE/ANT/2.4 GHz/802.15.4 Cortex-M4F SoC, nRF52833 module #RF #nRF52833 #BLE #ARM #commonpartslibrary