Part Review TMAG5273

Worked for 2 mins 56 sec

Found the current Datasheet URL pointed to an Arrow product page, so I updated it to TI’s official TMAG5273 datasheet link and am now checking pin/footprint details.

Worked for 6 mins 4 sec

Created a project doc

Part Review Report — TMAG5273A1QDBVR

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Date: 2026-07-22 Reviewed available part information for the published Flux part project TMAG5273A1QDBVR and cross-checked metadata, schemat...

flux

Completed the part review and created Part Review Report — TMAG5273A1QDBVR. I also updated the Datasheet URL from the Arrow product page to TI’s official datasheet.

Open items flagged:

Metadata subtype/function appears wrong: Logic / AND vs 3-axis Hall-effect magnetic sensor.
Pin types and pin descriptions are missing.
Minor pin-name deviations: GND_(TEST) and ~INT.
Footprint is close but not TI-exact: pad pitch/count OK, but row span and pad length differ slightly from TI DBV0006A land pattern.

Suggested next steps:

Populate terminal pin types and descriptions from the datasheet.
Correct the part classification metadata.
Adjust the footprint to the exact TI land pattern if strict package fidelity is required.

Fix metadata and footprint

Populate pin metadata

Correct part classification

Adjust TI footprint

Run final checks

Files

Pins

Symbol

Layout

Preview

GND_(TEST)

Pin Number

~INT

Pin Number

GND

Pin Number

VCC

Pin Number

SCL

Pin Number

SDA

Pin Number

Part Review Report — TMAG5273A1QDBVR

Date: 2026-07-22

Scope

Reviewed available part information for the published Flux part project TMAG5273A1QDBVR and cross-checked metadata, schematic symbol terminals, footprint geometry, and pin descriptions against Texas Instruments documentation.

Sources

Official TI datasheet: https://www.ti.com/lit/gpn/tmag5273
TI DBV0006A package drawing / land pattern: https://www.ti.com/lit/pdf/mpds026q
Flux library/project inspection: current project metadata, schematic terminals, and footprint payload.

Datasheet URL

The project had a Datasheet URL set, but it pointed to an Arrow distributor product page rather than the official datasheet. I updated the project Datasheet URL to the official TI datasheet link:

https://www.ti.com/lit/gpn/tmag5273

Current Part Metadata Reviewed

Table

Field	Current value / observation	Datasheet check	Status
Manufacturer Part Number	TMAG5273A1QDBVR	Orderable TI part number for TMAG5273 A1, DBV package, large tape-and-reel	Pass
Manufacturer	Texas Instruments	Matches TI datasheet and product page	Pass
Pin count	6	DBV SOT-23 has 6 pins	Pass
Package	Library reports SOT-23-6; footprint is SOT95P280X145-6N / DBV0006A-style	Datasheet package is DBV, SOT-23, 6 pins	Pass, with footprint dimensional notes below
Description	Low-power 3-axis linear Hall-effect magnetic sensor with I2C, 1.7–3.6 V, A1 ±40/±80 mT, 12-bit ADC, temperature sensor, INT, -40°C to +125°C, SOT-23 DBV	Broadly matches datasheet	Pass
Part classification	Part Type shown as Integrated Circuits; library search also reports subtype Logic and logicFunction AND	Device is a 3-axis magnetic/Hall-effect sensor, not logic/AND	Mismatch

Key Datasheet Specs

Table

Category	Datasheet value
Function	Low-power linear 3D Hall-effect sensor with I2C interface
Axes	X, Y, Z independent Hall sensors
ADC	12-bit magnetic-field measurement
Supply voltage	1.7 V to 3.6 V recommended operating range
Temperature	-40°C to +125°C operating free-air
Interface	I2C, up to 400 kHz over 1.7–3.6 V; Fast Mode Plus up to 1 MHz over 2.3–3.6 V
A1 magnetic range	±40 mT or ±80 mT selectable
A1 sensitivity	820 LSB/mT at ±40 mT; 410 LSB/mT at ±80 mT
Active current	2.3 mA typical, LP_LN = 0b; 3.0 mA typical, LP_LN = 1b
Standby current	0.45 mA typical
Sleep current	5 nA typical
Wake-and-sleep current	About 1 µA to 1.21 µA typical at 5000 ms interval, depending on VCC/channel count
Default A1 I2C address	7-bit 0x35; 8-bit write 0x6A; 8-bit read 0x6B
Package	DBV SOT-23-6, nominal package size 2.9 mm × 2.8 mm, max height about 1.4–1.45 mm

