Part Audit Review
Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
Thought for 13 sec
I’ll audit the part metadata, source the official TI datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against it.
Worked for 6 mins 2 sec
The metadata and datasheet audit is underway; I’m now waiting on the full 13-pad symbol/footprint comparison and will verify any reported discrepancies before closing.
Worked for 4 mins 6 sec
Audit complete. The official TI datasheet URL was already set, so no property update was needed; all 13 physical pads were reviewed.
Key mismatches: VIN lands are numbered 11–13 instead of sharing pin number 8, all pin types are unspecified, pin descriptions/package metadata are missing, and automotive/synchronization claims are unsupported. Full findings: TPS56837RPAR Part Audit.
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Correct VIN numbering
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TPS56837RPAR Part Audit
Audit date: 2026-07-27
Authoritative source: Texas Instruments, TPS5683x 4.5-V to 28-V Input, 8-A Synchronous Buck Converter, Rev. B (SLVSGM3B, January 2024)
Official TI datasheet: https://www.ti.com/lit/ds/symlink/tps56837.pdf
TI orderable-part page: https://www.ti.com/product/TPS56837/part-details/TPS56837RPAR
Authoritative source: Texas Instruments, TPS5683x 4.5-V to 28-V Input, 8-A Synchronous Buck Converter, Rev. B (SLVSGM3B, January 2024)
Official TI datasheet: https://www.ti.com/lit/ds/symlink/tps56837.pdf
TI orderable-part page: https://www.ti.com/product/TPS56837/part-details/TPS56837RPAR
Scope and mutation status
- Metadata inventory: Completed.
- Datasheet property: Completed inspection. A Datasheet URL was already present, so it was not changed, per the instruction to update only if absent.
- Symbol audit: Completed for all 13 project terminals.
- Footprint/package audit: Completed against TI RPA0010A package outline and land-pattern data.
- Symbol/footprint edits: None.
Current metadata inventory
Project identity
Table
| Field | Current value | Audit result |
|---|---|---|
| Project/part name | TPS56837RPAR | Match |
| Published part UID | ff59bbd6-989c-468f-8c8d-ba6f437e9413 | Informational |
| Manufacturer Part Number | TPS56837RPAR | Match |
| Manufacturer Name | Texas Instruments | Match |
| Designator Prefix | IC | Reasonable, although U is more conventional |
| Part Type | Integrated Circuits | Broad but correct |
| Package property | Absent | Mismatch/omission; TI identity is RPA, VQFN-HR, 10 logical pins, 3.00 mm × 3.00 mm, 1.00 mm max height |
| Datasheet URL | Google Storage user-uploaded PDF | Present; no mutation made. Content identifies TI Rev. B datasheet, but property is not the canonical TI URL |
| Machine Datasheet URL | Absent | Optional omission |
| Project components/terminals | 13 | Represents 13 physical copper lands, not 13 TI logical pin numbers |
| PCB pads | 13 | Physical land count matches the HotRod footprint implementation |
| Nets/BOM items | 0 / 0 | Expected for a standalone part project |
Current project description
The description correctly states 4.5–28 V input, 0.6–13 V output, 8 A continuous output, D-CAP3, 45 µA typical TPS56837 quiescent current, 20.4 mΩ/9.5 mΩ integrated MOSFETs, selectable 500/800/1200 kHz operation, Eco-mode, PG, adjustable soft start, protection functions, −40°C to +150°C junction range, and 3 mm × 3 mm VQFN-HR packaging.
Description mismatches/ambiguities:
- “Automotive” is unsupported/misleading. TI classifies TPS56837RPAR as a catalog part; the orderable number does not carry a
-Q1automotive qualification suffix, and the datasheet does not claim AEC-Q100 qualification. - “Frequency synchronization” is not supported by the documented pinout. There is no SYNC input. Frequency is selected at startup by the MODE resistor (500, 800, or 1200 kHz), not synchronized to an external clock.
- “Pre-biased startup” was not found in the Rev. B feature list or extracted operating description. Treat this claim as unverified unless a specific TI section is cited.
- Application phrases such as automotive power supplies, industrial automation, networking equipment, and embedded applications are broad marketing/use-case claims rather than orderable-part specifications.
