RF Modules E01-2G4M27SX WIRELM-SMD_E01-2G4M27SX LCSC Part Number: C2971733 JLCPCB Part Class: Extended Part Manufactured by EBYTE(亿佰特) EBYTE E01-2G4M27SX 2.4GHz SMD RF transceiver module based on Nordic nRF24L01P, integrated PA and LNA, up to 500mW transmit power, SPI interface with 0 to 10Mbps data rate, supports 2Mbps/1Mbps/250kbps air data rates, 125 communication channels, 2.3V to 3.6V supply voltage, industrial 16MHz crystal, IPEX antenna connector, enhanced ShockBurst compatible with nRF24L01/nRF24L01P/nRF24 series, compact 18 x 14.5mm module for long-range wireless communication. Search Keywords: E01-2G4M27SX, EBYTE E01-2G4M27SX, E01 2G4M27SX, E01-2G4M27SX RF module, E01-2G4M27SX nRF24L01P, EBYTE 2.4GHz RF module, nRF24L01P PA LNA module, 500mW 2.4GHz RF transceiver module, SPI RF transceiver module, 2.4GHz SMD wireless module, IPEX antenna RF module, long range nRF24L01P module, EBYTE nRF24 module, E01-2G4M27SX datasheet Hashtags: #E012G4M27SX #EBYTEE012G4M27SX #EBYTE #nRF24L01P #nRF24Module #RFTransceiverModule #24GHzRFModule #24GHzWirelessModule #SMDWirelessModule #500mWRFModule #PALNAModule #SPIRFModule #IPEXAntenna #EnhancedShockBurst #NordicnRF24 #LongRangeWirelessModule

20A 9V 300W 7V Bidirectional 5V SOD-323 ESD and Surge Protection (TVS/ESD) ROHS ESD DIODE 5VWM 7VC 9VC SOD-323 300W peak pulse power (8/20µs) * Protects one data or power line PESD5V0S1BA 1-Line BI-directional TVS Diode www.sot23.com.tw Mechanical Characteristics Package: SOD-323 Lead Finish: Matte Tin Case Material: "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 3 per J-STD-020 Terminal Connections: See Diagram Below * Ultra low leakage: nA level * Operating voltage: 5V * Ultra low clamping voltage * Complies with following standards: - IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge: +30kV - IEC61000-4-4 (Lightning) 20A (8/20ns) #CommonPartsLibrary #Diode

The B0505S-1WR3 is a compact isolated DC-DC power converter module designed to provide regulated power conversion while maintaining galvanic isolation between input and output circuits. The module incorporates high-frequency switching technology and transformer isolation to deliver stable power with reduced noise coupling and improved system safety. It is widely used in industrial control systems, communication equipment, instrumentation, data acquisition devices, medical electronics, and embedded applications where isolated power rails are required to eliminate ground loops and enhance signal integrity. Engineering Specification Device Type Isolated DC-DC Converter Module Power Conversion Topology Transformer-Isolated Switching Regulator Input Configuration Single DC Input Output Configuration Single Isolated DC Output Isolation Method Internal High-Frequency Transformer Isolation Regulation Characteristics Regulated Output Voltage High Conversion Efficiency Low Output Ripple and Noise Electrical Features Galvanic Isolation Between Input and Output Enhanced Noise Immunity Stable Load Regulation Reliable Power Transfer Performance Protection Characteristics Short-Circuit Resistant Design Input-to-Output Isolation Protection Thermal Reliability Enhancement Package Style Single In-Line Through-Hole Package Mounting Type Through-Hole Mounting Environmental Characteristics Industrial-Grade Reliability Long Operational Lifetime High Resistance to Electrical Interference Suitable for Harsh Operating Environments Applications Industrial Automation Equipment Data Acquisition Systems Sensor Signal Conditioning Communication Interfaces Medical Electronics Embedded Control Systems Power Supply Isolation Instrumentation Equipment Process Control Devices Microcontroller-Based Systems Features Compact Integrated Module Isolated Power Distribution High Reliability Design Low Electromagnetic Interference Simple Circuit Integration Efficient Power Conversion Stable Output Performance Wide Application Compatibility RoHS Compliant Construction Manufacturer MORNSUN #commonpartslibrary #powermodule #dcdcconverter #isolatedpower #galvanicisolation #powermanagement #powersupply #powerelectronics #industrialelectronics #instrumentation #communications #embeddedsystems #medicalelectronics #throughhole #electroniccomponents

