Dual bidirectional I2C Bus and SMBus voltage level translator, VSSOP-8 #CommonPartsLibrary #IntegratedCircuits #Logic #Translators #Level Shifters #PCA9306

Automotive, 60-V, 6-A, 30-mΩ, one-channel smart high-side switch with adjustable current limit TPS1HTC30-Q1 is a single-channel, smart high-side switch, with integrated NMOS power FET and charge pump, designed to meet the requirements of 24-V automotive battery systems. The low RON(30 mΩ) minimizes device power dissipation driving a wide range of output load current up to 6-A DC, and the 60- V DC operating range improves system robustness. The device integrates protection features such as thermal shutdown, output clamp, and current limit. These features improve system robustness during fault events such as short circuit. TPS1HTC30-Q1 implements an adjustable current limiting circuit that improves the reliability of the system by reducing inrush current when driving large capacitive loads and minimizing overload current. The device also provides an accurate load current sense that allows for improved load diagnostics such as overload and open-load detection enabling better predictive maintenance. TPS1HTC30-Q1 is available in a small 14-pin, 4.40- mm × 5.0-mm HTSSOP leaded package with 0.65- mm pin pitch minimizing the PCB footprint. • Single-channel smart high-side power switch for 24-V automotive systems with full diagnostics • Wide operating voltage range: 6 V to 60 V – OVP protection: 66 V • Low RON: 30-mΩ typical, 55-mΩ maximum • Low standby current: < 0.5 µA • Low quiescent current (Iq): < 2 mA • Improve system level reliability through adjustable current limiting – Current limit: 2 A –16 A • Accurate current sensing: ±4% at 1 A • Protection – Overload and short-circuit protection – Integrated inductive discharge clamp – Undervoltage lockout (UVLO) protection – Loss of GND, loss of supply protection – Reverse battery protection with external components • Diagnostics – On and off state output open-load and short-tobattery detection – Overload and short to ground detection – Absolute and relative thermal shutdown detection • Functional Safety-Capable – Documentation available to aid functional safety system design • Operating junction temperature: –40 to 125°C • Input control: 1.8-V, 3.3-V and 5-V logic compatible • Integrated fault sense voltage scaling for ADC protection • Qualifications – AEC-Q100 qualified for automotive applications • Temperature grade 1: –40°C to +125°C, TA • 14-pin thermally-enhanced TSSOP package TPS1HTC30AQPWPRQ1 #CommonPartsLibrary #IntegratedCircuit

Voltage Level Translator Bidirectional 1 Circuit 1 Channel 420Mbps SOT-23-6 #commonpartslibrary #integratedcircuit #voltage #level #translator

Voltage Level Translator Bidirectional 1 Circuit 8 Channel 100Mbps 20-USON (4x2) #commonpartslibrary #integratedcircuit #translator

33V (Typ) Clamp 2.7A (8/20µs) Ipp Tvs Diode Surface Mount 2-X1SON (1x0.6) The ESD601-Q1 is a bidirectional ESD protection diode. The ESD601-Q1 is offered in the industry standard 0402 (DPY) package, and offers an IEC 61000-4-2 protection level of 15kV. The device can clamp 8/20μs surges with peak pulse currents up to 2.7A in accordance with the IEC 61000-4-5 standard. The low capacitance and low leakage current provide protection against transient events in a variety of systems and applications. This protection is key for many applications, such as smaller form factors and faster data speeds, which are becoming more popular over time. Features • IEC 61000-4-2 ESD Protection: – ±15kV contact discharge – ±15kV air gap discharge • ISO 10605 (330pF, 330Ω) ESD Protection: – ±12kV contact discharge – ±15kV air-gap discharge • IEC 61000-4-5 surge protection: – 2.7A (8/20µs) • I/O capacitance: 0.3pF (typical) • Ultra low leakage current: 1nA (typical) • Low dynamic resistance 0.9Ω (typical) • Industry standard 0402 package 2 Applications • Automotive Antenna ESD Protection • RF Signal ESD Protection • Near Field Communications (NFC) • Automotive SerDes w/Power over Coax • USB Type-C (short-to-Vbus tolerant) #CommonPartsLibrary #Diode #TVS

1/1 Transceiver Half CANbus 8-SOIC The SN65HVD230DR is a high-speed Controller Area Network (CAN) transceiver designed to interface a CAN protocol controller with the physical two-wire CAN bus. It operates as a differential line driver and receiver, translating logic-level signals into robust bus-level signals suitable for automotive, industrial, and distributed control applications. The device is optimized for reliable communication in electrically noisy environments and supports low-power operation, making it suitable for systems requiring energy efficiency and extended operational stability. This transceiver conforms to widely adopted CAN physical layer standards and is intended for use in systems requiring high data integrity, fault tolerance, and electromagnetic compatibility. It integrates protection features and supports standby functionality to reduce system power consumption when communication is inactive. Functional Overview The device provides bidirectional signal conversion between a CAN controller and the differential CAN bus lines. It features a transmit data input and a receive data output, enabling full-duplex communication at the protocol level. The driver stage generates differential output signals on the bus, while the receiver stage detects and translates bus signals back into logic-level data. An internal control mechanism allows the device to enter a low-power standby mode, reducing current consumption when active communication is not required. The transceiver includes slope control capability to manage signal edge rates, which helps minimize electromagnetic interference and improves signal integrity across the network. Electrical Characteristics The transceiver operates from a single low-voltage supply and is designed for compatibility with modern microcontrollers and digital logic systems. It provides differential output drive capability with controlled rise and fall characteristics. The receiver is designed with high input sensitivity and noise immunity to ensure accurate signal detection under varying bus conditions. The device includes thermal protection and safeguards against bus faults, including short-circuit conditions. Its internal circuitry is designed to maintain stable operation across a wide range of environmental conditions and supply variations. Interface Requirements The logic interface is compatible with standard digital input and output levels, allowing direct connection to a CAN controller. The bus interface consists of two differential lines that connect to the CAN network. Proper termination and layout practices are required to ensure optimal communication performance and compliance with CAN network design guidelines. Operating Conditions The device is intended for operation across a broad temperature range suitable for industrial and automotive environments. It maintains functional integrity under typical voltage fluctuations and environmental stresses encountered in embedded systems. Protection and Reliability Features The transceiver incorporates protection mechanisms to guard against overcurrent, thermal overload, and electrostatic discharge. It is designed to maintain communication reliability even in the presence of transient disturbances and electrical noise. Packaging and Integration The SN65HVD230DR is provided in a compact surface-mount package suitable for automated assembly. Its pin configuration supports straightforward integration into printed circuit board designs with minimal external components. #CommonPartsLibrary #IntegratedCircuits #Interface #Drivers #Receivers #Transceivers #65HVD230

20 Hz ~ 20 kHz Analog Microphone Electret Condenser 3 V ~ 10 V Omnidirectional (-44dB ±2dB) PC Pins JLI 140A HD microphone microphone capsule The CMA-4544PF-W is an electret condenser microphone designed for compact audio capture applications. It features high sensitivity, low noise characteristics, and stable frequency response, making it suitable for voice recording, communication devices, and embedded audio systems. The device integrates a permanently charged electret diaphragm with a built-in FET preamplifier, enabling reliable signal output with minimal external circuitry. Key Features Electret condenser microphone element High sensitivity and signal-to-noise ratio Omnidirectional pickup pattern Compact, low-profile package Built-in FET impedance converter Stable performance over temperature range RoHS compliant Electrical Characteristics Operating Voltage: typically 2.0 V (range: 1.5 V to 10 V) Current Consumption: typically 0.5 mA Sensitivity: typically -44 dB ±3 dB (at 1 kHz, 0 dB = 1 V/Pa) Signal-to-Noise Ratio: typically 60 dB Output Impedance: typically 2.2 kΩ Frequency Response: 20 Hz to 16 kHz Acoustic Characteristics Directivity: Omnidirectional Maximum Sound Pressure Level: typically 110 dB SPL Equivalent Noise Level: typically 34 dB SPL Mechanical Characteristics Package Type: Through-hole cylindrical metal can Dimensions: approximately 4.5 mm diameter × 4.4 mm height Mounting Type: PCB through-hole Terminal Configuration: Two-pin (signal and ground) Environmental Specifications Operating Temperature Range: -20°C to +70°C Storage Temperature Range: -40°C to +85°C Applications Voice recording devices Mobile and handheld electronics Intercom and communication systems Embedded audio input modules IoT and consumer electronics Pin Configuration Pin 1: Output (Vout) Pin 2: Ground (GND / Case) Compliance RoHS compliant Suitable for general consumer electronics use #commonpartslibrary #audio #microphone #analog #condenser

