I’ll audit the part metadata and existing assets, source the official datasheet if needed, update the Datasheet property, then compare symbol pins and footprint geometry against the manufacturer documentation.
The Datasheet property was not changed because a URL is already populated. The existing link is a distributor product page rather than the official manufacturer PDF.
Audit complete. The part is not safe to use as-is: the datasheet specifies pin 1 as RF feed, but the symbol/footprint maps FEED to pin 9; pad sizes also differ from Taoglas’s recommended land pattern. Metadata incorrectly classifies it as a logic AND IC.
The Datasheet property was already populated, so it was not changed, though it links to Arrow rather than the official Taoglas PDF. Full specifications and findings are in the Part Audit Report; I also filed an internal part-quality report.
The Datasheet property was not changed because a URL is already populated. The existing link is a distributor product page rather than the official manufacturer PDF.
Missing; should describe the 15 × 15 × 4 mm SMD ceramic patch package
Datasheet URL
Arrow product page
Populated, but non-authoritative
Datasheet key specifications
Table
Parameter
Datasheet value
Frequency bands
2400–2500 MHz; 4900–5500 MHz; 5500–5850 MHz
Impedance
50 Ω
Polarization
Linear
Peak gain
5.70 dBi; 5.29 dBi; 4.03 dBi across the three listed bands
Average gain
−3.15 dBi; −3.47 dBi; −3.70 dBi
Efficiency
48.45%; 44.95%; 42.64%
Maximum input power
10 W
Operating/storage temperature
−40 °C to +85 °C
Qualified reference ground plane
70 × 70 mm, antenna centered; other environments may require custom tuning
Pin cross-check
The manufacturer pin table defines:
Pin 1: RF FEED, 50 Ω
Pins 2–10: Ground
The datasheet text says “8 pins,” but immediately lists pins 1 through 10; this appears to be a manufacturer-document typo. The mechanical footprint and pin table clearly show ten terminals.
Current symbol/terminal mapping
Pin 9 is named FEED.
Pin 1 is named GND_1.
Pins 2–8 and 10 are ground-named.
Every terminal has Pin Type: Unspecified and lacks a useful functional pin description.
Critical mismatch: the RF feed is assigned to pin 9 instead of pin 1. This makes the symbol-to-footprint mapping electrically incorrect.
Footprint cross-check
Correct aspects
Ten copper pads are present.
Pad center pitch for the eight main pads uses the expected 5.5 mm grid.
Fabrication outline is 15 × 15 mm, matching the nominal antenna body.
A STEP model is attached.
Mismatches
Wrong feed pad number: footprint pad 9 is mapped to FEED, while the datasheet requires pad 1 to be RF FEED.
Wrong main-pad size: pads 1–8 are 4.0 × 4.0 mm; the manufacturer footprint specifies eight 3.0 × 3.0 mm pads.
Wrong small-pad size: pads 9–10 are 1.0 × 1.0 mm; the manufacturer footprint specifies two 0.8 × 0.8 mm pads.
Potential solder-mask/paste noncompliance: all pads currently use matching copper, paste, and mask apertures. The manufacturer PCB-layout figures should be followed exactly, including any stated clearance or optional-pad treatment.
Courtyard asymmetry: the current courtyard extends from −9.7 to +8.5 mm in X, which is not centered on the 15 mm body and is not identified in the datasheet as a required placement boundary.
Symbol assessment
The symbol exposes ten terminals, but the feed/ground assignment is wrong and terminal descriptions/types are not useful. Recommended terminal metadata:
Pins 2–10: GND, power/ground or passive as appropriate, “Antenna ground terminal”
3D model assessment
A STEP asset is present (SWDP.2458.15.4.A.02_Web.STEP) at zero offset, unit scale, and zero rotation. The available structured layout data does not expose measured model extents, so exact 15 × 15 × 4 mm dimensional alignment and pad registration could not be conclusively verified in this audit.
Overall disposition
Not safe to use as-is. The feed terminal is mapped to the wrong physical pad, and the land-pattern pad sizes differ materially from the manufacturer recommendation. Correct the symbol/terminal mapping and footprint before using this part in a PCB design. The classification metadata should also be changed from logic IC to RF antenna.
RF ANTENNA Wi-Fi Ceramic Patch Solder Surface Mount
Embedded ceramic patch antenna for dual-band IEEE 802.11 Wi-Fi applications, covering 2400–2500 MHz and 4900–5850 MHz with 50 Ω impedance, linear polarization, and 10 W input power. The SMD antenna measures 15 × 15 × 4 mm, weighs 3.5 g, and operates from −40°C to 85°C. #Antenna#WiFi#RF#SMD#DualBand