Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

IC RF TxRx Only Bluetooth, WiFi Bluetooth v5.0, Thread, Zigbee® 2.412GHz ~ 2.484GHz 32-VFQFN Exposed Pad The ESP32-C6FH4 is a low-power, highly integrated wireless microcontroller from Espressif Systems, designed for IoT applications. It is based on a 32-bit RISC-V processor running at up to 160 MHz, providing efficient performance for embedded systems while maintaining low power consumption. This variant includes 4 MB of embedded flash memory, making it suitable for standalone applications without the need for external flash. The ESP32-C6FH4 supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band (backward compatible with Wi-Fi 4/802.11 b/g/n) Bluetooth Low Energy (BLE 5) IEEE 802.15.4 (used for protocols like Thread and Zigbee) Key features include: Rich set of GPIO pins with support for peripherals such as UART, SPI, I2C, PWM, ADC, and more Integrated hardware security features (secure boot, flash encryption, cryptographic accelerators) Multiple low-power modes for battery-operated devices On-chip temperature sensor and RTC peripherals #commonpartslibrary #transceiver

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C3-WROOM-02-N4 is a compact, general-purpose Wi-Fi and Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-C3 SoC and integrates RF components, crystal oscillator, flash memory, and PCB antenna in a single module. It is designed for a wide range of applications such as IoT devices, smart home systems, industrial automation, and consumer electronics, offering a balance of performance, low power consumption, and cost efficiency. Key Features MCU & Memory 32-bit RISC-V single-core processor up to 160 MHz 384 KB ROM 400 KB SRAM + 8 KB RTC SRAM Integrated 4 MB SPI flash (N4 variant) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Supports Station, SoftAP, and Station + SoftAP modes Bluetooth 5 (BLE) with mesh support Data rates up to 150 Mbps (Wi-Fi) Peripherals & Interfaces Up to 15 GPIOs Interfaces: SPI, UART, I2C, I2S LED PWM ADC (SAR) Timers & watchdog USB Serial/JTAG support TWAI® (CAN 2.0 compatible) #commonpartslibrary #transceiver #module #wireless #rf

Kinetis KW41Z-2.4 GHz, Arm Cortex-M0+, 256kB Flash, 64kB SRAM, generic FSK, LQFN-48 #microcontrollers #Kinetis #commonpartslibrary

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

SMA Connector, Jack, 50 ohm, Threaded, 12.4 GHz, 1 Position, Printed Circuit Board, Board Mount, -65 165 C [-85 329 F], Solder, Straight, Brass #CommonPartsLibrary #Connector #SMA

Multiprotocol Modules ESP32-C61-based module supporting 2.4 GHz Wi-Fi 6(802.11ax) and Bluetooth 5 Low Energy. Ultra-low power, compact size, high cost performance, and rich peripheral interfaces. #Module #RF-Transceiver #ESP32-C61

RF Attenuators 0dB ~ 31.75dB 9 kHz ~ 6 GHz 50 Ohms 24-VFQFN Exposed Pad #commonpartslibrary #integratedcircuit #attenuator

RF Switch IC 802.11a/b/g/WiFi, WLAN SP3T 6 GHz 50Ohm 8-MLP (1.5x1.5) #CommonPartsLibrary #IntegratedCircuit #RF #RF-Switch #SKY13317

Clock Fanout Buffer (Distribution), Multiplexer IC 1:10 3.5 GHz 32-VFQFN Exposed Pad #CommonPartsLibrary #IntegratedCircuit #Clock/Timing #Buffer #Driver #CDCLVP111

Clock Fanout Buffer (Distribution), Divider IC 2:8 1.2 GHz 64-VFQFN Exposed Pad, CSP #CommonPartsLibrary #IntegratedCircuit #Clock/Timing #Clock-Buffer #Driver #AD9510

Clock Fanout Buffer (Distribution) IC 1:2 3.8 GHz 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) #CommonPartsLibrary #IntegratedCircuit #Clock/Timing #Buffer #Driver #65LVEP11

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount The ESP32-S3-WROOM-1U-N16R8 is a high-performance embedded module designed for IoT and edge computing applications, featuring integrated wireless connectivity and enhanced processing capabilities. Processor: Dual-core Xtensa LX7, up to 240 MHz Wireless Connectivity: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth LE 5.0 Memory Configuration (N16R8): 16 MB Flash memory 8 MB PSRAM Antenna Type: U.FL connector for external antenna (“1U” variant) Indicates support for an external antenna via U.FL connector Allows improved RF performance and flexible antenna placement #commonpartslibrary #rf #wireless #transceiver #module

RF ANTENNA Bluetooth, Wi-Fi, WLAN, Zigbee™ Ceramic Patch Solder Surface Mount The SWLP.2450.10.4.A.02 specification defines the engineering requirements for a surface-mount radio frequency antenna designed for wireless communication applications operating within the 2.4 GHz frequency band. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure efficient RF transmission and reception, stable antenna performance, and long-term operational reliability in embedded electronic systems. The antenna is intended for use in wireless communication devices supporting technologies such as Bluetooth, Wi-Fi, Zigbee, Thread, and other 2.4 GHz ISM band protocols. It is optimized for compact PCB integration while providing efficient radiation characteristics, stable impedance matching, and dependable performance in space-constrained electronic products including IoT devices, industrial controllers, consumer electronics, and smart sensing platforms. Engineering Requirements The antenna shall be manufactured using qualified conductive and dielectric materials with controlled production processes to ensure consistent RF performance, mechanical durability, and long-term reliability. The construction shall maintain stable electrical characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall provide efficient radiation efficiency, stable impedance matching, low return loss, and reliable signal transmission and reception across the intended operating frequency range. The antenna shall maintain consistent performance when integrated according to the recommended PCB layout and grounding practices. The RF structure shall minimize insertion losses and support reliable wireless communication while maintaining acceptable gain, bandwidth, and radiation pattern characteristics. The antenna shall exhibit stable performance under normal operating conditions without significant degradation caused by thermal variation or environmental exposure. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental stress without degradation of electrical or structural performance. Workmanship shall be free from defects including cracks, contamination, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, impedance matching recommendations, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFAntenna #WirelessCommunication #Antenna #Bluetooth #WiFi #IoT #EmbeddedSystems #QualityAssurance #EngineeringDocumentation

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

5.8GHz Center High Pass Ceramic Filter 5.8 GHz 50Ohm 6-SMD, No Lead