802.15.4 Bluetooth, Wi-Fi Bluetooth v5.0, ZigBee® Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N4 is based on the ESP32-C6 single-core RISC-V microcontroller, integrating advanced wireless standards and secure connectivity in a small module format. It is designed for next-generation IoT devices that require Wi-Fi 6 efficiency, mesh networking, and Bluetooth Low Energy support. Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless Connectivity: Wi-Fi 6 (802.11ax, 2.4 GHz) Bluetooth LE 5.0 IEEE 802.15.4 (Thread / Zigbee support) Memory (N4 variant): 4 MB Flash Security: Secure boot Flash encryption Cryptographic hardware acceleration #commonpartslibrary #rf #wireless #transceiver #module #zigbee

WiFi 802.11b/g/n Transceiver Module 2.4GHz ~ 2.5GHz Integrated, Trace Surface Mount The ESP-12F is a compact WiFi module based on the ESP8266EX, widely used in IoT and embedded systems due to its low cost and built-in networking capabilities. Integrated WiFi (2.4 GHz) Supports 802.11 b/g/n Built-in TCP/IP stack (no external WiFi processor needed) Microcontroller + WiFi in one Powered by the ESP8266EX SoC Can run user applications directly (not just a WiFi modem) Flash Memory Typically 4 MB SPI flash (varies by version) GPIO Support Multiple multifunction pins: Digital I/O PWM I2C SPI UART ADC (1 channel) Size: ~16 mm × 24 mm Mounting: Castellated SMD module Antenna: Built-in PCB trace antenna (requires proper keepout zone) Power Requirements Operating Voltage: 3.0V – 3.6V (typical 3.3V) Current Consumption: Idle: ~70 mA Peak (TX): up to ~300 mA Common Interfaces UART – programming and debugging SPI – peripheral communication I2C (software-based) GPIO – general-purpose control #commonpartslibrary #transceiver #module #wireless #rf #wifi

Buck Switching Regulator IC Positive Adjustable 1.2V 1 Output 3.5A 8-PowerSOIC (0.154", 3.90mm Width) The LM5013DDAR is a 100-V input, 3.5-A buck switching regulator IC that efficiently steps down high DC voltages (such as 24 V, 48 V, or battery rails) to lower regulated outputs. It is optimized for rugged environments where wide input variations and high reliability are required. It features ultra-low quiescent current operation, making it suitable for systems that require high efficiency even at light load or standby conditions. Key Features Wide input voltage range: 6 V to 100 V Up to 3.5 A output current capability Integrated 100-V high-side MOSFET Non-synchronous buck topology Ultra-low quiescent current (IQ) for high efficiency in standby Constant-on-time (COT) control for fast transient response No external compensation components required Adjustable output voltage (down to ~1.2 V reference) 50 ns minimum on/off time for high step-down ratios Built-in protection features: Overcurrent protection Thermal shutdown Input undervoltage lockout (UVLO) Open-drain power-good (PGOOD) signal for system monitoring Meets low EMI requirements (CISPR 25 Class 5 capable) Package 8-pin SO PowerPAD (DDA) surface-mount package Designed for good thermal performance in high-voltage applications Typical Applications Industrial power supplies (24 V / 48 V systems) Automotive power systems Telecom and networking equipment High cell-count battery systems Motor control and inverter subsystems #LM5013 #BuckConverter #DCDCConverter #TexasInstruments #PowerManagementIC #HighVoltageRegulator #3ARegulator #IndustrialPower #AutomotiveElectronics #SwitchingRegulator #COTController

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

Non-Isolated PoL Module DC DC Converter 1 Output 0.8 ~ 6V 10A 6V - 20V Input The LMZ22010TZ/NOPB is a compact, high-efficiency step-down (buck) DC-DC power module from Texas Instruments. It integrates a switching regulator, power MOSFETs, inductor, and compensation components into a single package, simplifying power supply design. This module is capable of delivering up to 10A output current with excellent thermal performance and minimal external components. It is intended for high power density applications such as industrial systems, telecommunications equipment, and embedded processing platforms. Manufacturer Information Manufacturer: Texas Instruments Part Number: LMZ22010TZ/NOPB Product Type: DC-DC Buck Power Module Key Features Integrated power module with inductor and controller Output current up to 10A Wide input voltage range High efficiency operation Adjustable output voltage Built-in protection features (thermal shutdown, overcurrent protection) Power-good output and enable control Requires minimal external components Electrical Characteristics Parameter Value Input Voltage Range 6 V to 20 V Output Voltage Range 0.8 V to 6 V (adjustable) Output Current Up to 10 A Switching Frequency ~500 kHz Efficiency Up to ~95% Operating Temperature Range -40°C to +125°C Package Information Package Type: TO-PMOD (Power Module) Mounting Type: Surface Mount Integrated inductor and power components Optimized for thermal performance Pin Configuration (Typical) Pin Name Description VIN Input supply voltage VOUT Regulated output voltage GND Ground EN Enable input FB Feedback for output adjustment PGOOD Power-good indicator Typical Applications Industrial automation systems Telecom and networking equipment FPGA / DSP / processor power rails Embedded systems Point-of-load regulation Design Considerations Ensure proper PCB layout for heat dissipation Use appropriate input/output capacitors External resistors required to set output voltage Consider airflow for high-current operation #commonpartslibrary #powersupply #dcdc #converter

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

11 Position Connector Header, Center Strip Contacts Surface Mount Gold or Gold, GXT™ The 91911-31311LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is designed for compact, high-density PCB stacking applications commonly used in industrial, embedded, networking, and portable electronic systems. Key Features 11-position vertical header 1.00 mm pitch compact board-to-board connector Surface-mount (SMT) mounting 5 mm mated stacking height Gold/GXT™ contact plating for reliable signal integrity and durability Board guide and solder retention features for easier assembly and improved mechanical stability Supports high-density PCB layouts Designed for industrial and embedded applications RoHS and REACH compliant Housing material: LCP (Liquid Crystal Polymer) Rated up to 1 A current and 500 V voltage Typical Applications Embedded computing modules Industrial control systems Networking equipment Portable electronics Compact PCB stacking designs

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering