8 (6 + 2) Position Card Connector NANO SIM Surface Mount, Right Angle Gold SIM card holder nano SIM The 2452796-1 is a surface-mount Nano SIM card connector from TE Connectivity designed for 4FF Nano SIM applications in cellular, IoT, GPS, and wireless communication devices. It features a hinged locking mechanism for secure card retention and reliable electrical contact in compact embedded systems. The connector is optimized for PCB mounting and supports high durability for repeated SIM card insertion and removal cycles. Key Features Supports 4FF (Nano SIM) cards Hinge-type SIM holder with locking mechanism 7-position contact configuration Surface-mount (SMT) PCB termination Integrated card detection switch Compact right-angle board-mount design Contact material made from copper alloy with gold plating Durable stainless-steel shell construction Operating temperature range: -40°C to +85°C Rated durability up to 2500 mating cycles Suitable for cellular modems, LTE modules, GPS trackers, and IoT devices UL 94V-0 flammability rated housing #CommonPartsLibrary #Connector #NANO SIM

24 MHz ±20ppm Crystal 18pF 60 Ohms 4-SMD, No Lead The ABM8G-24.000MHZ-18-D2Y-T is a compact 24.000 MHz surface-mount quartz crystal from Abracon's ABM8G series, designed to provide a stable and accurate clock reference for digital electronic systems. Housed in a miniature 3.2 × 2.5 mm, 4-pad SMD package, it is optimized for space-constrained applications while delivering reliable frequency performance over a wide operating temperature range. This crystal is commonly used in microcontrollers, wireless modules, communication equipment, networking devices, industrial electronics, and precision timing circuits. It operates in the fundamental mode with an 18 pF load capacitance, making it suitable for a broad range of oscillator circuits. Key Features 24.000 MHz fundamental-mode quartz crystal Compact 3.2 × 2.5 × 1.0 mm 4-pad SMD package 18 pF load capacitance ±20 ppm frequency tolerance ±30 ppm frequency stability Maximum 60 Ω ESR Wide operating temperature range: −40°C to +85°C Glass-sealed ceramic package for high reliability Compatible with standard IR reflow soldering processes Low-profile design suitable for compact PCB layouts Ideal for embedded systems, communications, wireless devices, and clock generation applications. #Abracon #QuartzCrystal #24MHz #ABM8G #SMDCrystal #TimingDevice #ClockSource #EmbeddedSystems #WirelessElectronics #IndustrialElectronics #PCBDesign #ElectronicsComponents