13V Clamp 2.5A (8/20µs) Ipp Tvs Diode Surface Mount 5-TSSOP The PESD5V0L4UG,115 is a low-capacitance, unidirectional quad-channel Electrostatic Discharge (ESD) protection diode array from Nexperia. It is designed to protect up to four high-speed signal or data lines from ESD events and other transient voltage spikes while maintaining excellent signal integrity due to its low junction capacitance. Packaged in a compact SOT-353 (SC-88A/5-TSSOP) surface-mount package, it is well suited for space-constrained electronic designs, including communication equipment, portable devices, computers, and consumer electronics. Key Features Quad-channel unidirectional ESD protection for up to 4 signal lines 5 V reverse standoff voltage (VRWM) suitable for 5 V interfaces Low junction capacitance (~16 pF typ.) to minimize signal distortion Low clamping voltage (13 V max.) for effective transient suppression Peak pulse power of 30 W IEC 61000-4-2 Level 4 ESD protection (up to ±20 kV) Ultra-low leakage current (typically 5 nA) Compact SOT-353 (SC-88A) surface-mount package Qualified to AEC-Q100 for automotive applications Ideal for protecting USB, communication interfaces, SIM card lines, audio/video ports, and other sensitive I/O circuits. #PESD5V0L4UG115 #Nexperia #ESDProtection #TVSDiode #TransientProtection #CircuitProtection #QuadChannel #LowCapacitance #AutomotiveGrade #SOT353 #SignalIntegrity #ElectronicsDesign

Voltage Level Translator Bidirectional 1 Circuit 4 Channel 24Mbps 14-VQFN (3.5x3.5) #commonpartslibrary #integratedcircuit #voltageleveltranslator

The Arduino Nano 33 IoT (ABX00027) is an advanced evaluation platform designed for IoT applications, featuring the 32 bit ARM® Cortex®-M0+ ATSAMD21G18A MCU. This board supports WiFi and Bluetooth connectivity by utilizing the Nina W102 uBlox module, making it ideal for wireless projects. It operates at a clock speed of 48MHz and uses a 3.3V logic level. The board is equipped with 22 digital I/O pins, 8 analog inputs, and supports PWM on 5 pins. It offers communication via UART, I2C and SPI. #Module #part #SAM D, Maker

Voltage Level Translator Bidirectional 1 Circuit 2 Channel - 8-VSSOP #CommonPartsLibrary #IntegratedCircuit #Logic #Translator #Level-Shifter #PCA9306

Voltage Level Translator Bidirectional 1 Circuit 2 Channel 420Mbps 8-VSSOP #CommonPartsLibrary #IntegratedCircuit #logic #Bidirectional #translator #LevelShifter

Voltage Level Translator Bidirectional 1 Circuit 2 Channel 24Mbps 8-X2SON (1.4x1) #CommonPartsLibrary #IntegratedCircuit #logic #Bidirectional #translator #LevelShifter

Voltage Level Translator Bidirectional 1 Circuit 2 Channel 24Mbps SM8

Voltage Level Translator Bidirectional 1 Circuit 2 Channel SM8 #commonpartslibrary #integratedcircuit #voltage #level #translator

Buzzers Transducer, Externally Driven Piezo 3 V 3mA 4kHz 70dB @ 3V, 10cm Surface Mount Solder Pads The CMT-1603-SMT-TR is a compact, surface-mount piezoelectric buzzer transducer designed for applications requiring an externally driven audible indicator. Featuring a low-profile 16 × 16 mm package, it delivers reliable single-tone sound output with low current consumption, making it suitable for portable electronics, industrial equipment, consumer devices, medical instruments, and embedded systems where PCB space is limited. Key Features: Piezoelectric buzzer transducer (externally driven) Surface-mount (SMT) package with solder pad terminals Compact 16 × 16 × 2.8 mm low-profile design Low current consumption (~3 mA typical) Resonant frequency of 4 kHz Sound pressure level of 70 dB @ 3 V, 10 cm Rated voltage: 3 V Maximum input voltage: 25 Vp-p Single-tone acoustic output Operating temperature range: −30°C to +70°C Tape-and-reel (TR) packaging for automated assembly RoHS compliant #Hashtags: #PiezoBuzzer #AudioTransducer #SurfaceMount #SMTBuzzer #ExternallyDriven #LowProfile #LowCurrent #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #MedicalDevices #RoHS #commonpartslibrary #audio #buzzer

