TE Connectivity CRGCQ2010J1M0 Resistor, 1MOhm, 0.75W, 2010 Package

TE Connectivity CRGCQ2010J10K Resistor, 10kOhm, 0.75W, 2010 Package

TE Connectivity CRGCQ2010J1K0 Resistor, 1kOhm, 0.75W, 2010 Package

TE Connectivity CRGCQ2010J150R, 150 Ohms ±5% 0.75W, 3/4W Chip Resistor 2010 (5025 Metric) Automotive AEC-Q200, Moisture Resistant Thick Film

TE Connectivity CRGCQ2010J470K Resistor, 470kOhm, 0.75W, 2010 Package

TE Connectivity CRGP2010F33R Resistor, 33Ohm, 1.25W, 2010 Package

TE Connectivity 35021M8FT, 1.8 MOhms ±1% 2W Chip Resistor 2010 (5025 Metric) - Thick Film

The Wio-E5-LE mini Dev Board integrates and provides access to the full GPIO capabilities of the Wio-E5-LE Wireless Module (STM32WLE5JC). With support for long range protocols and global frequencies, the Wio-E5-LE mini can achieve a transmission range up to 10km in open areas. It supports EU868 and US915, making it well-suited for wireless sensor networks and other IoT devices requiring battery power, low power consumption, and long range connectivity.

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

USB Type-C USB 2.0 Receptacle Connector – Right-angle USB Type-C receptacle designed for consumer electronics, industrial controllers, IoT devices, embedded systems, charging equipment, portable products, and USB-enabled communication interfaces. The Same Sky (formerly CUI Devices) UJ20-C-H-G-SMT-2-P16-TR features a 24-contact (16 active + 8 dummy) USB Type-C interface supporting USB 2.0 data rates up to 480 Mbps. It is rated for 48 VDC, with 5 A on VBUS power contacts, 1.25 A on VCONN contacts, and 0.25 A on signal contacts. Designed with a surface-mount, right-angle configuration plus through-hole retention tabs, it provides enhanced mechanical strength for repeated cable insertion. Features include gold-plated contacts, shielded steel shell (SUS304), UL94 V-0 housing, 10,000 mating cycles, and an operating temperature range of −25°C to +85°C, making it ideal for reliable power and data connectivity in compact embedded designs. #SameSky #UJ20CHGSMT2P16TR #USBTypeC #USB20 #USBConnector #TypeCReceptacle #BoardToCable #SurfaceMountConnector #EmbeddedSystems #IndustrialElectronics #IoT #ConsumerElectronics

Tactile Switch SPST-NO Top Actuated Surface Mount The FSM1LP is a surface-mount tactile (momentary) switch manufactured by TE Connectivity under the ALCOSWITCH series. It is a low-profile, top-actuated pushbutton switch designed for compact PCB applications requiring reliable user input. This switch operates as a momentary SPST-NO (Single Pole Single Throw – Normally Open) device, meaning it only conducts when pressed and returns to open when released. Key Features Switch Type Tactile momentary (OFF–(ON)) pushbutton Contact Configuration SPST-NO (Normally Open) Mounting Type Surface Mount (SMD) with gull-wing leads Actuation Style Top-actuated round button Electrical Rating 50 mA @ 24 VDC Operating Force Approximately 1.57 N (~160 gf) Low Profile Design Compact height (~3–3.5 mm typical), suitable for slim devices Mechanical Life Around 100,000 cycles Contact Material Copper alloy with silver plating for reliable conductivity Compact Size Typically ~6 × 6 mm footprint RoHS Compliant Lead-free and environmentally compliant tactile switch momentary 4 pin smd #CommonPartsLibrary #Switch

The Wio Terminal is a SAMD51-based microcontroller with Wireless Connectivity powered by Realtek RTL8720DN that’s compatible with Arduino and MicroPython. Currently, wireless connectivity is only supported by Arduino. It runs at 120MHz (Boost up to 200MHz), 4MB External Flash and 192KB RAM. It supports both Bluetooth and Wi-Fi providing backbone for IoT projects.

6-Position Vertical Wire-to-Board PCB Header – Single-row shrouded male header designed for industrial controls, consumer electronics, appliances, power supplies, embedded systems, instrumentation, and general-purpose wire-to-board interconnect applications. The TE Connectivity 640456-6 is part of the MTA-100 Series, featuring 6 positions on a 2.54 mm (0.100") pitch with a through-hole vertical PCB mount. It utilizes square copper alloy contacts with tin plating, a single-wall polarized shroud, and a friction-lock mating system to ensure secure cable retention and proper orientation during assembly. Rated for 250 VAC (current rating depends on the mating wire gauge), it is constructed with a UL94 V-0 thermoplastic housing for durability and flame resistance. The connector operates over a −55°C to +105°C temperature range and is ideal for reliable board-to-wire connections in embedded and industrial electronic designs. #TEConnectivity #6404566 #MTA100 #WireToBoard #PCBHeader #MaleHeader #ThroughHoleConnector #254mmPitch #IndustrialElectronics #EmbeddedSystems #BoardToWire #Connector

