dsPIC dsPIC™ 30F Microcontroller IC 16-Bit 20 MIPS 12KB (4K x 24) FLASH 44-TQFP (10x10) #CommonPartsLibrary #IntegratedCircuit #Microcontroller #Embedded #DSPIC30F2023

RT1062 Teensy 4.1 - ARM® Cortex®-M7 MCU 32-Bit Embedded Evaluation Board #commonpartslibrary #developmentboard #rt1062 #teensy4.1 #mcu32

PIC PIC® XLP™ 18J Microcontroller IC 8-Bit 48MHz 16KB (8K x 16) FLASH 28-SOIC #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC18F24J11

PIC PIC® 16F, Functional Safety (FuSa) Microcontroller IC 8-Bit 32MHz 3.5KB (2K x 14) FLASH 14-SOIC #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16F15223

PIC PIC® 16C Microcontroller IC 8-Bit 20MHz 1.5KB (1K x 12) OTP 14-SOIC #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16C505

Accelerometer X, Y, Z Axis ±400g 160Hz ~ 2.56kHz 16-LGA (3x3.25) The ADXL373BCCZ-RL7 is an ultralow power, high-g digital MEMS accelerometer developed by Analog Devices for motion sensing and impact detection applications. The device is optimized for battery-powered and always-on systems requiring continuous acceleration monitoring with minimal power consumption. It supports selectable measurement ranges suitable for shock, vibration, and activity monitoring in industrial, wearable, medical, asset tracking, and IoT applications. The accelerometer integrates embedded motion detection features, a FIFO buffer, and interrupt capabilities to reduce host processor workload and overall system power consumption. Engineering Specification Device Type Ultralow power 3-axis digital MEMS accelerometer Manufacturer Analog Devices Inc. Manufacturer Part Number ADXL373BCCZ-RL7 Measurement Axes Three-axis acceleration sensing Acceleration Range Selectable full-scale ranges supporting high-g measurements up to ±400 g Output Interface SPI digital serial communication interface Resolution High-resolution digital acceleration output with integrated filtering and signal conditioning Power Supply Requirement Operates from a low-voltage DC supply suitable for portable and embedded systems Power Consumption Designed for extremely low current operation during measurement and wake-up monitoring modes Embedded Features Integrated activity detection Motion and impact sensing FIFO data buffering Interrupt generation Wake-up detection functionality Sampling and Performance Programmable output data rates and filtering options for optimized noise and bandwidth performance Operating Temperature Range Industrial temperature range suitable for harsh environmental applications Package Type LGA surface-mount package Mounting Style Surface mount technology Application Areas Impact event recording Condition monitoring Asset tracking Industrial sensing Wearable electronics Portable instrumentation Shock and vibration monitoring Always-on motion detection systems #commonpartslibrary #integratedcircuit #accelerometer #sensor

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

The TGS2611-C00 specification defines the engineering requirements for a semiconductor gas sensor designed for the detection of combustible gases in industrial, commercial, and embedded monitoring systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate gas detection, stable sensing characteristics, and long-term operational reliability. The sensor is intended for use in gas leak detection equipment, safety monitoring systems, residential and commercial appliances, industrial automation, and environmental monitoring applications. It utilizes semiconductor sensing technology to detect target combustible gases with high sensitivity and repeatable performance, enabling reliable monitoring and early warning in safety-critical environments. Engineering Requirements The gas sensor shall be manufactured using qualified semiconductor sensing materials and controlled production processes to ensure consistent sensitivity, repeatability, and long-term stability. The sensing element shall maintain reliable performance under specified operating voltage, temperature, humidity, and environmental conditions. Electrical characteristics shall provide stable output response, repeatable detection performance, and predictable recovery behavior following gas exposure. The sensor shall maintain reliable operation during continuous monitoring while minimizing drift and preserving measurement consistency throughout its service life. The sensing element shall provide dependable detection of the intended combustible gases while maintaining resistance to environmental influences and normal operational contaminants. The sensor shall exhibit stable response characteristics suitable for integration with embedded control systems and gas monitoring electronics. Mechanical construction shall provide adequate protection for the sensing element while allowing sufficient exposure to the surrounding atmosphere for effective gas diffusion. The package shall withstand handling, vibration, thermal cycling, and standard assembly processes without degradation of sensing performance or structural integrity. Workmanship shall be free from defects including contamination, mechanical damage, corrosion, package deformation, or structural inconsistencies that could adversely affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, gas sensitivity characteristics, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #GasSensor #CombustibleGasSensor #SemiconductorSensor #GasDetection #IndustrialSafety #EmbeddedSystems #EnvironmentalMonitoring #QualityAssurance #EngineeringDocumentation