Buck-Boost Regulator Positive Output Step-Up/Step-Down I2C DC-DC Controller IC 40-VQFN (6x6) The LM51772RHAR is a high-performance multi-phase bidirectional buck-boost controller designed for power conversion systems requiring efficient energy transfer between two voltage domains. The device supports seamless operation in both step-up and step-down modes and is optimized for battery-powered, automotive, industrial, and energy storage applications. The controller enables bidirectional current flow, making it suitable for battery charging, backup power systems, supercapacitor management, and high-power USB Type-C power delivery applications. The device integrates advanced control architecture for high efficiency across a wide operating range while supporting programmable current regulation, voltage regulation, and protection features. Multi-phase capability allows reduced input and output ripple currents, improved thermal distribution, and higher overall power capability. The controller supports external MOSFETs for scalable power design flexibility and includes comprehensive monitoring and fault management functions. The LM51772RHAR is designed for operation in demanding environments with robust protection features including overvoltage protection, undervoltage lockout, cycle-by-cycle current limiting, thermal shutdown, and fault reporting. Its flexible configuration and high integration level reduce external component count and simplify implementation in high-density power systems. Key Features Bidirectional synchronous buck-boost controller architecture Supports power transfer in both forward and reverse directions Multi-phase operation for increased power capability and reduced ripple Wide input and output voltage operating range High-efficiency synchronous control using external MOSFETs Programmable current and voltage regulation Peak and average current control capability Seamless transition between buck, boost, and buck-boost operating modes Integrated current sensing support Programmable switching frequency synchronization Phase interleaving support for thermal and ripple optimization External clock synchronization capability Soft-start and controlled startup sequencing Comprehensive fault detection and protection functions Overcurrent protection and short-circuit protection Overvoltage and undervoltage protection Thermal shutdown protection Fault status reporting and system monitoring support Designed for automotive and industrial power applications Compact thermally enhanced package Typical Applications Bidirectional battery charging systems Energy storage systems Automotive dual-battery architectures USB Type-C Power Delivery systems Backup power and UPS systems Supercapacitor charging and balancing Industrial DC power conversion Renewable energy power management High-power portable electronics Telecom and server power systems Electrical Characteristics Wide operating supply voltage range High switching frequency operation capability High-current multi-phase scalability Precision current regulation accuracy Low standby power consumption High-efficiency synchronous rectification support Programmable dead-time and switching parameters Stable operation across wide temperature range Package Information Package Type: VQFN Package Suffix: RHA Thermally enhanced exposed pad package Surface-mount implementation Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powermanagement #buckboost #dcdcswitchingcontrollers

Voltage Level Translator Bidirectional 1 Circuit 8 Channel 60Mbps 20-TSSOP #CommonPartsLibrary #IntegratedCircuit #logic #Bidirectional #translator #LevelShifter

2 Line Common Mode Choke Surface Mount 100mA DCR 3Ohm (Typ) , -55C ~ 125C The ECMF2-40A100N6 and ECMF4-40A100N10 are highly integrated common mode filters designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI 2.1, HDMI 2.0, HDMI1.4, USB4, USB 3.2 Gen 2, USB 2.0, ethernet, MIPI, Display Port and other high speed serial interfaces. They have a very large differential bandwidth to comply with these standards and can also protect and filter one or two differential lanes. 10.7 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB4, USB 3.2 Gen2, USB 2.0, MIPI, Display port 2.0, etc. • High common mode attenuation on WLAN frequencies: – -15 dB at 2.4 GHz – -21 dB at 5.0 GHz – -17 dB at 6.0 GHz • Low serial resistance: 3.0 Ω • Very low PCB space consumption • Thin package: 0.5 mm max. • High reduction of parasitic elements through integration • Lead free and RoHS package • Exceeds IEC 61000-4-2 level 4 standard: – Contact discharge: ◦ ±9 kV (contact discharge, ECMF2-40A100N6) ◦ ±10 kV (contact discharge, ECMF4-40A100N10) – Air discharge: ◦ ±20 kV (air discharge, ECMF2-40A100N6) ◦ ±25 kV (air discharge, ECMF4-40A100N10)