10 µH Shielded Drum Core, Wirewound Inductor 7.5 A 30mOhm Max Nonstandard # Engineering Specification ## Product Name SRP1038A-100M ## General Description SRP1038A-100M is a shielded surface mount power inductor designed for use in high-efficiency DC-DC conversion and power management applications. The device is intended to support energy storage and current smoothing functions in switching regulator circuits, where stable inductance performance and low power loss are critical. The inductor utilizes a ferrite core construction with a shielded magnetic structure to minimize electromagnetic interference and reduce magnetic flux leakage. This enables improved circuit density and reduced noise coupling in compact electronic assemblies. The design is optimized for use in high current power conversion systems, including buck converters, point-of-load regulators, and distributed power architectures. The component is widely used in industrial, automotive, telecommunications, and embedded systems where reliable energy transfer, thermal stability, and efficient power delivery are required. Its surface mount form factor supports automated PCB assembly and compact system integration while maintaining mechanical robustness under thermal and electrical stress. The design emphasizes low direct current resistance, high current handling capability, and stable inductance behavior under load conditions. It is suitable for applications requiring efficient power conversion with minimal energy loss and stable electromagnetic performance. ## Functional Requirements ### Energy Storage The device shall store energy in a magnetic field during switching operation in power conversion circuits. ### Current Filtering The device shall smooth current ripple in switching regulator applications to maintain stable output conditions. ### Electromagnetic Shielding The device shall reduce electromagnetic interference through a shielded magnetic structure. ### Power Conversion Support The component shall support efficient operation in DC-DC conversion systems. ## Electrical Requirements ### Inductive Performance The device shall provide stable inductance characteristics suitable for power conversion and filtering applications. ### Low Loss Operation The inductor shall minimize resistive and core losses to improve overall system efficiency. ### High Current Capability The device shall support operation under elevated current conditions typical of switching power supplies. ### Thermal Stability The inductor shall maintain performance consistency under thermal loading and temperature variation. ## Mechanical Requirements ### Surface Mount Package The device shall be supplied in a surface mount configuration suitable for automated PCB assembly processes. ### Structural Integrity The component shall withstand mechanical stress during assembly, operation, and thermal cycling. ### PCB Integration The design shall support compact layout integration in multilayer printed circuit board systems. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under conditions typical of industrial and embedded electronic systems. ### Thermal Performance The component shall maintain stable operation under continuous power cycling and heat generation. ### Storage and Handling The device shall retain structural and electrical integrity during storage, transportation, and handling. ## Quality Requirements ### Reliability The inductor shall provide consistent long-term performance under continuous electrical and thermal stress. ### Verification Electrical and thermal characteristics shall be validated through appropriate qualification and testing procedures. ### Compliance The product shall conform to applicable standards for magnetic components used in power electronics applications. ## Documentation Requirements Technical documentation shall include application guidance, layout recommendations for switching power designs, thermal considerations, electrical characteristics, and integration practices for DC-DC converter systems. ## Classification Tags #SRP1038A100M #PowerInductor #ShieldedInductor #SMDInductor #MagneticComponent #EnergyStorageInductor #DCDCConverter #BuckConverter #PowerElectronics #SMPSDesign #ElectromagneticCompatibility #EMIShielding #PCBDesign #ElectricalEngineering #EmbeddedPower #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #PowerManagement #CircuitDesign #HighCurrentInductor

MOSFET N-CH 20V 6.3A SOT-23 The IRLML6244TRPBF is an N-channel enhancement-mode power MOSFET from Infineon Technologies (originally International Rectifier HEXFET series). It is designed for low-voltage power switching applications such as load switching, DC-DC converters, and LED control. It comes in a compact SOT-23 (Micro3™) surface-mount package, making it suitable for space-constrained PCB designs while still handling relatively high current for its size. Key Features Drain-Source Voltage (VDS): 20 V Continuous Drain Current: up to ~6.3 A (at 25°C) Very low RDS(on): ~21 mΩ @ VGS = 4.5 V ~27 mΩ @ VGS = 2.5 V Low gate threshold voltage (~0.5–1.1 V typical range) (note: not a switching guarantee) Gate-to-source voltage rating: ±12 V Low power loss due to low on-resistance High efficiency switching for low-voltage systems Power dissipation: ~1.3 W (thermal limited in SOT-23 package) Fast switching performance (low gate charge ~8.9 nC) Operating temperature range: −55°C to +150°C RoHS compliant (lead-free, halogen-free) Typical Applications Low-side load switching (MCUs, GPIO control) LED strip / RGB LED drivers Battery-powered systems DC-DC converter switching Small motor or relay driving General-purpose power management in compact electronics Important Design Note Even though it has a low VGS(th), this MOSFET is not selected based on threshold voltage. What matters is the RDS(on) at your gate drive voltage (2.5 V / 3.3 V / 5 V) to ensure it fully turns on with minimal heating. #CommonPartsLibrary #Transistor #FET #IRLML6244 #MOSFET #NChannelMOSFET #PowerElectronics #SOT23 #Infineon #HEXFET #LEDDriver #LowSideSwitch #ElectronicsComponents

