I’ll audit the part metadata, source the official JST datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against it.
The official JST SHL-series datasheet is confirmed. I’m applying the datasheet URL now and completing the dimensional/pin audit against the current symbol and footprint.
Audit complete. The Datasheet URL now points to the official JST SHL datasheet; MPN, manufacturer, 10-contact/12-pad structure, 1.0 mm pitch, mounting tabs, body dimensions, and pin-1 orientation are consistent.
Critical mismatch: signal pads 1–10 are 0.60 × 1.25 mm, while JST recommends 0.60 × 1.70 mm.
Symbol gaps: all pins are Unspecified; pin descriptions and grouping metadata are absent.
Metadata gaps: package, structured pitch/position/row fields, connector type/gender, and electrical ratings are missing, although many appear in the description.
The description incorrectly tags it as board-to-board; JST classifies SHL as wire-to-board.
I filed an internal part-quality report for the undersized signal pads. No geometry was changed.
Documents are markdown text files which describe project goals, capture details, or even simulation outputs.
Assets
SM10B-SHLS-TF-thumb.png
SM10B-SHLS-TF-thumbThumbnail
SM10B-SHLS-TF__LF__SN_
SM10BSHLSTFLFSN.kicad_modFootprint
SM10B-SHLS-TF
1.0 mm Pitch Right-Angle SMT Board Header – 10-position shrouded wire-to-board header designed for consumer electronics, industrial equipment, IoT devices, portable electronics, embedded controllers, and compact PCB interconnect applications. Part of the JST SHL Series, it features a 1.00 mm pitch, single-row, right-angle surface-mount (SMT) configuration, and 1 A current rating with a 50 V voltage rating. Constructed with phosphor bronze contacts and tin-plated mating and termination surfaces, it provides reliable electrical performance and easy solderability. The connector includes four-wall shrouding, solder retention tabs for enhanced mechanical stability, and a UL94 V-0 rated polyamide (nylon) housing. Designed for operation over a −25°C to +85°C temperature range, it is supplied in tape-and-reel packaging for automated SMT assembly.