- “10-pin VQFN-HR” is TI’s correct logical package pin count, but the footprint has 13 physical copper lands because pin 8 (VIN) is physically segmented into four lands. This distinction should be explicit.
Exact key datasheet specifications
Table
| Parameter | TI value/evidence |
|---|---|
| Topology | Synchronous buck converter |
| Input operating range | 4.5 V to 28 V |
| Absolute maximum VIN | 32 V |
| Output range | 0.6 V to 13 V |
| Continuous output current | 8 A |
| Feedback reference | 0.6 V ±1% at 25°C |
| Control | D-CAP3™ |
| TPS56837 light-load mode | Eco-mode / auto-skip |
| Selectable switching frequencies | 500 kHz, 800 kHz, 1200 kHz via MODE resistor |
| MODE current-limit options | 7.2 A typ low-side valley limit (ILIM-1) or 9.6 A typ (ILIM) |
| High-side peak current limit | 15 A typ |
| High-side MOSFET RDS(on) | 20.4 mΩ typ at 25°C |
| Low-side MOSFET RDS(on) | 9.5 mΩ typ at 25°C |
| Quiescent current | 45 µA typ, nonswitching, TPS56837 |
| Shutdown current | 3 µA typ |
| Default soft start | 1.8 ms; adjustable using SS capacitor |
| Bootstrap capacitor | 0.1 µF between BOOT and SW |
| Maximum duty operation | Up to 98% |
| PG output | Open-drain; 10 mA typ sink characterization |
| Output discharge | Integrated, 200 Ω typ |
| Junction operating range | −40°C to +150°C |
| Package | RPA0010A, VQFN-HR / HotRod QFN, 3.00 mm × 3.00 mm, 1.00 mm max height |
| Thermal RθJA | 68.1°C/W JEDEC; effective 30°C/W on TI four-layer EVM |
Logical pin table cross-check
TI defines 10 logical pins. The project contains correct names for pins 1–10, but all project pin electrical types are
Unspecified, and pin descriptions are absent.Table
| TI pin | TI name | TI type | TI function summary | Current project result |
|---|---|---|---|---|
| 1 | EN | Input | Enable; floating/high enables; resistor divider can implement UVLO | Number/name match; type and description missing |
| 2 | FB | Input | Output feedback divider input | Match; type and description missing |
| 3 | AGND | Ground | Internal analog ground; connect to PGND plane at one point | Match; type and description missing |
| 4 | PG | Output | Open-drain power-good output | Match; type and description missing |
| 5 | SS | Output (TI table) | Soft-start capacitor node; 1.8 ms default if floating | Match; type and description missing |
| 6 | SW | Output | Switching node; output inductor connection | Match; type and description missing |
| 7 | BOOT | Input | High-side gate-drive supply; 0.1 µF to SW | Match; type and description missing |
| 8 | VIN | Power | Input supply/high-side MOSFET drain; decouple to PGND | Project VIN_1 is numbered 8 and matches function; suffix differs from canonical name |
| 9 | PGND | Ground | Power ground/low-side MOSFET source | Match; type and description missing |
| 10 | MODE | Input | Selects switching frequency and current limit using resistor to AGND | Match; type and description missing |
Additional project terminals 11–13
Table
| Project terminal | Current pin number | Physical footprint land | Correct TI logical mapping |
|---|---|---|---|
| VIN_2 | 11 | Right-side VIN segment | Pin 8 (VIN) |
| VIN_3 | 12 | Right-side VIN segment | Pin 8 (VIN) |
| VIN_4 | 13 | Right-side VIN segment | Pin 8 (VIN) |
Major mapping mismatch: TI does not define logical pins 11, 12, or 13. The RPA0010A package is a 10-pin package. Its VIN terminal is implemented by four physical lands: the large VIN land plus three right-edge VIN lands. The project correctly names all four as VIN variants but incorrectly gives the three segmented lands new logical pin numbers 11–13. Electrically and for BOM/netlist semantics, they should all map to logical pin 8 (duplicate physical pads for VIN), while remaining separate physical copper pads in the footprint.
Exposed/thermal pad treatment
The package has two large exposed power lands:
- Pad 6 / SW: approximately 0.25 mm × 1.70 mm in the TI land pattern; high-dV/dt switching copper, not a grounded thermal pad.