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector

Cellular, Navigation BeiDou, EGDE, Galileo, GLONASS, GPS, GNSS, GSM, LTE Transceiver Module 850MHz, 900MHz, 1.8GHz, 1.9GHz Antenna Not Included Surface Mount The BG95M3LA-64-SGNS is a compact low-power LTE cellular communication module designed for IoT, telematics, asset tracking, industrial automation, and embedded wireless applications. The module supports global LTE Cat M1, Cat NB2, and EGPRS connectivity, enabling reliable wide-area wireless communication for battery-powered and mobile embedded systems. The device integrates cellular modem functionality, GNSS positioning capability, power management features, and multiple peripheral communication interfaces within a highly compact surface-mount package optimized for space-constrained embedded designs. The module is engineered for low-power operation, making it suitable for long-life IoT deployments requiring efficient wireless connectivity. The BG95M3LA-64-SGNS supports integrated satellite positioning technologies including GPS, GLONASS, Galileo, and BeiDou for location-aware applications. Its robust RF performance and industrial-grade operating capability allow deployment in harsh environmental conditions and demanding remote monitoring systems. The module provides comprehensive support for embedded communication protocols and is commonly used in smart meters, telematics units, industrial gateways, environmental monitoring systems, fleet tracking devices, and connected sensor platforms. Key Features LTE Cat M1 cellular communication support LTE Cat NB2 narrowband IoT capability EGPRS fallback connectivity Integrated GNSS positioning functionality Low-power optimized architecture Global wireless network compatibility Compact surface-mount module design Embedded TCP/IP protocol stack support UART, USB, and serial communication interfaces Integrated power management subsystem Industrial operating temperature support Embedded IoT connectivity optimization High-reliability wireless communication platform Multi-constellation satellite navigation support Electrical Characteristics Low operating power consumption Wide input voltage support High RF sensitivity performance Embedded low-power sleep functionality Stable wireless communication architecture Integrated RF and baseband processing Optimized antenna interface support Industrial-grade reliability performance Fast network registration capability Applications IoT and M2M communication systems Asset tracking devices Fleet management platforms Smart utility metering Industrial automation equipment Remote environmental monitoring Smart agriculture systems Telematics and transportation electronics Portable wireless data terminals Embedded gateway systems Smart city infrastructure Connected sensor platforms Package Information Package Type: LGA Module Mounting Type: Surface Mount Compact embedded wireless module package RoHS compliant configuration available #commonpartslibrary #wirelessmodule #lte #iot #embeddedhardware #cellularcommunication #gnss #telematics #industrialautomation #assettracking

Red, Green, Blue (RGB) 624nm Red, 525nm Green, 470nm Blue LED Indication - Discrete 2V Red, 3.3V Green, 3.3V Blue 4-SMD, No Lead # 150080M153000 ## General Description The 150080M153000 is a compact surface-mount full-color RGB LED manufactured by Würth Elektronik as part of the WL-SFCD series. The device integrates red, green, and blue light-emitting elements within a single package, enabling the generation of a wide spectrum of colors for status indication, user interfaces, backlighting, visual notifications, and decorative lighting applications. Its diffused lens design provides uniform light distribution and wide viewing visibility, making it suitable for industrial equipment, consumer electronics, communication devices, instrumentation systems, control panels, and embedded electronic products. The component is optimized for automated assembly processes and offers reliable optical performance, low power consumption, and long operational life. ## Key Features ### Optical Characteristics * Full-color RGB light output * Integrated red, green, and blue emitters * Diffused lens design for uniform illumination * Wide viewing angle * High-visibility indication capability * Consistent color performance ### Electrical Characteristics * Low-power operation * Stable optical output * Suitable for indicator and backlighting applications * Reliable performance across operating conditions * Optimized for embedded electronic systems ### Mechanical Characteristics * Surface-mount package construction * Compact footprint * Low-profile package design * Compatible with automated assembly processes * Reflow-soldering compatible ### Package Construction * Common-anode configuration * Integrated multi-die LED architecture * Rectangular lens geometry * Lead-free package design * Industrial-grade construction ### Material Characteristics * High-quality encapsulation materials * Diffused optical lens * RoHS-compliant construction * Environmentally compliant materials ### Environmental Characteristics * Suitable for commercial and industrial applications * Long operational service life * Reliable operation under standard environmental conditions * Resistant to normal assembly and handling processes ### Application Areas * Status Indicators * User Interface Displays * Industrial Control Panels * Consumer Electronics * Home Appliances * Telecommunications Equipment * Instrumentation Systems * Backlighting Applications * Smart Devices * Embedded Electronic Products * Safety and Security Equipment * Human-Machine Interface Systems ### Compliance * RoHS Compliant * REACH Compliant * Lead-Free Compatible * Industry-Standard Surface-Mount Technology ## Manufacturer Würth Elektronik ## Product Family WL-SFCD SMD Full-Color Chip LED Series #150080M153000 #WurthElektronik #RGBLED #SMDLED #WLSFCD #FullColorLED #LEDIndicator #Backlighting #Optoelectronics #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #PCBDesign #ElectronicsEngineering #SMTAssembly #commonpartslibrary #optoelectronic #ledindication

