1.5µH Shielded Drum Core, Wirewound Inductor 1.9 A 137mOhm Max 0806 (2016 Metric) The Bourns SRP2010-1R5M is a 1.5 µH wirewound drum-core power inductor designed for high-current, low-loss power conversion applications such as buck/boost converters in compact electronics like smartphones, tablets, SSDs, and embedded systems. It uses a metal powder (iron powder) core with magnetic shielding, which helps reduce EMI (electromagnetic interference) and improves efficiency in high-frequency switching circuits. Key Features Inductance: 1.5 µH Tolerance: ±20% Current Rating (Irms): ~1.9 A Saturation Current (Isat): ~2.5 A Low DCR: ~137 mΩ max Shielded construction (reduces magnetic radiation) Wirewound drum core design Surface-mount package (0806 / 2016 metric) Operating temperature: -40°C to +125°C RoHS compliant Typical Applications DC-DC converters (buck / boost regulators) Power management circuits in mobile devices Laptops, tablets, smartphones SSD/HDD power filtering Embedded systems and IoT devices #CommonPartsLibrary #Inductor #Coil #Choke #Fixed-Inductor #SRP2010

Bipolar (BJT) Transistor Array 2 PNP (Dual) Matched Pair 65V 100mA 175MHz 380mW Surface Mount 6-TSOP The BCM856DS,115 is a dual matched PNP bipolar junction transistor (BJT) housed in a compact SOT-363 (SC-88) 6-pin surface-mount package. It consists of two independent PNP transistors with closely matched electrical characteristics, making it suitable for differential amplifier stages, current mirrors, and signal processing applications where symmetry and thermal tracking are important. Key Features Dual PNP transistor configuration in a single package Matched transistor pair for improved circuit stability Low collector-emitter saturation voltage High current gain consistency between channels Compact SOT-363 (SC-88) package for space-constrained designs Suitable for low-power and signal-level applications Electrical Characteristics (typical values unless otherwise noted) Collector-Emitter Voltage (VCEO): -45 V Collector-Base Voltage (VCBO): -50 V Emitter-Base Voltage (VEBO): -5 V Continuous Collector Current (IC): -100 mA per transistor Power Dissipation (Ptot): ~250 mW total DC Current Gain (hFE): 100 to 300 Transition Frequency (fT): ~100 MHz Package Information Package Type: SOT-363 (SC-88) Mounting: Surface Mount Pin Count: 6 Configuration: Dual PNP (E1, B1, C2, E2, B2, C1 pin arrangement depending on layout) Applications Differential amplifier input stages Current mirror circuits Signal amplification Analog front-end designs Matched pair transistor applications Additional Notes The two transistors are thermally coupled within the same package, improving matching over temperature variations Ideal for precision analog circuits requiring closely matched transistor characteristics Commonly used in compact and high-density PCB layouts #commonpartslibrary #transistor #bjt #pnp

