Multiprotocol Modules ESP32-C61-based module supporting 2.4 GHz Wi-Fi 6(802.11ax) and Bluetooth 5 Low Energy. Ultra-low power, compact size, high cost performance, and rich peripheral interfaces. #Module #RF-Transceiver #ESP32-C61

Bluetooth Bluetooth v5.0 Transceiver Module 2.4GHz Integrated, Chip Surface Mount #RF #Module #RF-Transceiver #BL652-SA-01

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount #WiFi #Bluetooth #ARM #ESP32 #S3 #IoT

RF ANTENNA Bluetooth, IoT, ISM, M2M, Wi-Fi, ZigBee™ Chip Solder Surface Mount #commonpartslibrary #integratedcircuit #rf #antenna

802.15.4, Bluetooth Bluetooth v5.3, Thread, Zigbee® Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount #commonpartslibrary #integratedcircuit #transceiver #zigbee #bluetooth

IC RF TxRx + MCU Bluetooth Bluetooth v5.3 2.4GHz 40-VFQFN Exposed Pad #commonpartslibrary #transceiver #integratedcircuit #arduino-matter

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount #RF #Transceiver #ESP32-S3 #Wifi #Bluetooth #CommonPartsLibrary #IntegratedCircuit #

Bluetooth Bluetooth v5.0 Transceiver Module 2.4GHz Integrated, Chip Surface Mount #BLE #IoT #RF #part

Bluetooth Modules - 802.15.1 ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - Jedec Tray #commonpartslibrary #bluetooth #module

Bluetooth Bluetooth v5.1 Transceiver Module 2.36GHz ~ 2.5GHz Integrated, Trace Surface Mount #Module #RF #Bluetooth #Ublox360 #Transceiver #Modem

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount The ESP32-S3-WROOM-1U-N16R8 is a high-performance embedded module designed for IoT and edge computing applications, featuring integrated wireless connectivity and enhanced processing capabilities. Processor: Dual-core Xtensa LX7, up to 240 MHz Wireless Connectivity: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth LE 5.0 Memory Configuration (N16R8): 16 MB Flash memory 8 MB PSRAM Antenna Type: U.FL connector for external antenna (“1U” variant) Indicates support for an external antenna via U.FL connector Allows improved RF performance and flexible antenna placement #commonpartslibrary #rf #wireless #transceiver #module

IC RF TxRx + MCU Bluetooth Bluetooth v5.3 2.4GHz 48-VFQFN Exposed Pad #commonpartslibrary #transceiver #integratedcircuit #arduino-matter