Part Audit Review


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Checking TCPP02 M18 Correction progress…
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Reading TCPP02 M18 Correction's report…
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4/5 Independently verify pin mapping and footprint against the ST datasheet

Inspect the latest part metadata, terminal properties, and footprint state

Correct part classification and terminal names/types/descriptions

Correct pad geometry, exposed-pad paste, and silkscreen artwork

Independently verify pin mapping and footprint against the ST datasheet

Update the audit record with final corrected state

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TCPP02-M18 Review
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Corrected and independently verified:
  • Part classification, all terminal types/descriptions/groups, and GND_EP mapping.
  • ST-recommended 0.30 × 0.50 mm perimeter lands and 2.20 mm exposed pad.
  • Reduced EP paste aperture, clean pin-1 marker, external reference text, and removal of erroneous silk/courtyard artwork.
Flux normalizes mixed-case pin names to uppercase and cannot create segmented paste-only windows; a reduced 1.70 × 1.70 mm EP paste aperture is used instead. Final details are in Part Audit.
Improve EP stencil
Verify 3D package
Prepare release package
Review application circuit

CC1
Pin Number
2
CC2
Pin Number
4
EN
Pin Number
1
VCC_VCONN
Pin Number
3
Name
Pin #
Type
Section
Pin Group
Orientation
Order
Sub-symbol
EN
1
Input
Control
Left
1
CC1
2
Bi-Directional
USB-C Controller CC
Left
2
VCC_VCONN
3
Power In
Power
Left
3
CC2
4
Bi-Directional
USB-C Controller CC
Left
4
IANA
5
Output
Current Monitor
Left
5
GATE
6
Output
MOSFET Driver
Bottom
6
SRC
7
Input
MOSFET Driver
Bottom
7
VBUSC
8
Input
VBUS
Bottom
8
ISENSE
9
Input
Current Monitor
Bottom
9
GND_10
10
Ground
Ground
Right
10
CC2C
11
Bi-Directional
USB-C Connector CC
Right
11
CBIAS
12
Output
ESD Bias
Right
12
CC1C
13
Bi-Directional
USB-C Connector CC
Right
13
GND_14
14
Ground
Ground
Right
14
I2C_ADD
15
Input
I2C
Top
15
SDA
16
Bi-Directional
I2C
Top
16
SCL
17
Bi-Directional
I2C
Top
17
FLGN
18
Output
Fault
Top
18
GND_EP
19
Ground
Ground
Top
19

TCPP02-M18