Part Audit Review
Thought for 6 sec
I’ll audit the part metadata, locate the official Taiwan Semiconductor datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin definitions against it.
Worked for 9 mins 5 sec
Created a project doc
Part Audit Report
Part Audit Report
Reviewed part
- MPN: SMAJ54CAH
- Manufacturer: Taiwan Semiconductor
- Function: Bidirectional automotive transient-voltage suppressor (TVS)
- Package: DO-214AC (SMA)
- Terminal count: 2
- Designator prefix: D
- Official datasheet source: https://services.taiwansemi.com/storage/resources/datasheet/SMAJH%20SERIES_A2102.pdf
- Qualification: AEC-Q101
The datasheet property was populated from the official Taiwan Semiconductor PDF. Flux currently exposes the stored/indexed datasheet as an internal cached PDF URL; the source used for the update is the official URL listed above.
Corrected or added:
- Manufacturer changed from TSMC to Taiwan Semiconductor.
Audit complete. I added the official datasheet, corrected manufacturer/package/classification metadata, and verified the two passive bidirectional terminals; detailed specifications and findings are in the Part Audit Report.
Open items: the footprint differs from Taiwan Semiconductor’s suggested land pattern, and the STEP model has unrelated internal provenance despite plausible SMA dimensions. Validate the footprint against your intended IPC-7351B density level before production.
Validate footprint and model
Fix footprint geometry
Replace 3D model
Run manufacturability review
Refine this doc
Ask about this doc
Part Audit Report
Reviewed part
- MPN: SMAJ54CAH
- Manufacturer: Taiwan Semiconductor
- Function: Bidirectional automotive transient-voltage suppressor (TVS)
- Package: DO-214AC (SMA)
- Terminal count: 2
- Designator prefix: D
- Official datasheet source: https://services.taiwansemi.com/storage/resources/datasheet/SMAJH%20SERIES_A2102.pdf
- Qualification: AEC-Q101
Key electrical specifications
Table
| Parameter | Datasheet value |
|---|---|
| Peak pulse power, 10/1000 µs | 400 W |
| Reverse stand-off voltage, VRWM | 54 V |
| Breakdown voltage, VBR at 1 mA | 60.0–66.3 V |
| Maximum leakage at VRWM | 1 µA |
| Peak pulse current, IPP | 4.6 A |
| Maximum clamping voltage, VC | 87.1 V |
| Junction temperature | −55 to +150 °C |
| Storage temperature | −55 to +150 °C |
| Polarity | Bidirectional; characteristics apply in both directions |
Metadata review and updates
The datasheet property was populated from the official Taiwan Semiconductor PDF. Flux currently exposes the stored/indexed datasheet as an internal cached PDF URL; the source used for the update is the official URL listed above.
Corrected or added:
- Manufacturer changed from TSMC to Taiwan Semiconductor.
- Part Type changed from TVS Diodes to Protection.
- Package/case added as DO-214AC (SMA).
- Compliance added as AEC-Q101.
- Operating temperature added as −55 to +150 °C.
- Project description updated with the device function and principal ratings.
Schematic symbol and pins
Table
| Pin | Current type | Current description | Result |
|---|---|---|---|
| 1 | Passive | Bidirectional TVS terminal; electrically equivalent to terminal 2; no cathode polarity requirement | Match |
| 2 | Passive | Bidirectional TVS terminal; electrically equivalent to terminal 1; no cathode polarity requirement | Match |
The two-terminal, non-polar symbol intent is correct for the CAH bidirectional variant. Pin numbering is consistent with the two footprint pads. Passive pin types are appropriate.
Footprint review
Datasheet package envelope
- Case: DO-214AC (SMA)
- Body/lead dimensions include:
- Package length E: 4.95–5.33 mm
- Body length E1: 4.06–4.60 mm
- Body width D: 2.29–2.83 mm
- Height A: 1.99–2.50 mm
- Terminal width b: 1.27–1.58 mm
- Terminal length L: 0.90–1.41 mm
Current footprint
- Asset:
DIOM4325X250N.kicad_mod - Pads: 2.12 × 1.50 mm
- Pad centers: ±2.115 mm, giving 4.23 mm center-to-center spacing
- Courtyard: approximately 6.85 × 3.06 mm
Mismatch / risk
The current land pattern is not an exact match to the manufacturer suggested pad layout. The datasheet indicates approximately 2.41 × 1.52 mm pads and a 5.45 mm overall land-pattern dimension. The current pads are about 0.29 mm shorter and are spaced differently. The footprint remains mechanically plausible for the package envelope, so it was not changed without a clearer interpretation or solder-joint requirement. This should be treated as a moderate footprint-validation item before production; compare the manufacturer drawing directly with the intended IPC-7351B density level and assembly process.
The layout inspection reports dimensions numerically in metres while labeling the unit as millimetres (for example, 0.00212 corresponding to 2.12 mm). The footprint source itself contains the expected millimetre values; this appears to be a display/unit-conversion issue rather than a 1000× undersized footprint.
3D model review
The attached model is named
SMAJ54CAH.step, but its internal STEP identity references P4SMA100C.STEP. Its approximate geometry is consistent with a generic SMA/DO-214AC molded diode, but it is not identity-specific evidence for SMAJ54CAH. No clear dimensional incompatibility was found, so the model was retained.Final mismatch summary
- Footprint differs from the manufacturer suggested land pattern — validate before manufacturing; no automatic geometry change was made.
- 3D model has a different internal source identity — geometry appears package-compatible, but provenance is uncertain.
- Datasheet property is surfaced as a Flux-cached PDF URL — the authoritative source used is the official Taiwan Semiconductor URL documented above.
- No symbol or pin-function mismatch remains — two passive, equivalent bidirectional terminals are correct.
Reviewed part
Key electrical specifications
Metadata review and updates
Schematic symbol and pins
Footprint review
Datasheet package envelope
Current footprint
Mismatch / risk
3D model review
Final mismatch summary