ARM® Cortex®-M33 RT-600 Microcontroller IC 32-Bit Dual-Core 300MHz External Program Memory 176-VFBGA (9x9) The RT600 is a family of dual-core microcontrollers for embedded applications featuring an Arm Cortex-M33 CPU combined with a Cadence Xtensa HiFi4 advanced Audio Digital Signal Processor CPU. The Cortex-M33 includes two hardware coprocessors providing enhanced performance for an array of complex algorithms. The family offers a rich set of peripherals and very low power consumption. The Arm Cortex-M33 is a next generation core based on the ARMv8-M architecture that offers system enhancements, such as ARM TrustZone® security, single-cycle digital signal processing, and a tightly-coupled coprocessor interface, combined with low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M33 CPU employs a 3-stage instruction pipe and includes an internal prefetch unit that supports speculative branching. A hardware floating-point processor is integrated into the core. On the RT600, the Cortex-M33 is augmented with two hardware coprocessors providing accelerated support for additional DSP algorithms and cryptography. The Cadence Xtensa HiFi 4 Audio DSP engine is a highly optimized audio processor designed especially for efficient execution of audio and voice codecs and pre- and post-processing modules. It supports four 32x32-bit MACs, some support for 72-bit accumulators, limited ability to support eight 32x16-bit MACs, and the ability to issue two 64-bit loads per cycle. There is a floating point unit providing up to four single-precision IEEE floating point MACs per cycle. The RT600 provides up to 4.5 MB of on-chip SRAM (plus an additional 128 KB of tightly-coupled HiFi4 ram) and several high-bandwidth interfaces to access off-chip flash. The FlexSPI flash interface supports two channels and includes an 32 KB cache and an on-the-fly decryption engine. The RT600 is designed to allow the CortexM33 to operate at frequencies of up to 300 MHz and the HiFi4 DSP to operate at frequencies of up to 600 MHz. Key Features Dual-core architecture with Arm Cortex-M33 CPU and Cadence Xtensa HiFi4 DSP Cortex-M33 operating at up to 300 MHz HiFi4 DSP operating at up to 600 MHz Up to 4.5 MB on-chip SRAM 128 KB DSP tightly coupled memory (TCM) FlexSPI interface supporting Quad/Octal SPI Flash with execute-in-place (XIP) High-speed USB 2.0 Host/Device with integrated PHY Digital microphone (DMIC) interface supporting up to 8 channels Multiple I2S, SPI, I²C, UART, SDIO, and I3C interfaces 12-bit ADC with up to 1 MSPS sampling rate Hardware cryptography acceleration (AES, SHA, RSA, ECC) Arm TrustZone® security technology Secure boot and physically unclonable function (PUF) key storage Multiple low-power operating modes for battery-powered applications Up to 147 GPIOs depending on package option 176-pin VFBGA package (9 mm × 9 mm) Typical Applications Voice-controlled smart devices Audio processing and DSP systems Smart speakers and soundbars Industrial HMI and control panels Edge AI and machine learning applications IoT gateways and connected devices Wearable and portable electronics #NXP #iMXRT685 #RT600 #CortexM33 #HiFi4DSP #Microcontroller #EmbeddedSystems #EdgeAI #VoiceRecognition #AudioProcessing #IoT #IndustrialAutomation #SecureMCU #MachineLearning #MCUDesign

Voltage Level Translator Bidirectional 1 Circuit 4 Channel 100Mbps 14-VQFN (3.5x3.5) #CommonPartsLibrary #IntegratedCircuit #logic #Bidirectional #translator #LevelShifter