10 µH Shielded Drum Core, Wirewound Inductor 7.5 A 30mOhm Max Nonstandard # Engineering Specification ## Product Name SRP1038A-100M ## General Description SRP1038A-100M is a shielded surface mount power inductor designed for use in high-efficiency DC-DC conversion and power management applications. The device is intended to support energy storage and current smoothing functions in switching regulator circuits, where stable inductance performance and low power loss are critical. The inductor utilizes a ferrite core construction with a shielded magnetic structure to minimize electromagnetic interference and reduce magnetic flux leakage. This enables improved circuit density and reduced noise coupling in compact electronic assemblies. The design is optimized for use in high current power conversion systems, including buck converters, point-of-load regulators, and distributed power architectures. The component is widely used in industrial, automotive, telecommunications, and embedded systems where reliable energy transfer, thermal stability, and efficient power delivery are required. Its surface mount form factor supports automated PCB assembly and compact system integration while maintaining mechanical robustness under thermal and electrical stress. The design emphasizes low direct current resistance, high current handling capability, and stable inductance behavior under load conditions. It is suitable for applications requiring efficient power conversion with minimal energy loss and stable electromagnetic performance. ## Functional Requirements ### Energy Storage The device shall store energy in a magnetic field during switching operation in power conversion circuits. ### Current Filtering The device shall smooth current ripple in switching regulator applications to maintain stable output conditions. ### Electromagnetic Shielding The device shall reduce electromagnetic interference through a shielded magnetic structure. ### Power Conversion Support The component shall support efficient operation in DC-DC conversion systems. ## Electrical Requirements ### Inductive Performance The device shall provide stable inductance characteristics suitable for power conversion and filtering applications. ### Low Loss Operation The inductor shall minimize resistive and core losses to improve overall system efficiency. ### High Current Capability The device shall support operation under elevated current conditions typical of switching power supplies. ### Thermal Stability The inductor shall maintain performance consistency under thermal loading and temperature variation. ## Mechanical Requirements ### Surface Mount Package The device shall be supplied in a surface mount configuration suitable for automated PCB assembly processes. ### Structural Integrity The component shall withstand mechanical stress during assembly, operation, and thermal cycling. ### PCB Integration The design shall support compact layout integration in multilayer printed circuit board systems. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under conditions typical of industrial and embedded electronic systems. ### Thermal Performance The component shall maintain stable operation under continuous power cycling and heat generation. ### Storage and Handling The device shall retain structural and electrical integrity during storage, transportation, and handling. ## Quality Requirements ### Reliability The inductor shall provide consistent long-term performance under continuous electrical and thermal stress. ### Verification Electrical and thermal characteristics shall be validated through appropriate qualification and testing procedures. ### Compliance The product shall conform to applicable standards for magnetic components used in power electronics applications. ## Documentation Requirements Technical documentation shall include application guidance, layout recommendations for switching power designs, thermal considerations, electrical characteristics, and integration practices for DC-DC converter systems. ## Classification Tags #SRP1038A100M #PowerInductor #ShieldedInductor #SMDInductor #MagneticComponent #EnergyStorageInductor #DCDCConverter #BuckConverter #PowerElectronics #SMPSDesign #ElectromagneticCompatibility #EMIShielding #PCBDesign #ElectricalEngineering #EmbeddedPower #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #PowerManagement #CircuitDesign #HighCurrentInductor

600 Ohms @ 100 MHz 1 Ferrite Bead 0603 (1608 Metric) ferrite bead 600 ohm 0603 ferrite bead 600 ohm 100MHz 0603 ferrite bead 0603 600ohm The BLM18AG601SN1D is a surface-mount ferrite bead designed for suppression of high-frequency noise in electronic circuits. It provides high impedance at high frequencies while maintaining low DC resistance, making it suitable for power lines and signal line filtering. This component is commonly used in portable electronics, communication devices, and general digital circuits to improve EMI performance. ELECTRICAL CHARACTERISTICS Impedance: 600 Ω ±25% @ 100 MHz Rated Current: 500 mA (max) DC Resistance (DCR): 0.5 Ω (typ), 0.8 Ω (max) Insulation Resistance: 10 MΩ min PHYSICAL CHARACTERISTICS Package Size: 0603 (1608 Metric) Length: 1.6 mm Width: 0.8 mm Height: 0.8 mm (typ) Mounting Type: Surface Mount (SMD) ENVIRONMENTAL & OPERATING CONDITIONS Operating Temperature Range: -55°C to +125°C Storage Temperature Range: -55°C to +125°C APPLICATIONS Power supply line noise suppression Signal line EMI filtering Mobile devices and handheld electronics Computers and peripherals Consumer electronics FEATURES High impedance at high frequencies for effective noise suppression Low DC resistance minimizes signal/power loss Compact 0603 package suitable for high-density PCB layouts Reliable multilayer construction Lead-free and RoHS compliant PACKAGING Packaging Type: Tape and Reel Standard Reel Quantity: Typically 4000 pcs/reel #CommonPartLibrary #Filter #FerriteBead