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C3-WROOM-02-N4 is a compact, general-purpose Wi-Fi and Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-C3 SoC and integrates RF components, crystal oscillator, flash memory, and PCB antenna in a single module. It is designed for a wide range of applications such as IoT devices, smart home systems, industrial automation, and consumer electronics, offering a balance of performance, low power consumption, and cost efficiency. Key Features MCU & Memory 32-bit RISC-V single-core processor up to 160 MHz 384 KB ROM 400 KB SRAM + 8 KB RTC SRAM Integrated 4 MB SPI flash (N4 variant) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Supports Station, SoftAP, and Station + SoftAP modes Bluetooth 5 (BLE) with mesh support Data rates up to 150 Mbps (Wi-Fi) Peripherals & Interfaces Up to 15 GPIOs Interfaces: SPI, UART, I2C, I2S LED PWM ADC (SAR) Timers & watchdog USB Serial/JTAG support TWAI® (CAN 2.0 compatible) #commonpartslibrary #transceiver #module #wireless #rf

RP2040 chip for Raspberry Pi Pico - ARM® Cortex®-M0+ MCU 32-Bit The RP2040 is a high-performance, low-cost microcontroller built around two ARM Cortex-M0+ cores. It is optimized for flexibility, ease of use, and deterministic real-time performance. Unlike many microcontrollers, it includes a unique programmable I/O subsystem (PIO), allowing custom hardware interfaces without extra components. Key Features Processing Dual-core ARM Cortex-M0+ processors Up to 133 MHz clock speed Efficient integer performance with low power consumption Memory 264 KB on-chip SRAM External QSPI flash support (typically 2 MB–16 MB depending on board) Programmable I/O (PIO) 2 PIO blocks, each with 4 state machines Enables custom protocols (e.g., SPI, I2C, UART, WS2812, VGA, etc.) Offloads timing-critical tasks from CPU 🔗 Connectivity Interfaces 2× UART 2× SPI 2× I2C USB 1.1 controller (device or host support) 16× PWM channels Analog Features 12-bit ADC (up to 5 channels, including internal temperature sensor) Power & Voltage Operating voltage: 1.8V – 3.3V Low-power modes available Package Options QFN-56 (7×7 mm) Development Ecosystem Supports C/C++ SDK MicroPython and CircuitPython support Strong community and documentation Typical Applications Embedded systems and IoT devices Robotics and automation DIY electronics and prototyping USB devices (HID, MIDI, etc.) Custom communication interfaces using PIO #CommonPartsLibrary #IntegratedCircuit #Microcontroller

Seeed Studio XIAO ESP32C3 adopts new RISC-V architecture, supporting both Wi-Fi and BLE wireless connectivity. For Internet of Things applications, you will find it is flexible and suitable for all kinds of IoT scenarios. #SeeedStudio #xiao

Connector Header Through Hole, Right Angle 10 position 0.100" (2.54mm) The 1761607-3 is a pluggable terminal block connector manufactured by TE Connectivity. It is designed for reliable wire-to-board connections in industrial and electronic applications. The connector supports screw-clamp termination, allowing secure and reusable wire connections. Its modular design enables easy installation and maintenance, making it suitable for control systems, power distribution, and signal interfacing. Key Features Pluggable terminal block connector Screw-clamp wire termination Reliable mechanical and electrical connection Modular and field-serviceable design Suitable for industrial environments Electrical Characteristics Rated voltage: up to 300 V (typical, application dependent) Rated current: up to 8 A (depending on wire size and conditions) Contact resistance: low contact resistance for stable conductivity Insulation resistance: high insulation resistance Mechanical Characteristics Number of positions: 3 Pitch: 3.5 mm Termination type: screw clamp Wire size range: typically 26 AWG to 16 AWG Mounting type: through-hole PCB Mating type: pluggable header interface Material Properties Housing material: high-temperature thermoplastic Contact material: copper alloy Contact plating: tin plating Flammability rating: UL94 V-0 Environmental Specifications Operating temperature range: −40°C to +105°C RoHS compliant Suitable for industrial applications Applications Industrial control systems Power supply connections Signal interface modules Automation equipment HVAC and building control systems Compliance & Standards RoHS compliant UL recognized (application dependent) IEC standard compliant terminal block design #commonpartslibrary #connector #header

The Wi-Fi HaLow Board based on the FGH100M-H module is a high-performance, long-range Wi-Fi HaLow solution. Operating in the 902-928 MHz frequency band, it offers excellent penetration and coverage, making it ideal for smart home and IoT applications. With its compact design and compatibility with the Seeed Studio XIAO ecosystem, this card ensures reliable and efficient connectivity for various projects.

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering