10µH Shielded Molded Inductor 1.5 A 243mOhm Max 2-SMD #commonpartslibrary #inductor #coil #WE-LHMI

4.7µH Shielded Inductor 11 A 24mOhm Max Nonstandard #CommonPartsLibrary #Fixed-Inductor #SRP7050AA

1.5µH Shielded Drum Core, Wirewound Inductor 1.9 A 137mOhm Max 0806 (2016 Metric) The Bourns SRP2010-1R5M is a 1.5 µH wirewound drum-core power inductor designed for high-current, low-loss power conversion applications such as buck/boost converters in compact electronics like smartphones, tablets, SSDs, and embedded systems. It uses a metal powder (iron powder) core with magnetic shielding, which helps reduce EMI (electromagnetic interference) and improves efficiency in high-frequency switching circuits. Key Features Inductance: 1.5 µH Tolerance: ±20% Current Rating (Irms): ~1.9 A Saturation Current (Isat): ~2.5 A Low DCR: ~137 mΩ max Shielded construction (reduces magnetic radiation) Wirewound drum core design Surface-mount package (0806 / 2016 metric) Operating temperature: -40°C to +125°C RoHS compliant Typical Applications DC-DC converters (buck / boost regulators) Power management circuits in mobile devices Laptops, tablets, smartphones SSD/HDD power filtering Embedded systems and IoT devices #CommonPartsLibrary #Inductor #Coil #Choke #Fixed-Inductor #SRP2010

1µH Shielded Molded Inductor 7.4 A 13.5mOhm Max 1616 (4040 Metric) #CommonPartsLibrary #Inductor #FixedInductor #WE-MAPI

10 µH Shielded Drum Core, Wirewound Inductor 7.5 A 30mOhm Max Nonstandard # Engineering Specification ## Product Name SRP1038A-100M ## General Description SRP1038A-100M is a shielded surface mount power inductor designed for use in high-efficiency DC-DC conversion and power management applications. The device is intended to support energy storage and current smoothing functions in switching regulator circuits, where stable inductance performance and low power loss are critical. The inductor utilizes a ferrite core construction with a shielded magnetic structure to minimize electromagnetic interference and reduce magnetic flux leakage. This enables improved circuit density and reduced noise coupling in compact electronic assemblies. The design is optimized for use in high current power conversion systems, including buck converters, point-of-load regulators, and distributed power architectures. The component is widely used in industrial, automotive, telecommunications, and embedded systems where reliable energy transfer, thermal stability, and efficient power delivery are required. Its surface mount form factor supports automated PCB assembly and compact system integration while maintaining mechanical robustness under thermal and electrical stress. The design emphasizes low direct current resistance, high current handling capability, and stable inductance behavior under load conditions. It is suitable for applications requiring efficient power conversion with minimal energy loss and stable electromagnetic performance. ## Functional Requirements ### Energy Storage The device shall store energy in a magnetic field during switching operation in power conversion circuits. ### Current Filtering The device shall smooth current ripple in switching regulator applications to maintain stable output conditions. ### Electromagnetic Shielding The device shall reduce electromagnetic interference through a shielded magnetic structure. ### Power Conversion Support The component shall support efficient operation in DC-DC conversion systems. ## Electrical Requirements ### Inductive Performance The device shall provide stable inductance characteristics suitable for power conversion and filtering applications. ### Low Loss Operation The inductor shall minimize resistive and core losses to improve overall system efficiency. ### High Current Capability The device shall support operation under elevated current conditions typical of switching power supplies. ### Thermal Stability The inductor shall maintain performance consistency under thermal loading and temperature variation. ## Mechanical Requirements ### Surface Mount Package The device shall be supplied in a surface mount configuration suitable for automated PCB assembly processes. ### Structural Integrity The component shall withstand mechanical stress during assembly, operation, and thermal cycling. ### PCB Integration The design shall support compact layout integration in multilayer printed circuit board systems. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under conditions typical of industrial and embedded electronic systems. ### Thermal Performance The component shall maintain stable operation under continuous power cycling and heat generation. ### Storage and Handling The device shall retain structural and electrical integrity during storage, transportation, and handling. ## Quality Requirements ### Reliability The inductor shall provide consistent long-term performance under continuous electrical and thermal stress. ### Verification Electrical and thermal characteristics shall be validated through appropriate qualification and testing procedures. ### Compliance The product shall conform to applicable standards for magnetic components used in power electronics applications. ## Documentation Requirements Technical documentation shall include application guidance, layout recommendations for switching power designs, thermal considerations, electrical characteristics, and integration practices for DC-DC converter systems. ## Classification Tags #SRP1038A100M #PowerInductor #ShieldedInductor #SMDInductor #MagneticComponent #EnergyStorageInductor #DCDCConverter #BuckConverter #PowerElectronics #SMPSDesign #ElectromagneticCompatibility #EMIShielding #PCBDesign #ElectricalEngineering #EmbeddedPower #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #PowerManagement #CircuitDesign #HighCurrentInductor

