Datasheet Part Review
Worked for 5 mins 34 sec
Created a project doc
Part Review - TLV9061SQDBVRQ1
Date: 2026-07-20 Official datasheet set on the part: https://www.ti.com/lit/ds/symlink/tlv9061-q1.pdf
I created a detailed project-file report with the datasheet-backed pinout, footprint comparison, key specs, and metadata gaps.
Thought for 1 min 25 sec
Done — I added the official TI datasheet URL to the part and created the detailed review in Part Review - TLV9061SQDBVRQ1.
Open items:
- Symbol pin numbers/types match the datasheet, but pin names/descriptions are missing.
- Part Type, clearer description, and explicit package metadata should be cleaned up.
- Footprint is compatible with DBV SOT-23-6; pad geometry is IPC-style and slightly different from TI’s example land pattern.
Suggested next steps:
- Populate pin names/descriptions from the datasheet.
- Update Part Type and description metadata.
- If needed, revise the footprint to exactly match TI’s example land pattern.
Fix metadata and check
Populate pin descriptions
Update part metadata
Match TI land pattern
Run final review
Refine this doc
Ask about this doc
Part Review - TLV9061SQDBVRQ1
Date: 2026-07-20
Source reviewed
- Official datasheet set on the part: https://www.ti.com/lit/ds/symlink/tlv9061-q1.pdf
- TI part page: https://www.ti.com/product/TLV9061-Q1/part-details/TLV9061SQDBVRQ1
- Datasheet family: TLV906xS-Q1 Automotive 10-MHz, RRIO, CMOS Operational Amplifiers, Rev. H.
Existing Flux part metadata
Table
| Field | Existing value | Datasheet / TI reference | Review |
|---|---|---|---|
| Manufacturer Part Number | TLV9061SQDBVRQ1 | TLV9061SQDBVRQ1 | Match |
| Manufacturer Name | Texas Instruments | Texas Instruments | Match |
| Datasheet URL | Previously blank; updated to official TI PDF | https://www.ti.com/lit/ds/symlink/tlv9061-q1.pdf | Fixed |
| Pin count | 6 terminals / pads | SOT-23 DBV, 6 pins | Match |
| Designator Prefix | U | IC / op amp | Match |
| Part Type | Blank | Operational Amplifier / Integrated Circuit | Missing metadata |
| Description | 1.45mm ANA IPC 7351B H Texas Instruments | Single automotive RRIO CMOS op amp with shutdown, 10-MHz GBW, 1.8-V to 5.5-V supply, SOT-23-6 | Weak / incomplete description |
| Package / Case property | Not explicitly set as a property | DBV, SOT-23-6, 1.45-mm max height | Missing metadata, but footprint asset indicates SOT-23-6 |
Datasheet pinout for TLV9061S-Q1 DBV SOT-23-6
Table
| Pin | Name | Type | Datasheet description |
|---|---|---|---|
| 1 | OUT | Output | Output |
| 2 | V- | Power / supply | Negative / lowest supply or ground for single-supply operation |
| 3 | IN+ | Input | Noninverting input |
| 4 | IN- | Input | Inverting input |
| 5 | SHDN | Input | Shutdown: low = amp disabled, high = amp enabled |
| 6 | V+ | Power / supply | Positive / highest supply |
Symbol cross-check
Table
| Pin | Existing symbol type | Expected | Review |
|---|---|---|---|
| 1 | Output | OUT, output | Match |
| 2 | Power In | V-, negative supply / ground | Match |
| 3 | Input | IN+, noninverting input | Match |
| 4 | Input | IN-, inverting input | Match |
| 5 | Input | SHDN, shutdown input | Match |
| 6 | Power In | V+, positive supply | Match |
Notes:
- The symbol appears logically arranged like an op-amp: inputs on the left, output on the right, supplies vertical.
- Pin numbers and electrical types are correct.
- Pin names / pin descriptions are not populated in the terminal properties. This is the main symbol metadata gap: the part can be used electrically, but the symbol is not self-documenting from the properties alone.