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign

Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

N-Channel 30 V 161A (Tc) 140W (Tc) Surface Mount TO-252AA (DPAK) The IRLR7843TRPBF is an N-channel power MOSFET built on Infineon's HEXFET technology platform, originally developed by International Rectifier. It is designed as a low-voltage, high-current switching device intended for applications where minimizing conduction loss and maximizing efficiency are primary design goals. The part is particularly well suited to synchronous switching topologies, where pairs or arrays of MOSFETs alternately conduct to regulate power flow with minimal energy dissipation. This device targets high-density power conversion applications where board space is limited but current demands are substantial, such as notebook computer power delivery, point-of-load converters used in servers, and advanced telecom and datacom equipment. It is commonly found supporting synchronous buck converter stages that step down a higher input rail to a lower output voltage suitable for powering processors, memory, and other low-voltage digital logic. Its low on-resistance characteristic allows it to carry significant current while generating comparatively little resistive heating, which is essential in compact enclosures with constrained thermal budgets. The transistor is fabricated using a refined trench gate process that improves upon earlier HEXFET generations, offering reduced gate charge and lower switching losses alongside its low conduction resistance. This combination makes it effective in both the high-side and low-side positions of a synchronous switching cell, where fast, clean transitions reduce overlap losses and improve overall converter efficiency. The device also offers well-characterized avalanche energy ratings, giving designers confidence in its ruggedness when exposed to transient overvoltage events that can occur during switching, and it presents a very low gate impedance, allowing it to be driven efficiently by standard gate driver circuitry. Mechanically, the part is housed in a surface-mount power package with an exposed tab for enhanced thermal conduction to the host PCB, allowing heat generated during operation to be efficiently transferred away from the silicon die. This package style is widely used in power-dense designs where through-hole packages would be impractical. The device is supplied in a tape-and-reel format suitable for automated assembly and is compliant with RoHS material restrictions, reflecting current environmental and regulatory standards for electronic components. Spec Sheet Identification Part Number: IRLR7843TRPBF Device Family: HEXFET Power MOSFET Manufacturer: Infineon Technologies Functional Classification Device Type: Power MOSFET Channel Type: N-channel Technology: Trench-gate HEXFET (IR MOSFET legacy technology) Logic Level Compatibility: Logic-level gate drive compatible Electrical Characteristics Drain-to-Source Voltage Rating: Low-voltage class, optimized for sub-30V rail applications On-Resistance: Ultra-low on-resistance class Drain Current Capability: High continuous current class Gate Charge: Low gate charge, optimized for fast switching Gate Impedance: Ultra-low gate impedance Avalanche Characteristics: Fully characterized avalanche voltage and current rating Switching & Application Behavior Primary Application: Synchronous buck converter switching stages Suitable Position: High-side and low-side switch positions Target Use Cases: Point-of-load conversion, notebook power delivery, telecom/datacom power systems Thermal & Mechanical Package Type: Surface-mount power package with exposed thermal tab (DPAK-style) Mounting: Surface mount technology (SMT) Thermal Path: Tab-based conduction to PCB for heat dissipation Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Packaging Format Supply Format: Tape-and-reel, per part suffix designation #IRLR7843 #Infineon #HEXFET #PowerMOSFET #NChannelMOSFET #SynchronousBuck #PowerElectronics #DCDCConverter #PointOfLoad #PowerConversion #DPAK #SMTPackage #RoHSCompliant #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #PowerDensity #LowRDSon #DiscreteSemiconductor #commonpartslibrary #transistor

ADC, Audio 32 b 8k ~ 192k I2S 20-WQFN (3x3) The PCM1822 is a high-performance, Burr-Brown™ audio analog-to-digital converter (ADC) that supports simultaneous sampling of up to two analog channels. The device supports single-ended and differential line and microphone inputs with a 1-VRMS full-scale signal. The device integrates a phase-locked loop (PLL), a DC removal high-pass filter (HPF), and supports sample rates up to 192 kHz. The device supports time-division multiplexing (TDM) or I2S audio formats, selectable with the hardware pin level. Additionally, the PCM1822 supports master and slave mode selection for the audio bus interface operation. These integrated high-performance features, along with the ability to be powered from a single supply of 3.3 V, make the device an excellent choice for costsensitive, space-constrained audio systems in far-field microphone recording applications. The PCM1822 is specified from –40°C to +125°C, and is offered in a 20-pin WQFN package. Features • Stereo high-performance ADC: – 2-channel analog microphones or line-in • ADC line and microphone differential and singleended input performance: – PCM1822 dynamic range: • 117-dB, dynamic range enhancer enabled • 111-dB, dynamic range enhancer disabled – THD+N: –95 dB • 1-VRMS full-scale input • ADC sample rate (fS) = 8 kHz to 192 kHz • Hardware pin control configurations • Linear-phase or low-latency filter selection • Flexible audio serial data interface: – Master or slave interface selection – 32-bits, 2-channel TDM – 32-bits, 2-channel I2S • Automatic power-down upon loss of audio clocks • Integrated high-performance audio PLL • Single-supply operation: 3.3 V • I/O-supply operation: 3.3 V or 1.8 V • Power consumption for 3.3-V AVDD supply: – 19.6 mW/channel at 16-kHz sample rate – 21.3 mW/channel at 48-kHz sample rate #CommonPartsLibrary #IntegratedCircuit #PCM1822IRTER #TexasInstruments #AudioADC #StereoADC #BurrBrown #I2S #TDM #AudioElectronics #EmbeddedAudio #SmartSpeaker #AVReceiver #HighResolutionAudio #PCBDesign #ElectronicsDesign #SignalProcessing