600 Ohms @ 100 MHz 1 Ferrite Bead 0603 (1608 Metric) ferrite bead 600 ohm 0603 ferrite bead 600 ohm 100MHz 0603 ferrite bead 0603 600ohm The BLM18AG601SN1D is a surface-mount ferrite bead designed for suppression of high-frequency noise in electronic circuits. It provides high impedance at high frequencies while maintaining low DC resistance, making it suitable for power lines and signal line filtering. This component is commonly used in portable electronics, communication devices, and general digital circuits to improve EMI performance. ELECTRICAL CHARACTERISTICS Impedance: 600 Ω ±25% @ 100 MHz Rated Current: 500 mA (max) DC Resistance (DCR): 0.5 Ω (typ), 0.8 Ω (max) Insulation Resistance: 10 MΩ min PHYSICAL CHARACTERISTICS Package Size: 0603 (1608 Metric) Length: 1.6 mm Width: 0.8 mm Height: 0.8 mm (typ) Mounting Type: Surface Mount (SMD) ENVIRONMENTAL & OPERATING CONDITIONS Operating Temperature Range: -55°C to +125°C Storage Temperature Range: -55°C to +125°C APPLICATIONS Power supply line noise suppression Signal line EMI filtering Mobile devices and handheld electronics Computers and peripherals Consumer electronics FEATURES High impedance at high frequencies for effective noise suppression Low DC resistance minimizes signal/power loss Compact 0603 package suitable for high-density PCB layouts Reliable multilayer construction Lead-free and RoHS compliant PACKAGING Packaging Type: Tape and Reel Standard Reel Quantity: Typically 4000 pcs/reel #CommonPartLibrary #Filter #FerriteBead

Bipolar (BJT) Transistor NPN 40V 200 mA 300MHz 625 mW Through Hole TO-92-3 The 2N3904TFR is a general-purpose NPN bipolar junction transistor (BJT) designed for low-power amplification and switching applications. It is widely used in signal processing, small-signal amplification, and digital switching circuits. This transistor offers fast switching speed, low saturation voltage, and reliable performance in a compact surface-mount package, making it suitable for consumer electronics, industrial controls, and embedded systems. Manufacturer Various (commonly ON Semiconductor / onsemi, Diodes Inc., Central Semiconductor) Part Number 2N3904TFR Transistor Type NPN Bipolar Junction Transistor (BJT) Configuration Single Package / Case SOT-23 (TO-236AB) Mounting Style Surface Mount (SMD/SMT) Collector-Emitter Voltage (VCEO) 40 V Collector-Base Voltage (VCBO) 60 V Emitter-Base Voltage (VEBO) 6 V Collector Current (IC) 200 mA (max) Power Dissipation (PD) ~200 mW to 350 mW (package dependent) DC Current Gain (hFE) 100 to 300 (typical, varies with operating conditions) Transition Frequency (fT) ~300 MHz Collector-Emitter Saturation Voltage (VCE(sat)) ~0.2 V (typical at IC = 10 mA, IB = 1 mA) Operating Temperature Range -55°C to +150°C Polarity NPN Packaging Tape & Reel (TFR suffix) RoHS Compliance Compliant #commonpartslibrary #transistor #bjt

1µH Shielded Drum Core, Wirewound Inductor 2.13 A 72mOhm Max 0806 (2016 Metric) #commonpartslibrary #inductor #coil #fixedinductor

6.8 µH Shielded Inductor 4.9 A 23mOhm Max Nonstandard #commonpartslibrary #inductor

15 µH Shielded Drum Core, Wirewound Inductor 3.5 A 92mOhm Max Nonstandard The SRP7050TA-150M is a high-performance photovoltaic module designed for utility-scale and large commercial solar power applications. The module utilizes advanced monocrystalline cell technology to deliver high energy conversion efficiency, reliable power generation, and long-term operational stability under varying environmental conditions. Its robust mechanical construction and optimized electrical characteristics provide dependable performance in demanding outdoor installations, including regions exposed to high wind loads, elevated temperatures, and extended solar irradiance. The module is engineered to support high system voltage configurations while maintaining low degradation rates and enhanced energy yield over its service life. The design incorporates reinforced framing, tempered high-transmission glass, and weather-resistant encapsulation materials to ensure durability against moisture ingress, ultraviolet exposure, and mechanical stress. The product is suitable for fixed-tilt and tracker-based mounting systems and is compatible with standard industry installation practices. Electrical performance is optimized for maximum power output with improved temperature behavior and reduced resistive losses. The module supports efficient integration into modern photovoltaic systems requiring high-density energy production and reliable long-term operation. Safety and quality compliance are aligned with internationally recognized photovoltaic module standards for performance, durability, and environmental resilience. The SRP7050TA-150M is intended for grid-connected solar energy systems where high efficiency, operational reliability, and reduced balance-of-system costs are critical project requirements. #commonpartslibrary #inductor