2 Position Wire to Board Terminal Block Horizontal with Board 0.150" (3.81mm) Through Hole ## Engineering Specification ## General Description The **1727010** is a Phoenix Contact **MKDS series PCB terminal block** designed for secure wire-to-board electrical connection in printed circuit board assemblies. It provides a compact screw-clamp termination interface for connecting external conductors to PCB circuitry. The component is suitable for industrial electronics, automation equipment, control modules, power interfaces, instrumentation, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1727010** Manufacturer: **Phoenix Contact** Product Name: **MKDS 1/ 2-3,81** Product Series: **MKDS** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed PCB terminal block that allows external wires to connect directly to the printed circuit board. The screw-clamp mechanism provides both mechanical conductor retention and electrical continuity between the field wiring and PCB circuit. This makes the component suitable for applications where wiring must be secure, serviceable, and accessible during installation or maintenance. ## Mechanical Description The terminal block uses a compact housing with side-entry conductor access and through-hole solder pins for stable PCB attachment. Its construction supports organized wire routing and practical access for conductor insertion and screw tightening. The design is suitable for compact board layouts where reliable field wiring connection is required. ## Electrical Description The component is intended for signal and low-voltage power connection applications within the manufacturer’s specified electrical ratings. It provides stable electrical contact when used with compatible conductor sizes, correct wire preparation, and proper screw tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements that transfer current from the inserted conductor to the soldered PCB pins. The screw connection with tension sleeve helps maintain reliable contact pressure and secure conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1727010** is intended for through-hole solder mounting on a printed circuit board. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidance. The component should be positioned to allow safe wire insertion, screwdriver access, and adequate clearance from nearby components or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, power supply interfaces, relay boards, instrumentation equipment, sensor wiring interfaces, building control systems, communication hardware, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current requirement, voltage rating, tightening torque, creepage and clearance spacing, solder joint strength, wire routing, and service access. The terminal block should not be used beyond the manufacturer’s specified electrical, mechanical, or environmental limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkds #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

Board Mount Humidity Sensors Intermediate Humidity and Temperature Sensor Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41-AD1B-R2 is a fully calibrated, low-power environmental sensor that measures relative humidity (RH) and temperature. It integrates sensing elements, signal processing, and a digital interface into a small surface-mount package, making it ideal for space-constrained designs. Key Features Sensor Type: Digital humidity and temperature sensor Interface: I²C (easy MCU integration) Supply Voltage: ~1.08 V to 3.6 V Humidity Accuracy: up to ±1.8% RH (typical) Temperature Accuracy: up to ±0.2 °C (typical) Response Time: Fast measurement and low latency Power Consumption: Ultra-low, suitable for battery devices Package: DFN (compact, ~1.5 × 1.5 mm) Factory Calibration: No external calibration required Functional Overview The sensor uses capacitive humidity sensing combined with a bandgap temperature sensor. Internal electronics convert these measurements into digital data via I²C, eliminating the need for external ADCs or complex signal conditioning. Design Advantages Small footprint for compact PCBs Low power consumption for IoT and portable devices High reliability with long-term stability Fast response time for real-time monitoring Simple integration with microcontrollers Typical Applications IoT and smart home devices HVAC and climate control systems Wearables and portable electronics Industrial monitoring systems Environmental data logging #CommonPartsLibrary #Sensors,-Transducer #Humidity #Moisture-Sensor #SHT4x