Magnetic Sensors QMC5883L LGA-16_L3.0-W3.0-P0.50-BL_SQ The QMC5883L is a multi-chip three-axis magnetic sensor. This surface -mount, small sized chip has integrated magnetic sensors with signal condition ASIC, targeted for high precision applications such as compassing, navigation and gaming in drone, robot, mobile and personal hand-held devices. The QMC5883L is based on our state-of-the-art, high resolution, magneto-resistive technology licensed from Honeywell AMR technology. Along with custom-designed 16-bit ADC ASIC, it offers the advantages of low noise, high accuracy, low power consumption, offset cancellation and temperature compensation. QMC5883L enables 1° to 2° compass heading accuracy. The I²C serial bus allows for easy interface. The QMC5883L is in a 3x3x0.9mm3 surface mount 16-pin land grid array (LGA) package.  3-Axis Magneto-Resistive Sensors in a 3x3x0.9 mm3 Land Grid Array Package (LGA), guaranteed to operate over an extended temperature range of -40 °C to +85 °C.  Small Size for Highly Integrated Products. Signals Have Been Digitized And Calibrated.  16 Bit ADC With Low Noise AMR Sensors Achieves 2 Milli-Gauss Field Resolution  Enables 1° To 2° Degree Compass Heading Accuracy , Allows for Navigation and LBS Applications  Wide Magnetic Field Range (±8 Gauss)  Maximizes Sensor’s Full Dynamic Range and Resolution  Temperature Compensated Data Output and Temperature Output  Automatically Maintains Sensor’s Sensitivity Under Wide Operating Temperature Range  I 2C Interface with Standard and Fast Modes.  High-Speed Interfaces for Fast Data Communications. Maximum 200Hz Data Output Rate  Wide Range Operation Voltage (2.16V To 3.6V) and Low Power Consumption (75A)  Compatible with Battery Powered Applications  Lead Free Package Construction  RoHS Compliance  Software And Algorithm Support Available  Compassing Heading, Hard Iron, Soft Iron, and Auto Calibration Libraries Available #CommonPartsLibrary #Sensor

The SIM800L is a compact quad-band GSM/GPRS cellular communication module designed for embedded wireless applications requiring voice, SMS, and packet data connectivity. It integrates a complete GSM/GPRS protocol stack and supports communication over standard cellular networks, enabling reliable remote monitoring, control, telemetry, asset tracking, and Internet of Things deployments. The module features low power consumption, a compact surface-mount package, and a UART-based AT command interface for straightforward integration with microcontrollers, processors, and embedded systems. It supports voice calls, SMS messaging, GPRS data transmission, and network services while providing flexible interfacing options for audio and peripheral connectivity. Designed for industrial and consumer electronic applications, the SIM800L delivers dependable wireless communication performance in compact and power-sensitive designs. Its broad network compatibility and extensive software support make it a widely adopted solution for GSM-based connected devices. Features Quad-band GSM/GPRS cellular connectivity Voice call functionality with integrated audio interface SMS text messaging support GPRS packet data communication capability Standard AT command interface UART serial communication interface Low-power operating modes Compact surface-mount package Embedded TCP/IP protocol support Real-time clock functionality DTMF detection and generation Caller identification support SIM card interface integration Antenna interface for cellular communication Wide operating temperature capability Suitable for battery-powered applications Applications Internet of Things devices Remote monitoring systems Wireless telemetry equipment Smart metering solutions Asset tracking systems Vehicle tracking devices Industrial automation equipment Security and alarm systems Wireless data loggers Remote control applications Point-of-sale terminals Embedded communication systems Electrical Characteristics GSM/GPRS cellular network operation Low-voltage power supply architecture Serial UART host interface Integrated RF transceiver SIM card support interface Audio input and output connectivity Low standby power consumption Hardware and software power management support Mechanical Characteristics Compact SMT module package PCB-mountable design Integrated RF connection interface Embedded system integration optimized Lightweight construction Compliance and Reliability GSM standard compliant GPRS standard compliant Industrial embedded communication suitable Designed for long-term operational reliability Compatible with standard cellular infrastructure #commonpartslibrary #wirelesscommunication #gsmmodule #gprs #sim800l #cellularmodule #iot #embeddedsystems #telemetry #wirelessconnectivity #industrialelectronics #communicationmodule #remotecontrol #trackingdevice #machinetomachine #smtmodule