Footprint cross-check
Existing footprint asset:
SOT95P280X145-6N.kicad_mod.Table
| Feature | Existing footprint | Datasheet / TI package data | Review |
|---|---|---|---|
| Package family | SOT-23-6 style | DBV0006A SOT-23, 6 pins | Match |
| Pitch | 0.95 mm vertical pin pitch | 2 × 0.95 mm | Match |
| Pad count | 6 SMD pads | 6 pads | Match |
| Pad nominal size | 1.21 mm × 0.58 mm | TI example land pattern: 1.1 mm × 0.6 mm | Close; IPC 7351B land pattern differs slightly from TI example |
| Row spacing / land span | Pad centers at about ±1.255 mm, about 2.51 mm center-to-center | TI example board layout shows about 2.6 mm land-pattern span | Close |
| Body / fab outline | About 1.6 mm × 2.9 mm | Body B 1.45 mm to 1.75 mm, A 2.75 mm to 3.05 mm | Match |
| Height naming | ...X145... | 1.45 mm max height | Match |
| Pin-1 marker | Present | Pin 1 index required | Match |
| 3D model | TLV9061SQDBVRQ1.step present | SOT-23 DBV | Present; not dimensionally re-measured here |
Conclusion: footprint is compatible with the TI DBV0006A / SOT-23-6 package. The pad geometry is an IPC-7351B-style variant rather than an exact copy of TI's example land pattern, but the differences are small and typical for alternate land patterns.
Key electrical and package specs
Table
| Spec | Value |
|---|---|
| Function | Single automotive CMOS op amp with shutdown |
| Channels | 1 |
| Supply voltage, recommended | 1.8 V to 5.5 V |
| Absolute maximum supply | 6 V |
| Input/output | Rail-to-rail input and output |
| Gain-bandwidth product | 10 MHz typ |
| Slew rate | 6.5 V/us typ |
| Input offset voltage | ±0.3 mV typ, ±1.85 mV max at VS = 5 V; ±2 mV max over temperature |
| Input bias current | ±5 pA typ in electrical characteristics; feature list states 0.5 pA low input bias current |
| Quiescent current | 538 uA typ, 750 uA max at VS = 5.5 V; 800 uA max over -40°C to 125°C |
| Shutdown current | 0.5 uA typ, 1.5 uA max |
| Shutdown logic | High enables amplifier; low disables amplifier |
| Capacitive load drive | 100 pF |
| Operating temperature | -40°C to +125°C |
| Automotive qualification | AEC-Q100 grade 1; HBM level 3A, CDM level C6 |
| Package | DBV SOT-23-6, 1.45-mm max height |
| TI package drawing | DBV0006A, JEDEC MO-178 |
| Standard pack quantity | 3000 tape-and-reel |
Mismatches and gaps to flag
- Datasheet URL was missing; it has now been added to the part project as
Datasheet URL. Part Typeis blank. Recommended value:Operational Amplifier (OP-AMP)or equivalent IC category.- Description is not user-friendly and omits the functional identity and key specs.
- Pin names and pin descriptions are not populated on the symbol terminals, even though the pin numbers and electrical types are correct.
- Package / case is not explicitly recorded as a part property, though the footprint itself is named and shaped as SOT-23-6 DBV.
- Footprint pad dimensions differ slightly from TI's example board layout because the footprint appears to use an IPC-7351B land pattern. This is not a functional mismatch, but it is worth noting if exact TI land-pattern conformance is required.
Recommended cleanup
- Populate pin names and
Pin Descriptionfields:- 1 OUT: Output
- 2 V-: Negative supply or ground for single-supply operation
- 3 IN+: Noninverting input
- 4 IN-: Inverting input
- 5 SHDN: Shutdown input, low disables and high enables
- 6 V+: Positive supply
- Set
Part Typeto an op-amp category. - Update the description to:
Automotive single RRIO CMOS operational amplifier with shutdown, 10-MHz GBW, 1.8-V to 5.5-V supply, SOT-23-6 DBV. - Add explicit package metadata:
Package or Case Code = SOT-23-6 / DBVif the property model supports it for this part project.
Source reviewed
Existing Flux part metadata
Datasheet pinout for TLV9061S-Q1 DBV SOT-23-6
Symbol cross-check
Footprint cross-check
Key electrical and package specs
Mismatches and gaps to flag
Recommended cleanup
