Part Audit Review

A

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll audit the part metadata, locate and attach the official TI datasheet if needed, then verify the symbol, footprint, and pin descriptions against it.
Created a project doc

Part Audit Report

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Part Audit Report Part identity
  • MPN: TPS26750SRSMR
  • Manufacturer: Texas Instruments
  • Description: Stand-alone USB Type-C and USB Power Delivery controller with integrated power-path management and Extended Power Range support.
  • Orderable package: RSM, 32-pin VQFN, 4.0 mm × 4.0 mm, 0.4 mm pitch, 1.0 mm maximum height, exposed thermal pad (33 total electrical/thermal terminals).
  • Operating temperature: –40°C to +125°C junction/orderable rating; ambient limits depend on PP5V load.
  • Datasheet: Official TI datasheet was already populated, so no property update was required.
Key specifications
  • USB-IF certified for USB PD 3.1; supports EPR source/sink operation at 28 V, 36 V, and 48 V profiles and AVS/PPS functions.

flux

Audit complete. The official TI datasheet was already attached; key issues are pin 19 mislabeled GND_4 instead of VSYS, missing pin types/descriptions, incorrect “Logic / AND” classification, and footprint pad dimensions differing from TI’s land pattern. A quality ticket was filed; full results are in Part Audit Report.
Correct part metadata
Fix symbol data
Fix footprint geometry
Check thermal pad
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Part Audit Report
Part identity
  • MPN: TPS26750SRSMR
  • Manufacturer: Texas Instruments
  • Description: Stand-alone USB Type-C and USB Power Delivery controller with integrated power-path management and Extended Power Range support.
  • Orderable package: RSM, 32-pin VQFN, 4.0 mm × 4.0 mm, 0.4 mm pitch, 1.0 mm maximum height, exposed thermal pad (33 total electrical/thermal terminals).
  • Operating temperature: –40°C to +125°C junction/orderable rating; ambient limits depend on PP5V load.
  • Datasheet: Official TI datasheet was already populated, so no property update was required.
Key specifications
  • USB-IF certified for USB PD 3.1; supports EPR source/sink operation at 28 V, 36 V, and 48 V profiles and AVS/PPS functions.
  • Integrated 5 V, 3 A sourcing power path, approximately 36 mΩ at 25°C.
  • 26 V-tolerant CC1/CC2 pins; VBUS absolute maximum 28 V and recommended operating maximum 22 V.
  • Supply options: VIN_3V3 = 3.0–3.6 V or dead-battery startup from VBUS; PP5V = 4.9–5.5 V.
  • Ten configurable GPIO functions, BC1.2 support, one I2C controller interface, and one I2C target interface.
  • Orderable TPS26750SRSMR is active, large tape-and-reel, 3000 units/reel, MSL 2, 260°C peak reflow.
Symbol and pin audit
Pin numbering and names match the datasheet except for pin 19:
  • Pin 19 mismatch: the symbol calls this pin GND_4; TI names it VSYS and instructs that it be tied to GND. The electrical connection expectation is ground, but the present name hides its actual function as the POWER_PATH_EN reference.
  • Active-low interrupt pins are represented with ~I2CT_IRQ and ~I2CC_IRQ; this is semantically consistent with the datasheet.
  • All 33 terminals exist and the remaining pin-number/name mapping matches the top-view RSM pinout.
  • Pin metadata incomplete: every terminal has Pin Type: Unspecified, and no Pin Description properties are populated. TI provides explicit I/O and functional descriptions for all non-NC pins.
Footprint audit
  • Pad count, 0.4 mm pitch, 4 mm package outline, pin-1 orientation, and exposed pad topology match the RSM0032B package family.
  • Perimeter pad mismatch: footprint pads are 0.20 mm × 0.75 mm, while TI’s RSM0032B example land pattern specifies 0.20 mm × 0.55 mm.
  • Exposed pad difference: footprint pad 33 is 2.85 mm × 2.85 mm; TI’s example board layout shows 2.8 mm × 2.8 mm. This is a smaller discrepancy than the perimeter-pad length but should still be reviewed against assembly rules.
  • The footprint description identifies RSM0032B and the 3D model name matches the MPN.
Property mismatches
  • Part Type: Integrated Circuits is acceptable but nonspecific.
  • The library metadata classifies the subtype as Logic and the logic function as AND. This is incorrect; the device is a USB Type-C/USB PD interface and power-management controller.
  • The human-readable description says PD 3.1, while TI’s current product page markets the device as a PD 3.2 controller; the datasheet itself states USB-IF PD 3.1 certification. This is a wording/version nuance rather than a pin or package error.
Disposition
The official datasheet property was already present. A part-quality report was filed for the pin-19 naming error, missing pin types/descriptions, incorrect logic classification, and footprint land-pattern differences. No symbol or footprint geometry was changed during this audit.

  • Part identity

  • Key specifications

  • Symbol and pin audit

  • Footprint audit

  • Property mismatches

  • Disposition