JST PH Connector Header Through Hole, Right Angle 4 position 0.079" (2.00mm) The S4B-PH-K-S(LF)(SN) is a 4-position, single-row, right-angle (side-entry) male header designed for 2.0 mm pitch wire-to-board connections. It is a through-hole mounted, shrouded connector that ensures reliable and secure mating with compatible PH series housings and crimp terminals. This connector is commonly used in consumer electronics, embedded systems, power supplies, and industrial control boards, especially where space-saving and dependable connections are required. Key Features Connector Type: Shrouded male header (wire-to-board) Number of Positions: 4 pins (single row) Pitch: 2.0 mm Orientation: Right-angle (side entry) Mounting Type: Through-hole (THT) Termination: Solder Electrical Characteristics Rated Voltage: 100 V Rated Current: 2 A per contact Insulation Resistance: ≥1000 MΩ Contact Resistance: Low (typically ≤10–20 mΩ) Mechanical & Material Contact Material: Brass / phosphor bronze with tin plating Housing Material: PA66 (Nylon), UL94 V-0 flame rated Locking Mechanism: Detent lock for secure mating Shrouded Design: Prevents misalignment and protects pins Environmental Operating Temperature: −25 °C to +85 °C #CommonPartsLibrary #Connector #Header #JSTPH #MalePins #RightAngle #4pos

Molex SL series right-angle PCB header with latch and split pegs, 2.54mm (0.100") pitch wire-to-board connector, available in 2 to 25 circuit positions, through-hole mounting, 0.64mm square pins, glass-filled polyester UL94V-0 housing, phosphor bronze terminals, positive locking latch for secure cable retention, designed for reliable signal and power connections in industrial, consumer, automotive and embedded electronic applications. Molex 70551-0003 Molex SL header, Molex SL series connector, Molex 70400, Molex 70430, right angle header with latch, split peg header, 2.54mm wire to board connector, 0.100 inch header, Molex SL right angle header, locking PCB header, through hole connector, phosphor bronze header, Molex wire to board system Hashtags: #MolexSL #MolexConnector #SLSeries #WireToBoardConnector #RightAngleHeader #LockingHeader #SplitPegHeader #254mmPitch #100MilConnector #ThroughHoleConnector #PCBHeader #PhosphorBronzeContacts #IndustrialConnector #EmbeddedHardware #Molex70400 #Molex704302.54mm Pitch SL Header, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Beveled Plastic Peg, 4 Circuits, Tin (Sn) Plating

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount The ESP32-S3-WROOM-1U-N16R8 is a high-performance embedded module designed for IoT and edge computing applications, featuring integrated wireless connectivity and enhanced processing capabilities. Processor: Dual-core Xtensa LX7, up to 240 MHz Wireless Connectivity: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth LE 5.0 Memory Configuration (N16R8): 16 MB Flash memory 8 MB PSRAM Antenna Type: U.FL connector for external antenna (“1U” variant) Indicates support for an external antenna via U.FL connector Allows improved RF performance and flexible antenna placement #commonpartslibrary #rf #wireless #transceiver #module

Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivities, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot. All of these make it suitable for embedded ML, like intelligent voice and vision AI. #SeeedStudio #xiao