Part Audit Mismatch
Worked for 1 min 46 sec
The footprint geometry is a 2.0 mm body with four 0.65 × 0.85 mm pads and a pin-1 marker. The geometry is plausible, but its functional pad assignments inherit the symbol’s incorrect numbering, making the current part unsafe to use as-is.
Worked for 1 min 41 sec
Created a project doc
Part Audit Report
Part Audit Report
Scope
Audit of the XL-2020RGBC-WS2812B part metadata, schematic terminals, imported KiCad footprint, and stored datasheet.
Source reviewed
- Stored Datasheet URL: ea8ae72d9c4bdb4fec53958a67d8949b5c6230115996d12bdd7b64926976a8e2.pdf
- Document title: XL-2020RGBC-WS2812B Technical Data Sheet
- Manufacturer identified in part properties: XINGLIGHT
- Footprint asset:
XL2020RGBCWS2812B.kicad_mod - 3D model asset:
XL-2020RGBC-WS2812B.stp
The Datasheet URL property was already populated, so it was not changed. The stored URL is a hosted copy rather than a manufacturer-domain URL; the document title and MPN match the part, but source provenance should be confirmed befo...
Audit complete. The Datasheet URL was already populated, so no property update was needed; however, all four symbol pin numbers conflict with the datasheet, causing incorrect footprint pad assignments and making the part unsafe to use as-is. I documented specs and mismatches in the Part Audit Report and filed a part-quality report with Flux engineering.
Open item
- Required mapping: VDD=1, DOU=2, GND=3, DIN=4; pin types/descriptions and package metadata are also missing.
Fix pinout and metadata
Correct pinout
Add pin metadata
Update package details
Verify footprint geometry
Run part review
Refine this doc
Ask about this doc
Part Audit Report
Scope
Audit of the XL-2020RGBC-WS2812B part metadata, schematic terminals, imported KiCad footprint, and stored datasheet.
Source reviewed
- Stored Datasheet URL: ea8ae72d9c4bdb4fec53958a67d8949b5c6230115996d12bdd7b64926976a8e2.pdf
- Document title: XL-2020RGBC-WS2812B Technical Data Sheet
- Manufacturer identified in part properties: XINGLIGHT
- Footprint asset:
XL2020RGBCWS2812B.kicad_mod - 3D model asset:
XL-2020RGBC-WS2812B.stp
The Datasheet URL property was already populated, so it was not changed. The stored URL is a hosted copy rather than a manufacturer-domain URL; the document title and MPN match the part, but source provenance should be confirmed before publication if an official manufacturer-hosted URL is required.
Current part information
Table
| Field | Current value | Review |
|---|---|---|
| MPN | XL-2020RGBC-WS2812B | Matches datasheet title |
| Manufacturer | XINGLIGHT | Consistent with part identity |
| Part Type | Optoelectronic Devices | Broad but reasonable; LED or addressable RGB LED would be more specific if supported |
| Designator Prefix | LED | Appropriate |
| Pin count | 4 physical pads/terminals | Matches datasheet |
| Package property | Not populated | Missing; datasheet body is 2.0 × 2.0 × 0.65 mm SMD |
| Compliance | Rohs | Matches datasheet RoHS statement; capitalization could be normalized to RoHS |
| Datasheet URL | Populated | No update required |
| Description | 30~+70 RGB 2020 Light Emitting Diodes (LED) ROHS | Incomplete/ambiguous; appears to omit the minus sign from the −30 to +70 °C operating range and does not mention integrated controller or 800 kHz protocol |
| Symbol Style | parametric-v1 | Present |
| License | CC BY 4.0 URL | Present |
Datasheet pinout
Table
| Physical pin | Datasheet name | Function |
|---|---|---|
| 1 | VDD | Positive supply |
| 2 | DOU | Serial data output |
| 3 | GND | Ground |
| 4 | DIN | Serial data input |
Current symbol and footprint mapping
Table
| Project terminal | Current pin number | Required pin number | Result |
|---|---|---|---|
| DO | 1 | 2 | Mismatch |
| GND | 2 | 3 | Mismatch |
| DI | 3 | 4 | Mismatch |
| VDD | 4 | 1 | Mismatch |
This is a critical mismatch. The imported footprint has physical pads numbered 1–4, but Flux binds those pads to the project terminal numbers. As currently defined, the resulting functional mapping is wrong on every pad. A PCB using this part would connect VDD, ground, data input, and data output to incorrect physical leads.
Symbol quality
- Four terminals are present, but all Pin Type values are
Unspecified. - Pin Description is missing for every terminal.
- Pin Group, Section, explicit Pin Orientation, and Terminal Order are missing.
