260 Position SODIMM DDR4 SDRAM Socket Surface Mount #commonpartslibrary #connector #sdram #socket

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

SDRAM - DDR3L Memory IC 4Gbit Parallel 933 MHz 20 ns 78-FBGA (8x10.5) #CommonPartsLibrary #IntegratedCircuit #Memory #MT41K512M8

200 Position SODIMM DDR SDRAM Socket Surface Mount #commonpartslibrary #connector #sdramsocket

260 Position SODIMM DDR4 SDRAM Socket Surface Mount #commonpartslibrary #connector #sodimm #ddr4 #sdram

260 Position SODIMM DDR4 SDRAM Socket Surface Mount SO-DIMM memory socket for connecting DDR4 memory modules to a printed circuit board. It features 260 positions with a right-angle, surface-mount configuration, 0.5 mm contact pitch, 9.2 mm stack height, 1.2 V DRAM support, and a maximum contact current rating of 0.5 A, with an operating temperature range of -55°C to +85°C. #MemoryConnector #SODIMMSocket #DDR4 #260Position #SurfaceMount #RightAngle #TEConnectivity #CommonPartsLibrary #Connector #Module-Socket

SDRAM Memory IC 256Mbit Parallel 166 MHz 5 ns 54-TSOP II #CommonPartsLibrary #IntegratedCircuit #Memory #W9825G6

16 Gb LPDDR4 SDRAM, high-speed, low-power mobile memory in 200-ball FBGA package. #CommonPartsLibrary #IntegratedCircuit #Memory #200-TFBGA

SDRAM AS4C16M16SB-7TCN TSOP-54_L22.2-W10.2-P0.80-LS11.8-BL LCSC Part Number: C2919810 JLCPCB Part Class: undefined Manufactured by Alliance Memory

A microcontroller board with a camera, mic, and Coral Edge TPU. Dual-core i.MX RT1176 MCU Cortex-M7 (@800 MHz) and a Cortex-M4 (@400 MHz) 2 MB of built-in SRAM 64 MB of SDRAM More than 1 GB of flash memory Embedded Evaluation Board #coral #google #Edge #TPU #coprocessor #no3d #RT1176

260 Position SODIMM DDR4 SDRAM Socket Surface Mount #commonpartslibrary #connector #sodimm

SDRAM - DDR3 Memory IC 512Mbit Parallel 800 MHz 20 ns 96-FBGA (8x13) #commonpartslibrary #integratedcircuit #memory

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

SDRAM - DDR3L Memory IC 2Gbit Parallel 933 MHz 20 ns 96-FBGA (7.5x13.5) #CommonPartsLibrary #IntegratedCircuit #Memory #D1216

SDRAM - DDR3L Memory IC 4Gbit Parallel 933 MHz 20 ns 96-FBGA (7.5x13.5) #CommonPartsLibrary #IntegratedCircuit #Memory #D2516

SDRAM Memory IC 256Mbit Parallel 143 MHz 5.4 ns 54-TFBGA (8x8) #commonpartslibrary #integratedcircuit #memory

SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 96-TWBGA (9x13) #CommonPartsLibrary #IntegratedCircuit #Memory #SDRAM #DDR3

SDRAM Memory IC 256Mbit Parallel 166 MHz 5 ns 54-TSOP II #CommonPartsLibrary #IntegratedCircuit #Memory #W9825G6