MCP3913 Series 3.6 V 4.5 mA SMT Six-Channel Analog Front End - SSOP-28 The MCP3913A1T-E/SS is a high-performance, multi-channel analog front-end (AFE) from Microchip Technology intended for precision measurement applications. It features six simultaneous sampling 24-bit delta-sigma ADCs with integrated programmable gain amplifiers, enabling accurate acquisition of low-level analog signals. Designed for energy monitoring and industrial sensing, the device provides low noise, high dynamic range, and flexible configuration. It supports SPI communication for efficient interfacing with microcontrollers and digital processing systems. Key Features Six simultaneous sampling 24-bit delta-sigma ADC channels Integrated programmable gain amplifiers per channel High signal-to-noise ratio and low distortion Programmable oversampling ratios for performance tuning Internal voltage reference with external reference option SPI-compatible digital interface Configurable data output formats and control registers Low power operation modes Electrical Characteristics Resolution: 24-bit Number of Channels: 6 Input Configuration: Differential Supply Voltage: 2.7V to 3.6V Operating Temperature Range: -40°C to +125°C Programmable Gain: Up to 32 V/V (typical) Reference Voltage: Internal or external selectable Functional Description The device integrates six high-resolution delta-sigma ADCs that sample input signals simultaneously, ensuring accurate phase and timing relationships across channels. Each input passes through a programmable gain stage, allowing optimization for different sensor levels. Analog signals are digitized using oversampling and digital filtering techniques to achieve high precision and noise reduction. Configuration is handled via internal registers, and data is transferred through an SPI interface. Package Information Package Type: SSOP Pin Count: 28 Mounting Type: Surface Mount Applications Energy metering Power monitoring systems Industrial automation Multi-channel data acquisition Sensor interfacing Smart grid systems Advantages High integration reduces external components Simultaneous sampling improves measurement accuracy High resolution supports precise signal analysis Flexible configuration for various system requirements #commonpartslibrary #integratedcircuit #powermanagement #energymetering

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-DFN (1.5x1.5) STS40-CD1B-R3 is a high-accuracy digital temperature sensor from Sensirion, designed for precise temperature monitoring in space-constrained and low-power applications. Part of the STS4x series, it features a fully calibrated temperature sensing element with an I²C digital interface, providing reliable measurements over a wide operating temperature range. Its ultra-compact 4-DFN package makes it ideal for IoT devices, wearables, consumer electronics, industrial controls, and battery-powered systems. Key Features High-accuracy temperature measurement (±0.2°C typical at 25°C) Wide operating temperature range: -40°C to +125°C Digital I²C interface for easy MCU integration 16-bit temperature resolution Low operating voltage: 1.08 V to 3.6 V Factory calibrated and linearized output Ultra-small 1.5 mm × 1.5 mm DFN package Low power consumption suitable for battery-powered devices Surface-mount package for automated assembly Robust performance for industrial and consumer applications #STS40 #STS40CD1BR3 #Sensirion #TemperatureSensor #DigitalSensor #I2C #EmbeddedSystems #IoT #IndustrialAutomation #WearableElectronics #EnvironmentalMonitoring #ElectronicsDesign

Temp Monitoring System (Sensor) -55°C ~ 125°C Internal Sensor I2C Output 8-TDFN (3x3) #commonpartslibrary #integratedcircuit #powermanagement #thermometer

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-PICOSTAR (0.76x0.76) The TMP114NCIYMTR is a high-accuracy digital temperature sensor designed for precision thermal monitoring applications in industrial, automotive, medical, and embedded electronic systems. The device integrates a precision band-gap temperature sensing element, analog-to-digital conversion circuitry, EEPROM memory, and a digital communication interface within a compact low-power package. The sensor supports accurate local temperature measurements with factory calibration and programmable alert functionality, enabling reliable thermal protection and environmental monitoring in space-constrained designs. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: TMP114NCIYMTR Device Type: Digital Temperature Sensor Temperature Measurement Method: Local Semiconductor Temperature Sensing Interface Type: I²C-Compatible Serial Interface Supply Voltage Range: Ultra-Low Voltage Operation Compatible with Battery-Powered Systems Temperature Measurement Range: Industrial Temperature Range Support Accuracy: High-Precision Factory-Calibrated Temperature Measurement Resolution: High-Resolution Digital Temperature Output Conversion Architecture: Integrated Sigma-Delta Analog-to-Digital Conversion Programmable Features: High and low temperature alert thresholds EEPROM-stored configuration settings Programmable conversion rate Offset correction calibration Alert and interrupt functionality Power Consumption: Optimized for Low-Power Embedded Applications Communication Speed: Standard and Fast-Mode I²C Support Package Type: Small Outline Leadless Package Mounting Type: Surface Mount Technology Operating Environment: Suitable for Industrial and Embedded Control Systems Protection Features: Integrated thermal monitoring alerts Nonvolatile configuration retention Robust digital communication interface Applications: Industrial temperature monitoring Medical instrumentation Battery-powered electronics Thermal management systems Precision embedded sensing Data acquisition equipment Environmental monitoring devices #commonpartslibrary #integratedcircuit #temperaturesensor #digital