Part Review and Datasheet Update

A

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll review the part metadata, find and set the official datasheet URL if missing, then cross-check symbol pins, footprint, and pin descriptions against the datasheet.

flux

Completed the part review and saved the detailed findings in XF28P650DK9PTP Part Review. The Datasheet URL was already populated, so I did not overwrite it; I found the direct official TI datasheet URL and noted it in the report.
Open items flagged:
  • XF28P650DK9PTP appears to be a preproduction/obsolete prefix; active TI orderable appears to be F28P650DK9PTP.
  • Layout reports 178 pad nodes while the expected electrical count is 177 including PowerPAD.
  • Pin descriptions are mostly not populated beyond terminal names.
  • A few pin types look simplified for mixed analog/DAC or ground/reference pins.
Suggested next steps:
  1. Update the MPN to F28P650DK9PTP if this part is intended for procurement.
  2. Replace/add the direct TI datasheet URL if you want the property to point to the official source.
  3. Audit the footprint pad count discrepancy.
  4. Populate richer pin descriptions from the datasheet.
Fix metadata and pads
Fix flagged issues
Audit pad count
Populate pin descriptions
Run design checks
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XF28P650DK9PTP Part Review
Reviewed project metadata
  • Project / part: XF28P650DK9PTP
  • Manufacturer: Texas Instruments
  • Current Datasheet URL property: https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/f3ba4329b0ccb5891e2ec5f4057a54bbf9fba2e89eb5254203c213744d195425.pdf
  • Official datasheet found: TI TMS320F28P65x Real-Time Microcontrollers datasheet (Rev. D), https://www.ti.com/lit/ds/symlink/tms320f28p650dk.pdf
  • Official TI product page: https://www.ti.com/product/TMS320F28P650DK
The Datasheet URL property was already populated, so I did not overwrite it. The populated URL appears to be a stored PDF copy rather than the direct TI URL.
Key device specs from datasheet / TI product data
  • Device family: C2000 real-time MCU, TMS320F28P65x / F28P650DK9
  • Orderable active equivalent: F28P650DK9PTP; XF28P650DK9PTP appears to be older/preproduction/obsolete in TI quality data.
  • Package: PTP / HLQFP / PowerPAD thermally enhanced LQFP
  • Pin count: 176 peripheral leads plus exposed thermal pad / PowerPAD as pad 177
  • Package size: 26 mm × 26 mm, 0.5 mm pitch, max height 1.6 mm
  • Exposed pad: approximately 6.237 mm × 6.237 mm, tied to VSS / digital ground
  • Core supply: VDD nominal 1.2 V
  • I/O and analog supply: VDDIO / VDDA nominal 3.3 V, max 3.63 V
  • Operating temperature: -40 °C to 125 °C ambient; datasheet lists junction to 150 °C
  • CPU: dual C28x plus CLA, 200 MHz class
  • Memory: 1.28 MB flash, 248 KB RAM
  • Major peripherals: HRPWM, ADCs, CMPSS, DACs, EtherCAT, CAN-FD, USB, SPI, I2C, UART/SCI, FSI, eQEP, eCAP
Symbol / pin review
Project symbol consists of 177 Terminal entries, matching 176 signal/power pins plus EPAD/PowerPAD. Spot checks against the datasheet were consistent:

Table

Project terminalPinDatasheet check
GPIO88170GPIO88 I/O
A538A5 analog input / comparator functions / AIO232
B4,GPIO21564B4 ADC input and GPIO215
VDD161.2 V logic supply
GPIO45115GPIO45 and alternate functions
VREFHIA37ADC-A high reference input
B8,GPIO21766B8 ADC input and GPIO217
GPIO1912GPIO19 I/O expected for this range
VDDIO33.3 V digital I/O supply
GPIO2874GPIO28 / SCIA_RX / alternate functions
A10,GPIO21362A10 analog input and GPIO213
A11,GPIO21463A11 analog input and GPIO214
A8,GPIO21159A8 analog input and GPIO211
A9,GPIO21260A9 analog input and GPIO212
A0/DACA_OUT43A0 ADC input and DACA_OUT
EPAD177VSS / PowerPAD thermal pad
Footprint review
  • Layout summary: 178 pad nodes plus one footprint node.
  • Expected package: 176 signal leads plus exposed pad = 177 electrical pads. The project context reports 177 pads, while layout summary reports 178 pad nodes. The tree view shows one EPAD plus all named peripheral pads; there may be one additional pad-like node or duplicated pad counted by the layout summary.
  • Footprint naming/description HLQFP176_PTP_TEX matches the datasheet package family.
  • Datasheet land pattern reference: 176 × 1.45 mm × 0.3 mm signal pads, 0.5 mm pitch, 6.237 mm square thermal pad.
Mismatches / risks flagged
  1. MPN lifecycle / naming: Project MPN is XF28P650DK9PTP; TI search indicates the active orderable part is F28P650DK9PTP, while the XF... prefix appears preproduction/obsolete. If this part is intended for procurement, consider using F28P650DK9PTP as the Manufacturer Part Number and retaining the XF value only as an alias/legacy marking.
  2. Datasheet URL: A Datasheet URL is already set, but it is a stored uploaded PDF, not the direct official TI URL. Per instruction I did not overwrite it; direct official URL is https://www.ti.com/lit/ds/symlink/tms320f28p650dk.pdf.
  3. Pad count discrepancy: Project context says 177 pads, but layout summary reports 178 pad nodes. Expected electrical pads are 177 including PowerPAD. This should be investigated before publishing/releasing the footprint.
  4. Pin descriptions sparse: The terminal properties include Pin Number and Pin Type, but do not include rich Pin Description values from the datasheet. Functional names are present in terminal designators, but detailed descriptions/mux notes are not populated.
  5. Pin type simplification: Some analog pins with DAC output capability are marked Output (A0/DACA_OUT, B1/DACC_OUT), while the datasheet lists them as multi-function analog input / comparator input / DAC output pins. Bi-Directional or a more nuanced analog/mixed-signal description may better reflect the muxed nature.
  6. Ground pin typing: At least one VSSA terminal is marked Power Out; ground/reference pins are typically better represented as Power In/passive ground depending on Flux convention.
  • Decide whether to update MPN from XF28P650DK9PTP to active TI orderable F28P650DK9PTP.
  • Optionally replace or add the direct official TI datasheet URL.
  • Audit the extra layout pad count and confirm whether any non-electrical pad is being counted unexpectedly.
  • Populate Pin Description properties for terminals from datasheet signal descriptions, especially power, reference, oscillator, JTAG, reset, and analog muxed pins.
  • Review pin types for mixed analog/DAC pins and ground/reference pins.

  • Reviewed project metadata

  • Key device specs from datasheet / TI product data

  • Symbol / pin review

  • Footprint review

  • Mismatches / risks flagged

  • Recommended next fixes