Part Audit
Final Status
The TCPP02-M18 part has been corrected and independently reviewed against the official STMicroelectronics datasheet.
Corrected Metadata
- Part classification: Protection / Power Management IC rather than Connector.
- MPN: TCPP02-M18.
- Manufacturer: STMicroelectronics.
- Package: QFN-18L, 3.5 × 3.5 × 0.55 mm, 0.50 mm pitch, exposed GND pad.
- Official ST datasheet URL remains set.
- Project description now accurately identifies the USB Type-C source-port protection and interface function.
Corrected Terminals
All 18 perimeter leads plus the exposed pad exist exactly once and map one-to-one to the footprint. Every terminal now has a datasheet-based electrical type, functional description, Pin Group, Terminal Order, and orientation.
- Inputs: EN, SRC, VBUSC, ISENSE, I2C_ADD.
- Outputs: IANA, GATE, CBIAS, FLGN; FLGN is described as open-drain and active low.
- Bidirectional: CC1, CC2, CC1C, CC2C, SDA, SCL.
- Power input: VCC_VCONN.
- Grounds: GND_10, GND_14, and GND_EP.
- Exposed pad: clearly identified as GND_EP, physical mapping 19, with the description “Ground exposed pad (EP); must connect to ground.”
Flux normalizes terminal designators to uppercase, so datasheet mixed-case names such as VBUSc, Isense, CC1c, CC2c, and FLGn render as VBUSC, ISENSE, CC1C, CC2C, and FLGN. Their pin numbers, descriptions, electrical types, and pad mapping are correct.
Corrected Footprint
- 18 perimeter copper lands: 0.30 × 0.50 mm.
- Pitch: 0.50 mm.
- Side-pad centers: ±1.55 mm, producing the datasheet-recommended 3.60 mm overall land span.
- Exposed copper pad: 2.20 × 2.20 mm.
- EP solder paste: −0.25 mm expansion, producing a 1.70 × 1.70 mm aperture, approximately 60% of copper area.
- Pin numbering follows the datasheet counter-clockwise top-view sequence.
- The STEP model remains centered at the footprint origin with zero rotation and unit scale.
Paste Limitation
Flux does not currently support separate paste-only window apertures on this source footprint. The exposed pad therefore uses a single reduced 1.70 × 1.70 mm paste aperture rather than a segmented window pattern. This is a manufacturable paste reduction, but a stencil vendor may optionally segment the aperture during fabrication review.
Corrected Silkscreen
- Imported courtyard/silkscreen composite is disabled.
- Imported fabrication shape is disabled.
- Duplicate
IC** and value text are hidden.
- The only active markings are:
- A 0.30 mm pin-1 marker with 0.15 mm stroke.
- A 0.80 mm reference designator positioned 2.60 mm above the footprint center.
No courtyard rectangle, oversized centered text, duplicate value, or pad-overlapping silkscreen remains.
Verification Result
Independent review passed the classification, physical connection count, pad mapping, QFN numbering, copper geometry, exposed-pad treatment, and active silkscreen checks. The only noted limitation is uppercase normalization of mixed-case datasheet pin names and the platform’s inability to generate segmented paste-only EP windows.