Datasheet Part Review
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TPD1E10B06DYAR Part Review
Date: 2026-07-22 Reviewed available part metadata, schematic terminals/symbol information, PCB footprint data, and the official Texas Instru...
Done — I found and set the official TI datasheet URL for TPD1E10B06DYAR and completed the symbol/footprint/pin cross-check. Full details are in TPD1E10B06DYAR Part Review.
Open items:
- Pin metadata is incomplete: pins 1 and 2 exist, but
Pin TypeisUnspecifiedand pin descriptions are missing. - Footprint is usable but not an exact TI land-pattern transcription: small pad-size/pitch differences and rectangular pads vs TI’s rounded-pad example.
- Description is broader than the exact MPN because DYAR is specifically the DYA / SOD-523 package variant.
Suggested next steps:
- Update pin descriptions/types from the datasheet.
- Decide whether to adjust the footprint to exactly match the TI example land pattern.
- Tighten the part description to the exact TPD1E10B06DYAR package variant.
Fix metadata and footprint
Update pin metadata
Tighten description
Match TI footprint
Run ERC/DRC
Refine this doc
Ask about this doc
TPD1E10B06DYAR Part Review
Date: 2026-07-22
Scope
Reviewed available part metadata, schematic terminals/symbol information, PCB footprint data, and the official Texas Instruments datasheet for TPD1E10B06DYAR.
Official datasheet set on the part:
- Datasheet URL: https://www.ti.com/lit/ds/symlink/tpd1e10b06.pdf
- Source: Texas Instruments, TPD1E10B06 Single-Channel ESD Protection Diode, Rev. G.
Available part information in project
Table
| Field | Project / CAD value observed | Datasheet cross-check |
|---|---|---|
| MPN / project name | TPD1E10B06DYAR | Matches TI orderable part number. |
| Manufacturer | Not directly exposed in inspected schematic terminal properties | Datasheet/product page: Texas Instruments. |
| Description | “ESD Suppressors / TVS Diodes 12-pF, +/-5.5V, +/-30-kV ESD protection diode in 0402 and SOD-523 package” | Electrical description matches family. Note: the specific DYAR orderable is SOT-5X3 / DYA / SOD-523, 2 pins. The family also has other package variants, so the description is broader than this exact MPN. |
| Pin count | Project context: 2 pads; schematic: two terminal components; footprint: two SMD pads | Matches datasheet DYA package: 2 pins. |
| Package / footprint | Footprint asset SODFL1608X77N.kicad_mod, description DYA0002A; fab body approx. 1.2 mm × 0.8 mm; pads at ±0.725 mm, pad size 0.42 mm × 0.67 mm | Matches package family and substantially matches TI DYA0002A land pattern. Minor land-pattern deltas noted below. |
| Existing terminal properties | Pin 1 and Pin 2 terminals both have Pin Type: Unspecified; no visible Pin Description | Datasheet defines both pins as I/O: “ESD Protected I/O. Connect other pin ground.” |
Datasheet key specs
Table
| Parameter | Datasheet value |
|---|---|
| Device type | Single-channel ESD / TVS protection diode, bidirectional/back-to-back structure |
| Package for TPD1E10B06DYAR | SOT-5X3, package drawing DYA, 2 pins; SOD-523 outline |
| Package size | Nominal 1.6 mm × 0.8 mm; DYA0002A, 0.77 mm max height |
| Reverse stand-off voltage, VRWM | 5.5 V max, pin 1-to-2 or pin 2-to-1 |
| Recommended operating voltage | -5.5 V to +5.5 V |
| I/O capacitance, CIO | 12 pF typ at VIO = 2.5 V, f = 1 MHz |
| Leakage current | 100 nA max at pin 1 = 5 V, pin 2 = 0 V |
| Breakdown voltage | 6 V min at IIO = 1 mA, both polarities |
| Clamp voltage | 10 V max at 1 A, 14 V max at 5 A for pin 1 strike; 8.5 V typ at 1 A, 14 V typ at 5 A for pin 2 strike |
| Dynamic resistance | 0.32 Ω typ pin 1-to-2; 0.38 Ω typ pin 2-to-1 |
| IEC 61000-4-2 ESD | ±30 kV contact, ±30 kV air-gap |
| IEC 61000-4-5 surge | 6 A max, 8/20 µs; 90 W peak pulse power at 25 °C |
| Operating temperature | -40 °C to +125 °C |
| MSL / reflow | Level-3-260C-168 HR |
| Part marking | 1KF |
Pin and symbol cross-check
Datasheet DYA package pin functions:
Table
| Pin | Datasheet I/O | Datasheet description | Project terminal state | Result |
|---|---|---|---|---|
| 1 | I/O | ESD Protected I/O. Connect other pin ground. | Terminal exists with Pin Number: 1; pin type shown as Unspecified; no pin description visible | Pin number matches; metadata incomplete. |
| 2 | I/O | ESD Protected I/O. Connect other pin ground. | Terminal exists with Pin Number: 2; pin type shown as Unspecified; no pin description visible | Pin number matches; metadata incomplete. |
Symbol geometry is a simple 2-terminal inline symbol. That is acceptable for a 2-pin bidirectional TVS diode, but the terminal metadata should ideally identify both pins as I/O/passive TVS terminals and include the TI pin description.
