This project is a reference design for an ESP32-WROOM-32E based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #project #ESP32 #ESP32WROOM #RF #WIFI #MCU #referenceDesign #simple-embedded #espressif #template #reference-design

The Notecard is a device-to-cloud data pump that reduces the complexity of building connected solutions with secure, reliable cellular. As an embeddable system on module (SoM), the Notecard can be used with any microcontroller for both greenfield and retrofit projects using your own design, or one of our custom designed Notecarriers. Global Version

The ESP32-C3FH4 is a highly integrated wireless microcontroller designed for Internet of Things, smart devices, industrial automation, consumer electronics, and embedded connectivity applications. It combines a low-power RISC-V processor with integrated Wi-Fi and Bluetooth Low Energy connectivity, providing a cost-effective and secure platform for wireless communication and edge computing. The device incorporates embedded flash memory, advanced security features, low-power operating modes, and a rich set of peripheral interfaces, making it suitable for battery-powered and always-connected systems. Its compact design and comprehensive software ecosystem enable rapid development of connected products while maintaining high reliability and energy efficiency. The ESP32-C3FH4 is widely used in smart sensors, home automation devices, wearable electronics, industrial monitoring systems, wireless control modules, and cloud-connected embedded products. Features Integrated RISC-V microcontroller core Built-in Wi-Fi connectivity Integrated Bluetooth Low Energy support Embedded flash memory Low-power operation for battery-powered applications Hardware cryptographic acceleration Secure boot capability Flash encryption support Multiple GPIO interfaces Integrated UART, SPI, I²C, I²S, PWM, and ADC peripherals Real-time processing capability Wireless networking and cloud connectivity support OTA firmware update support Compact surface-mount package Industrial-grade reliability Electrical Characteristics Wireless microcontroller architecture Integrated RF subsystem Low-power operating modes High-performance embedded processing Secure communication support Multi-protocol wireless connectivity Flexible peripheral expansion capability Optimized power consumption for IoT devices Applications Internet of Things devices Smart home automation Wireless sensor networks Industrial monitoring systems Asset tracking devices Wearable electronics Smart appliances Remote control systems Data acquisition platforms Edge computing applications Connected consumer products Embedded wireless gateways Package Information Surface-mount package Compact footprint for embedded applications Suitable for automated assembly processes Optimized thermal and electrical performance PCB-friendly package design #commonpartslibrary #integratedcircuit #microcontroller #wirelessconnectivity #wifi #bluetoothlowenergy #iot #embeddedsystems #espressif #smartdevices #industrialautomation #edgecomputing #wirelessmodule #internetofthings #electronicsdesign #riscv #embeddedelectronics #lowpowerdesign

2.4GHz -98dBm SMD,19.2x18mm RF Transceiver Modules and Modems RoHS The ESP32-WROOM-32UE-N16 is a 2.4 GHz wireless MCU module built around the ESP32 SoC. It combines a dual-core processor, integrated Wi-Fi (802.11 b/g/n) and Bluetooth 4.2 (Classic + BLE), along with rich peripherals. The “UE” variant specifically uses a U.FL / IPEX connector for an external antenna, making it ideal for applications that require better RF performance or flexible antenna placement (e.g., enclosed products or long-range communication). The “N16” indicates 16 MB external flash memory, suitable for large firmware, OTA updates, and data-heavy applications. Processing Dual-core Xtensa LX6 32-bit CPU Clock speed up to 240 MHz Memory 16 MB Flash (N16 variant) ~520 KB SRAM + 448 KB ROM Connectivity Wi-Fi: 802.11 b/g/n (up to 150 Mbps) Bluetooth: v4.2 (BR/EDR + BLE) Frequency: 2.4 GHz band Antenna External antenna via U.FL connector Better range and flexibility vs PCB antenna Interfaces / Peripherals GPIO (≈26 usable pins) UART, SPI, I2C, I2S, SDIO ADC, DAC PWM (LED & motor control) Capacitive touch sensing Security Hardware encryption: AES, SHA, RSA Secure boot & flash encryption support Power Operating voltage: 3.0V – 3.6V (typ. 3.3V) Multiple low-power modes for battery applications Environmental Operating temperature: -40°C to +85°C Physical Surface-mount module (~38 pins / 52 pads depending on reference) Compact and RF-shielded design Typical Applications Smart home devices (IoT) Industrial automation Wireless sensors and data loggers Wearables and consumer electronics Remote monitoring systems #Module #ESP32