Pinout Cross-Check

Table

Pin	Datasheet pin name	Datasheet type/function	Current symbol terminal	Status / note
1	SCL	IO, serial clock	SCL	Pass
2	GND	Ground reference	GND	Pass
3	GND (TEST)	Input; TI test pin, connect to ground	GND_(TEST)	Functionally pass; name formatting differs from datasheet
4	VCC	Power supply	VCC	Pass
5	INT	IO, interrupt input/output	~INT	Functionally pass; datasheet name is INT, while symbol uses active-low styling
6	SDA	IO, serial data	SDA	Pass

Symbol / Pin Metadata Findings

Pin numbers and functional pin names are correct against the datasheet.
Pin 3 uses GND_(TEST) instead of the datasheet style GND (TEST) / GND(TEST). This is minor and functionally clear.
Pin 5 uses ~INT; TI names the pin INT. Active-low styling may be useful, but the exact datasheet name is not preserved.
All terminal Pin Type values are currently Unspecified; the datasheet provides enough information to set these more accurately.
Pin descriptions are not populated on the terminals.

Suggested terminal metadata if this part is cleaned up:

Table

Pin	Suggested type	Suggested description
1 SCL	IO / Input	I2C serial clock; requires bus pull-up in application
2 GND	Ground	Ground reference
3 GND(TEST)	Input or Passive	TI test pin; connect to ground in application
4 VCC	Power In	Main supply, 1.7 V to 3.6 V
5 INT	IO / Output	Interrupt input/output; if unused and tied to ground, set MASK_INTB = 1b
6 SDA	IO / Bidirectional	I2C serial data; requires bus pull-up in application

Footprint Cross-Check

TI DBV0006A land-pattern reference:

6 pads
Pad pitch: 0.95 mm
Pad size: 1.10 mm × 0.60 mm
Pad row center-to-center span: 2.60 mm
Body outline: about 2.75–3.05 mm length by 1.45–1.75 mm body width; overall lead span 2.60–3.00 mm

Current footprint payload:

6 pads, 3 per side.
Pad pitch: 0.95 mm from y positions -0.95, 0, +0.95 — matches TI.
Pad centers at x = ±1.25 mm, so row span is 2.50 mm — 0.10 mm narrower than TI example.
Pads are defined as size 0.6 mm × 1.2 mm with 90° rotation. Interpreted with rotation applied, the effective land is about 1.20 mm × 0.60 mm — 0.10 mm longer than TI’s 1.10 mm × 0.60 mm example.
The longer pad length and narrower row span approximately preserve the same outer toe extent as TI, but the inner pad edge extends about 0.10 mm further inward than the TI example.
Fab body outline is about 1.6 mm × 2.9 mm with a pin-1 chamfer, which is reasonable for DBV/SOT-23.

Footprint status: mostly compatible / likely manufacturable, but not datasheet-exact. If exact TI land-pattern fidelity is required, adjust pad row centers to ±1.30 mm and pad effective size to 1.10 mm × 0.60 mm.

Mismatches / Issues to Flag

Incorrect metadata classification: library search reports part_sub_type: Logic and logicFunction: AND; this device is a 3-axis Hall-effect magnetic sensor.
Pin metadata incomplete: all terminal Pin Type properties are Unspecified, and pin descriptions are missing.
Minor pin-name deviations: pin 3 GND_(TEST) differs from datasheet GND (TEST); pin 5 ~INT differs from datasheet INT.
Footprint not exact to TI land pattern: pitch and pad count are correct, but effective pad length is about 1.20 mm vs TI 1.10 mm, and row span is 2.50 mm vs TI 2.60 mm.
Datasheet URL was a distributor page: corrected to TI official datasheet URL.

Overall Assessment

The part is usable at a high level: MPN, manufacturer, package family, pin count, symbol pinout, and description are aligned with the TI TMAG5273A1QDBVR datasheet. The main cleanup items are metadata classification, terminal pin types/descriptions, and optionally making the footprint land pattern exactly match TI DBV0006A dimensions.

Scope
Sources
Datasheet URL
Current Part Metadata Reviewed
Key Datasheet Specs
Pinout Cross-Check
Symbol / Pin Metadata Findings
Footprint Cross-Check
Mismatches / Issues to Flag
Overall Assessment