Footprint cross-check
Datasheet DYA0002A land pattern example:
- 2 pads
- Pad dimensions shown: 2 × 0.4 mm and 2 × 0.67 mm
- Pad-to-pad/overall callout: 1.48 mm
- Pad corner radius: R0.05 typical
- Non-solder-mask-defined preferred
Current footprint asset:
- Asset name:
SODFL1608X77N.kicad_mod - Description:
DYA0002A - Pads: 2 SMD rectangular pads
- Pad positions: x = ±0.725 mm, center-to-center = 1.45 mm
- Pad size: 0.42 mm × 0.67 mm, rotated 90°
- Fab outline: approximately 1.2 mm × 0.8 mm
- Courtyard: approximately 2.42 mm × 1.15 mm
- 3D model:
TPD1E10B06DYAR.stp
Footprint result
The footprint is the correct general package style for the DYA / SOD-523 variant and uses two pads with essentially the expected 0.67 mm pad length. Potential discrepancies:
- Pad width: current footprint uses 0.42 mm vs datasheet example 0.40 mm. This is a small 0.02 mm difference and likely an IPC/library rounding choice, but it is not an exact TI example-land-pattern match.
- Pad pitch / callout: current pad centers are 1.45 mm apart vs datasheet callout 1.48 mm. This 0.03 mm difference is minor but should be reviewed if exact TI land-pattern fidelity is required.
- Pad corner radius: datasheet shows R0.05 typical rounded pads; current pads are rectangular with no explicit radius. Usually manufacturable, but not an exact visual match to the TI example.
- Fab outline length: current fab outline appears about 1.2 mm × 0.8 mm, while the DYA package outline includes 1.5–1.7 mm and 1.1–1.3 mm outer dimensions plus a 0.75–0.85 mm body dimension. This may reflect body-only vs total package interpretation in the imported footprint, but it should be checked visually against the 3D model if mechanical documentation accuracy matters.
No severe footprint issue was found that obviously makes the part unusable for PCB fabrication, but the footprint is not an exact transcription of the TI example land pattern.
Flagged mismatches / gaps
Table
| Severity | Item | Details | Recommended action |
|---|---|---|---|
| Medium | Pin metadata incomplete | Both terminal pins exist and have correct pin numbers, but Pin Type is Unspecified and no visible Pin Description is present. | Set both pins to I/O or passive-style terminal type if supported, and add: “ESD Protected I/O. Connect other pin ground.” |
| Low | Description is broader than exact orderable | Description mentions “0402 and SOD-523 package,” but the exact MPN TPD1E10B06DYAR is the SOT-5X3 / DYA / SOD-523 orderable. | Consider revising description to state this part project is specifically the DYA/SOD-523 variant, while the family also includes other package options. |
| Low | Footprint pad dimensions are close but not exact | Current pad width 0.42 mm vs datasheet 0.40 mm; pad center spacing 1.45 mm vs datasheet callout 1.48 mm. | Accept if library/IPC variant is intended; otherwise adjust to exact TI example. |
| Low | Rectangular pads vs rounded TI example | TI example shows R0.05 typical. Current pads are rectangular. | Optional: round pads if the platform/library supports it and exact drawing match is desired. |
| Low | Fab outline interpretation | Fab outline appears body-sized rather than full package-outline-sized. | Verify against 3D model/mechanical drawing if assembly drawings rely on F.Fab dimensions. |
Overall conclusion
The part is broadly consistent with the official TI TPD1E10B06DYAR DYA/SOD-523 2-pin ESD protection diode. The datasheet URL has been set and the PCB footprint appears usable, with only small land-pattern and documentation-style deviations. The main cleanup opportunity is terminal metadata: pin type and pin descriptions should be populated from the datasheet.
Scope
Available part information in project
Datasheet key specs
Pin and symbol cross-check
Footprint cross-check
Footprint result
Flagged mismatches / gaps
Overall conclusion