FLASH - NOR Memory IC 16Mbit SPI - Quad I/O 133 MHz 8-SOIC Serial NOR Flash Memory that provides non-volatile data storage using a SPI interface. The W25Q16JVSSIQ features 16-Mbit memory density, operates from a 2.7V to 3.6V supply voltage, supports standard SPI, Dual SPI, and Quad SPI interfaces, and provides clock frequencies up to 133 MHz in a 8-pin SOIC package. #FlashMemory #SPIFlash #NORFlash #NonVolatileMemory #Winbond #W25Q16JVSSIQ

RF Demodulator IC 20MHz ~ 300MHz 32-VFQFN Exposed Pad The CMX973Q5 specification defines the engineering requirements for a radio frequency quadrature modulator integrated circuit designed for digital and analog wireless communication systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure accurate signal modulation, high RF performance, and long-term operational reliability. The device is intended for use in wireless communication equipment, telemetry systems, software-defined radio platforms, digital data transmission equipment, industrial RF systems, and embedded communication applications requiring high-performance I/Q modulation. It provides precise conversion of baseband in-phase and quadrature signals into modulated RF output while maintaining excellent signal integrity, low distortion, and stable operation over a wide range of operating conditions. Engineering Requirements The RF modulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical characteristics, reliable modulation accuracy, and dependable long-term performance. The device shall maintain stable operation under specified supply voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate in-phase and quadrature signal processing, low phase imbalance, high linearity, low noise, and excellent carrier suppression. The device shall maintain stable RF output characteristics and predictable modulation performance throughout continuous operation while minimizing harmonic distortion and unwanted spurious emissions. The integrated RF architecture shall support efficient signal conversion and reliable interface with external oscillators, filters, and communication circuitry. The device shall preserve signal integrity across the specified operating frequency range while supporting high-quality modulation for digital and analog communication protocols. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, modulation characteristics, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFModulator #QuadratureModulator #WirelessCommunication #RFIC #SignalModulation #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation

BNO085 - Accelerometer, Gyroscope, Magnetometer, 3 Axis Sensor Evaluation Board The BNO085 Evaluation Board is a development platform designed to evaluate and prototype applications using the BNO085 9-axis Inertial Measurement Unit (IMU). It integrates a 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer with an onboard ARM Cortex-M0+ processor running advanced sensor fusion algorithms. The board provides accurate real-time orientation, motion tracking, rotation vectors, and heading information while offloading complex sensor fusion calculations from the host microcontroller. It is widely used in robotics, AR/VR systems, drones, motion tracking devices, navigation systems, and IoT applications. The evaluation board typically supports I²C, SPI, and UART communication interfaces, enabling easy integration with various embedded platforms. Key Features 9-DOF motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in ARM Cortex-M0+ processor for onboard sensor fusion Real-time orientation output including quaternions, Euler angles, and rotation vectors Supports I²C, SPI, and UART communication interfaces High-speed motion tracking with low latency operation Dynamic calibration for improved accuracy and stability Integrated motion detection features such as step counting and activity tracking Configurable sensor data rates and timestamped sensor reports Low-power operation suitable for battery-powered applications Ideal for robotics, VR/AR, wearable devices, navigation, and industrial motion sensing #BNO085 #IMU #9DOF #SensorFusion #MotionTracking #OrientationSensor #Robotics #EmbeddedSystems #IoT #WearableTech #ARVR #Navigation #EvaluationBoard #Accelerometer #Gyroscope #Magnetometer #commonpartslibrary #developmentboard #accelerometer