Part Information Review and Update


Update the Datasheet URL, add pin types/descriptions, fix the footprint pads, then run ERC/DRC.
I’ll update the part metadata and terminal properties, correct the QFN pad geometry, then run ERC/DRC to verify the result.
Metadata and terminal properties are updated. I’m correcting the QFN footprint land pattern now.
Footprint pad dimensions now match the TI land pattern. I’m running ERC/DRC and checking the current violations.
Updated the Datasheet URL to the official TI PDF, added datasheet-derived pin types/descriptions/groups/sections, and corrected the footprint pads to TI’s RUK0020B land pattern: 0.20 × 0.60 mm perimeter pads and 1.70 × 1.70 mm exposed pad.
Open items:
  • ERC/DRC returned no errors or warnings at the latest review timestamp.
  • The project description still appears to describe a different USB charging/ESD part; it should be corrected separately if desired.
Suggested next steps:
  • Ask me to clean up the project description.
  • Ask me to rerun component review checks after any manual edits.
  • Ask me to rename ~FLT to exact datasheet text FLT if you prefer strict datasheet pin naming.
Fix description and review
Clean project description
Rename FLT pin
Rerun component review
Check manufacturing export

Name
Pin #
Type
Section
Pin Group
Orientation
Order
Sub-symbol
Pin Description
C_SBU1
1
Bi-Directional
Interface
USB
Connector side of the SBU1 OVP FET. Connect to either SBU pin of the USB Type-C connector, or optionally to a USB2.0 pin when protecting USB2.0 instead of SBU.
C_SBU2
2
Bi-Directional
Interface
USB
Connector side of the SBU2 OVP FET. Connect to either SBU pin of the USB Type-C connector, or optionally to a USB2.0 pin when protecting USB2.0 instead of SBU.
VBIAS
3
Power In
Power
Power
Pin for ESD support capacitor. Place 0.1 µF from VBIAS to GND; capacitor must be at least 63 VDC rated, with 100 VDC recommended.
C_CC1
4
Bi-Directional
Interface
USB
Connector side of the CC1 OVP FET. Connect to either CC pin of the USB Type-C connector.
C_CC2
5
Bi-Directional
Interface
USB
Connector side of the CC2 OVP FET. Connect to either CC pin of the USB Type-C connector.
RPD_G2
6
Bi-Directional
Control
Control Bus
Dead-battery resistor gate for CC2 path. Short to C_CC2 if dead-battery resistors are needed; otherwise short to GND.
RPD_G1
7
Bi-Directional
Control
Control Bus
Dead-battery resistor gate for CC1 path. Short to C_CC1 if dead-battery resistors are needed; otherwise short to GND.
GND_1
8
Ground
Power
Ground
Bottom
Ground pin.
~FLT
9
Open Collector
Control
Control Bus
Open-drain fault reporting output. Pull up to the fault-reporting rail with 1.7 kΩ to 300 kΩ per datasheet.
VPWR
10
Power In
Power
Power
2.7 V to 4.5 V power supply input. Place 1 µF typical decoupling capacitor near this pin.
CC2
11
Bi-Directional
Interface
USB
System side of the CC2 OVP FET. Connect to either CC pin of the USB Type-C / USB-PD controller.
CC1
12
Bi-Directional
Interface
USB
System side of the CC1 OVP FET. Connect to either CC pin of the USB Type-C / USB-PD controller.
GND_2
13
Ground
Power
Ground
Bottom
Ground pin.
SBU2
14
Bi-Directional
Interface
USB
System side of the SBU2 OVP FET. Connect to either SBU pin of the SBU MUX, or optionally to a USB2.0 PHY pin when protecting USB2.0 instead of SBU.
SBU1
15
Bi-Directional
Interface
USB
System side of the SBU1 OVP FET. Connect to either SBU pin of the SBU MUX, or optionally to a USB2.0 PHY pin when protecting USB2.0 instead of SBU.
NC_1
16
Not Connected
MISC
MISC
No connect. Leave floating or connect to GND per datasheet.
NC_2
17
Not Connected
MISC
MISC
No connect. Leave floating or connect to GND per datasheet.
GND_3
18
Ground
Power
Ground
Bottom
Ground pin.
NC_3
19
Not Connected
MISC
MISC
No connect. Leave floating or connect to GND per datasheet.
NC_4
20
Not Connected
MISC
MISC
No connect. Leave floating or connect to GND per datasheet.
GND_4
21
Ground
Power
Ground
Bottom
Exposed thermal pad, internally connected to GND. Solder to PCB GND plane for thermal and mechanical performance.

TPD4S201RUKR