USB-C (USB TYPE-C) USB 3.2 Gen 2 (USB 3.1 Gen 2, Superspeed + (USB 3.1)) Plug Connector 24 Position Board Edge, Surface Mount; Through Hole, Right Angle Global Connector Technology (GCT) USB4155-03-C is a USB Type-C Plug Connector designed for USB 3.2 Gen 2 (USB 3.1 Gen 2 SuperSpeed+) high-speed data applications. It is a right-angle, horizontal SMT connector with a 24-contact configuration, suitable for PCB edge mounting. The connector supports high-speed signal transmission, power delivery, and durable mechanical connection for embedded systems, portable devices, and consumer electronics. Key Features: Connector Type: USB Type-C Plug Connector USB Standard: USB 3.2 Gen 2 / USB 3.1 Gen 2 SuperSpeed+ Number of Contacts: 24 positions Mounting Type: Surface Mount Technology (SMT), right-angle horizontal PCB mounting Data Transfer Rate: Supports high-speed USB 3.2 Gen 2 communication (up to 10 Gbps) Current Rating: Up to 5 A for power delivery applications Voltage Rating: Up to 48 VDC Durability: Rated for approximately 10,000 mating cycles Shielding: Metal shielded housing for EMI protection Contact Finish: Gold-plated contacts for reliable conductivity Operating Temperature: -30°C to +85°C Application: Embedded systems, laptops, tablets, mobile devices, storage devices, and USB-C interface boards Component Classification: Category: Connector / Interconnect Component Subcategory: USB Type-C Connector Not an IC or semiconductor component PCB Footprint Required: Yes Mechanical Part: No (it is an electromechanical connector with soldered electrical terminals) #CommonPartsLibrary #Connector #USBTypeC #USBConnector #USB32Gen2 #USB31Gen2 #SuperSpeedPlus #GCT #BoardMountConnector #SMTConnector #HighSpeedInterface #PCBDesign #ElectronicComponents #InterconnectTechnology

Operational Amplifiers - Op Amps 4GHz Ultralow bias current FET input Op Amp SOIC-8

Bipolar (BJT) Transistor NPN 40V 200 mA 300MHz 625 mW Through Hole TO-92-3 The 2N3904TFR is a general-purpose NPN bipolar junction transistor (BJT) designed for low-power amplification and switching applications. It is widely used in signal processing, small-signal amplification, and digital switching circuits. This transistor offers fast switching speed, low saturation voltage, and reliable performance in a compact surface-mount package, making it suitable for consumer electronics, industrial controls, and embedded systems. Manufacturer Various (commonly ON Semiconductor / onsemi, Diodes Inc., Central Semiconductor) Part Number 2N3904TFR Transistor Type NPN Bipolar Junction Transistor (BJT) Configuration Single Package / Case SOT-23 (TO-236AB) Mounting Style Surface Mount (SMD/SMT) Collector-Emitter Voltage (VCEO) 40 V Collector-Base Voltage (VCBO) 60 V Emitter-Base Voltage (VEBO) 6 V Collector Current (IC) 200 mA (max) Power Dissipation (PD) ~200 mW to 350 mW (package dependent) DC Current Gain (hFE) 100 to 300 (typical, varies with operating conditions) Transition Frequency (fT) ~300 MHz Collector-Emitter Saturation Voltage (VCE(sat)) ~0.2 V (typical at IC = 10 mA, IB = 1 mA) Operating Temperature Range -55°C to +150°C Polarity NPN Packaging Tape & Reel (TFR suffix) RoHS Compliance Compliant #commonpartslibrary #transistor #bjt

20 mOhms ±1% 0.5W, 1/2W Chip Resistor 1206 (3216 Metric) Current Sense Thick Film #commonpartslibrary #resistor #1206