- Terminal names
DOandDIare understandable abbreviations, but the datasheet usesDOUandDIN. - Current symbol placement puts VDD and DI on the left and DO and GND on the right. This is readable for signal flow, but the missing electrical types and incorrect pin numbers are more important than visual arrangement.
Recommended terminal definitions:
Table
| Name | Pin | Type | Description | Broad group/section |
|---|---|---|---|---|
| VDD | 1 | Power In | Positive power supply | Power |
| DOU | 2 | Output | Serial signal data output | Data |
| GND | 3 | Ground | Ground reference | Ground |
| DIN | 4 | Input | Serial signal data input | Data |
Footprint review
Imported footprint facts:
- SMD footprint with four rectangular pads.
- Body/fabrication outline: 2.0 × 2.0 mm.
- Pad centers:
(±0.675, ±0.650) mm. - Each pad: 0.650 × 0.850 mm, rotated 90°.
- Pad layers: F.Cu, F.Paste, F.Mask.
- Pad 1 marker is present near the positive-X/positive-Y corner.
- 3D model transform is zero offset, unit scale, zero rotation.
- Courtyard: 4.2 × 4.0 mm, substantially larger than the 2.0 × 2.0 mm body.
The copper geometry and 2.0 mm body outline are plausible for the package. The footprint numbering pattern is internally coherent, but the terminal-to-pad binding is wrong because the schematic terminal pin numbers are wrong. The datasheet OCR did not expose a recommended land-pattern dimension table, so the exact 0.650 × 0.850 mm land sizes could not be independently validated from text alone. Visual verification against the datasheet’s back-view drawing is still recommended.
Other footprint observations:
- The F.SilkS layer has only a very small pin-1 marker; there is no clear silkscreen body outline.
- Reference text size is 1.27 mm, large relative to a 2.0 mm component.
- The 4.2 × 4.0 mm courtyard may unnecessarily reduce LED packing density and should be checked against the intended assembly process and optical spacing.
Key electrical and protocol specifications
Table
| Parameter | Datasheet value |
|---|---|
| Recommended supply voltage | 3.5 to 5.5 V; 5 V typical |
| Absolute supply range | −0.5 to 5.5 V |
| Operating temperature | −30 to +70 °C |
| Storage temperature | −20 to +60 °C |
| Typical IC operating current | 0.5 mA |
| R/G/B drive current | 5 mA typical in electrical table |
| Built-in LED test current | 12 mA per color at 5 V in LED parameter table |
| Data rate | 800 kHz typical |
| PWM frequency | 1.5 kHz typical |
| Reset low time | ≥80 µs |
| Data word | 24 bits per LED |
| Logic-high input threshold | ≥0.5 × VDD |
| Logic-low input threshold | ≤0.25 × VDD |
| ESD withstand | 2 kV HBM |
| Moisture sensitivity | MSL 5a |
| Package | 2.0 × 2.0 × 0.65 mm SMD |
| Reflow cycles | Maximum two |
| Hand soldering | <20 W iron, <300 °C, <3 s per terminal, once per terminal |
Note: the datasheet contains differing current contexts (5 mA internal RGB drive current and 12 mA LED test current per color). These values should not be collapsed into a single maximum supply-current property without clarification from the manufacturer.
Mismatches and risks
Critical
- All four terminal pin numbers are shifted relative to the datasheet. The part is electrically unsafe to use until corrected.
- The footprint inherits the wrong functional pad mapping through those terminal numbers.
Important
- Pin electrical types and descriptions are missing.
- Package/case information is not populated as a property.
- The current description appears to encode the operating range incorrectly as
30~+70rather than−30 to +70 °Cand omits the integrated addressable controller. - The stored datasheet is a hosted copy rather than a manufacturer-domain URL, so its official provenance is not explicit.
Review recommended
- Validate the pad dimensions visually against the datasheet package drawing because no textual recommended land pattern was extractable.
- Review the oversized courtyard and sparse silkscreen for intended array density and assembly readability.
- Confirm the STEP model orientation against the physical pin-1 mark in 3D.
Recommended corrective action
Renumber and rename the terminals to
VDD=1, DOU=2, GND=3, and DIN=4; add appropriate pin types, descriptions, broad groups/sections, orientation, and terminal order; then verify that each terminal binds to the correspondingly numbered footprint pad and that the 3D model pin-1 indication matches pad 1. After correction, rerun the part terminal review and inspect the rendered symbol and footprint.Scope
Source reviewed
Current part information
Datasheet pinout
Current symbol and footprint mapping
Symbol quality
Footprint review
Key electrical and protocol specifications
Mismatches and risks
Critical
Important
Review recommended
Recommended corrective action