868/915MHz SPI SMD LoRa Module E22-900M22S is a compact, industrial-grade LoRa® wireless transceiver module developed by Ebyte, based on the Semtech SX1262 RF chipset. Operating in the 868/915 MHz ISM band, it communicates through an SPI interface and is designed for long-range, low-power wireless data transmission. The module offers excellent receiver sensitivity, strong anti-interference performance, and supports both LoRa and FSK modulation, making it suitable for smart metering, industrial automation, IoT sensor networks, remote monitoring, and wireless control applications. Key Features Based on the Semtech SX1262 LoRa transceiver Operates in the 850–930 MHz frequency range (optimized for 868/915 MHz ISM bands) SPI interface with data rates up to 10 Mbps Maximum transmit power of +22 dBm (160 mW) Receiver sensitivity up to −147 dBm (LoRa mode) Supports LoRa and FSK modulation Programmable air data rate up to 62.5 kbps (LoRa) and 300 kbps (FSK) Long communication range of up to 7 km under ideal line-of-sight conditions Wide operating voltage: 1.8 V to 3.7 V (3.3 V recommended) Ultra-low receive current (~6.8 mA) and low sleep current Industrial operating temperature: −40°C to +85°C Compact 20 × 14 × 2.8 mm SMD package with castellated pads/IPEX antenna options Suitable for IoT, AMI, smart home, industrial sensors, wireless alarms, and remote control systems. #Ebyte #E22Series #E22900M22S #SX1262 #LoRa #WirelessModule #SubGHz #SPI #IoT #IndustrialAutomation #SmartMetering #RemoteMonitoring #EmbeddedSystems #RFModule

J-FET Amplifier 4 Circuit 14-SOIC The TL074ACDR is a high-performance JFET-input quad operational amplifier manufactured by Texas Instruments. This integrated circuit contains four independent operational amplifiers optimized for low-noise analog signal processing, high input impedance, and low power consumption. The JFET input stage provides minimal input bias current and excellent signal integrity, making the device suitable for precision analog applications. The TL074ACDR is widely used in audio processing equipment, active filters, signal conditioning circuits, instrumentation systems, industrial electronics, and embedded analog front-end designs. Its high slew rate, wide bandwidth, and low harmonic distortion characteristics make it particularly suitable for audio amplification and high-fidelity analog signal applications. The device supports dual-supply operation and provides stable performance across a broad operating range. Its compact surface-mount package and integrated quad amplifier architecture reduce PCB space requirements and simplify analog circuit implementation in modern electronic systems. Engineering Specification Device Type Quad operational amplifier Amplifier Architecture JFET-input operational amplifier Number of Channels Four independent amplifier channels Input Characteristics High input impedance with low input bias current Signal Performance Low-noise analog signal amplification Bandwidth Characteristics Wide bandwidth suitable for audio and signal conditioning applications Slew Rate Performance High slew rate for fast analog signal response Distortion Characteristics Low harmonic distortion for precision analog applications Supply Configuration Dual-supply analog operation compatibility Output Characteristics Capable of driving standard analog signal loads Power Consumption Low operating power suitable for continuous analog processing Package Type SOIC surface-mount package Mounting Style Surface mount technology Applications Audio amplifiers Signal conditioning Active filters Instrumentation systems Sensor interfaces Industrial electronics Analog front-end circuits Embedded analog systems Data acquisition systems Consumer audio equipment Manufacturer Texas Instruments #commonpartslibrary #operationalamplifier #opamp #quadopamp #analogelectronics #signalconditioning #audioelectronics #texasinstruments #embeddedhardware #analogdesign #surfaceountcomponents #instrumentation #lownoise #jfetamplifier #electronicsdesign

The Notecard is a device-to-cloud data pump that reduces the complexity of building connected solutions with secure, reliable cellular. As an embeddable system on module (SoM), the Notecard can be used with any microcontroller for both greenfield and retrofit projects using your own design, or one of our custom designed Notecarriers. North America Version

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory

Magnetic Sensors LIS2MDLTR LGA-12_L2.0-W2.0-P0.50-BL LCSC Part Number: C919695 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics LIS2MDL ultralow-power high-performance 3-axis digital magnetometer, ±50 gauss magnetic dynamic range, 16-bit data output, SPI and I2C serial interfaces, 1.71V to 3.6V analog supply voltage, selectable power modes and resolution, single measurement mode, programmable interrupt generator, embedded self-test and temperature sensor, -40°C to +85°C operating range, LGA-12 package 2.0 x 2.0 x 0.7mm. Search Keywords: LIS2MDL, LIS2MDLTR, ST LIS2MDL, STMicroelectronics LIS2MDL, LIS2MDL magnetometer, 3-axis magnetometer, digital magnetic sensor, 3-axis digital magnetic sensor, ±50 gauss magnetometer, I2C SPI magnetometer, 16-bit magnetometer, low power magnetometer, compass sensor, LGA-12 magnetometer, 2x2mm magnetometer Hashtags: #LIS2MDL #LIS2MDLTR #STMicroelectronics #Magnetometer #3AxisMagnetometer #DigitalMagneticSensor #CompassSensor #I2CSensor #SPISensor #16BitSensor #LowPowerSensor #50GaussSensor #LGA12

The Notecard is a device-to-cloud data pump that reduces the complexity of building connected solutions with secure, reliable cellular. As an embeddable system on module (SoM), the Notecard can be used with any microcontroller for both greenfield and retrofit projects using your own design, or one of our custom designed Notecarriers. Wide-Band EMEA Version

32GB eMMC 5.1 FBGA-153 eMMC ROHS KLMBG2JETD-B041 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C2803245 JLCPCB Part Class: Extended Part Manufactured by SAMSUNG(三星半导体) embedded MultiMediaCard Ver. 5.1 compatible.  SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update. - Non-supported Features : Large Sector Size (4KB)  Full backward compatibility with previous Multi

The digital pressure sensors in the AMS 5935 series are high-resolution 18-bit board mount sensors which provide pressure and temperature meas-urement data via an I²C / SPI interface.

USB Switch IC 2 Channel 10-VSON (3x3) The TS3USB221DRCR specification defines the engineering requirements for a high-speed USB analog switch integrated circuit designed for signal routing and interface switching in embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable high-speed signal transmission, low insertion loss, and long-term operational stability. The device is intended for use in USB interface switching, portable electronics, embedded controllers, communication equipment, docking stations, and multimedia systems requiring high-speed differential signal routing. It enables seamless switching between USB data paths while maintaining signal integrity, minimizing propagation delay, and supporting reliable operation in compact, high-performance electronic designs. Engineering Requirements The analog switch shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent switching performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide low on-resistance, low capacitance, minimal insertion loss, and excellent channel-to-channel matching to preserve high-speed USB signal integrity. The device shall support reliable differential signal switching with minimal distortion, low propagation delay, and low crosstalk during continuous operation. The switching architecture shall provide dependable channel selection, high isolation between signal paths, and predictable switching behavior during power-up, power-down, and dynamic operating conditions. The device shall maintain stable electrical performance while minimizing electromagnetic interference and signal degradation. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand vibration, thermal cycling, mechanical handling, and environmental exposure without degradation of performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #USBAnalogSwitch #HighSpeedSwitch #USBInterface #SignalIntegrity #EmbeddedSystems #Semiconductor #ElectronicDesign #QualityAssurance #EngineeringDocumentation