- Pad 9 / PGND: approximately 0.40 mm × 2.10 mm; power-ground and primary thermal path. TI instructs using at least two PGND vias for thermal performance and wide PGND copper.
- Pad 8 / VIN: approximately 0.40 mm × 2.10 mm main land plus three segmented edge lands, all logically VIN.
TI’s stencil example calls for 89% printed paste coverage by area on exposed pads 6 and 9. The project inspection confirms the copper land geometry but did not expose independent paste-aperture geometry, so exact stencil coverage could not be verified. This remains an ambiguity rather than a confirmed mismatch.
Footprint geometry and package identity
The rendered footprint has a nominal 3 mm × 3 mm fabrication outline and the expected 13 physical copper lands. Tool output reports very small numeric coordinates while labeling them mm (for example, ±0.0015 for the package outline); these values consistently appear to use a 1000:1 internal display scaling. Comparing geometry after applying that scale gives the following:
Table
| Feature | Project geometry | TI land pattern | Result |
|---|---|---|---|
| Body/fab outline | 3.0 mm × 3.0 mm equivalent | 3.0 mm × 3.0 mm nominal | Match |
| Pins 1–4 | 0.25 mm × 0.60 mm | 0.25 mm × 0.60 mm | Match |
| Pins 5, 7, 10 | 0.25 mm × 0.60 mm | 0.25 mm × 0.60 mm | Match |
| SW, logical pin 6 | 0.25 mm × 1.70 mm | 0.25 mm × 1.70 mm | Match |
| Main VIN, logical pin 8 | 0.40 mm × 2.10 mm | 0.40 mm × 2.10 mm | Match |
| PGND, logical pin 9 | 0.40 mm × 2.10 mm | 0.40 mm × 2.10 mm | Match |
| Three segmented VIN lands | 0.25 mm × 0.56 mm | TI drawing shows three 0.25 mm lands with 0.56 mm reference extent | Match |
| Signal/edge pitch | 0.50 mm increments | 0.50 mm | Match |
| Package family/code metadata | Not populated | RPA0010A, VQFN-HR | Missing metadata |
| Pin-1 marker | Present near pin 1 | Required | Match |
The physical copper geometry closely matches TI’s RPA0010A recommended board layout. The key defect is logical pad numbering, not copper placement.
Complete mismatch and ambiguity list
Confirmed mismatches
- Project terminals
VIN_2,VIN_3, andVIN_4use pin numbers 11, 12, and 13; TI requires all three to be physical segments of logical pin 8 (VIN). - All 13 terminals have
Pin Type = Unspecified; TI provides explicit I/O/Power/Ground classifications. - All terminals lack datasheet-derived pin descriptions.
- Package/case property is absent; it should identify RPA / RPA0010A, VQFN-HR, 3 mm × 3 mm.
- Description claims external frequency synchronization, but the device only supports resistor-selected switching frequencies and has no SYNC pin.
- “Automotive” labeling is not supported by TI qualification/status evidence for TPS56837RPAR.
Ambiguities/unverified items
- The current Datasheet URL points to a user-uploaded Google Storage copy rather than the canonical TI URL. It is present and appears to be the correct Rev. B document, so no property change was allowed by the request.
- Paste stencil geometry/89% coverage for exposed pads 6 and 9 was not visible in structured footprint inspection.
- Solder-mask expansion and the TI minimum 0.07 mm non-solder-mask-defined clearance were not directly exposed for verification.
- “Pre-biased startup” was not found in the audited Rev. B feature/functional text.
- The footprint inspection tool’s unit labeling appears scaled by 1000; dimensional matching is based on the consistent equivalent geometry and relative positions.
Final disposition
The part’s identity, core electrical specifications, ten primary pin names, package family, and physical land geometry are substantially correct. It is not fully datasheet-clean because the three extra VIN lands are represented as nonexistent logical pins 11–13, terminal electrical types/descriptions are missing, package metadata is absent, and the description contains unsupported automotive and synchronization claims. No symbol or footprint changes were made.
Scope and mutation status
Current metadata inventory
Project identity
Current project description
Exact key datasheet specifications
Logical pin table cross-check
Additional project terminals 11–13
Exposed/thermal pad treatment
Footprint geometry and package identity
Complete mismatch and ambiguity list
Confirmed mismatches
Ambiguities/unverified items
Final disposition
