Part Datasheet Audit
Thought for 5 sec
I’ll audit the part metadata, find and attach the official datasheet if missing, then compare symbol pins, footprint, and descriptions against the datasheet and summarize any discrepancies.
Worked for 2 mins 26 sec
The part already has a datasheet attached; I also confirmed the official Renesas datasheet page. I’m now checking all 289 terminals and the BGA footprint against the Renesas pin table/package dimensions.
Worked for 6 mins 17 sec
Completed the part audit and updated R7KA8T2LFLCAC#UC0 Part Review. The datasheet was already set, metadata is mostly correct, and the schematic has the correct 289-ball pin mapping, but I flagged a critical footprint unit-scaling defect: pads are 1000× too small, making the footprint non-manufacturable as-is.
Open items:
- Footprint needs reimport/rescale to true 0.65 mm pitch and ~0.338 mm pad scale.
- Terminal metadata needs enrichment: pin descriptions, groups/sections, and electrical pin types.
- I filed an internal part-quality report for the footprint issue.
Suggested next steps:
- Fix/regenerate the BGA footprint geometry.
- Populate terminal descriptions and pin types from the Renesas pin table.
- Re-run the part QA audit after corrections.
Fix footprint and metadata
Fix BGA footprint
Populate pin metadata
Rerun QA audit
Export review report
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R7KA8T2LFLCAC#UC0 Part Review
Review date: 2026-07-20
Sources
- Project part:
R7KA8T2LFLCAC#UC0 - Existing Datasheet URL property:
https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/459721c752819fb14b72f2635a45360e92a9ad146ff9ba25eb38c5e27743be1b.pdf - Official Renesas datasheet page found by web search:
https://www.renesas.com/en/document/dst/ra8t2-group-datasheet - Datasheet used for cross-check: Renesas RA8T2 Group Datasheet, document R01DS0436EJ0130 Rev.1.30, dated Feb 27, 2026.
The project already had a Datasheet URL set and the datasheet was queryable from the part project, so I did not modify the Datasheet URL property. The official Renesas page above matches the attached/uploaded datasheet content used for this audit.
Current project metadata observed
Table
| Field | Current project value | Datasheet / expected value | Status |
|---|---|---|---|
| Manufacturer Part Number | R7KA8T2LFLCAC#UC0 | R7KA8T2LFLCAC#UC0; base product R7KA8T2LFLCAC | OK |
| Manufacturer Name | Renesas | Renesas Electronics | OK |
| Part Type | Microcontroller | Microcontroller / RA8T2 MCU | OK |
| Package or Case Code | 289-LFBGA | PLBG0289JA-A; JEITA P-LFBGA289-12x12-0.65; LFBGA-289 | OK; could be made more explicit with Renesas/JEITA codes |
| Designator Prefix | IC | IC/U-style prefix appropriate for MCU | OK |
| Datasheet URL | Uploaded Renesas RA8T2 datasheet PDF | Official Renesas RA8T2 Group Datasheet | OK; official page also identified above |
| Machine Datasheet URL | Not found in indexed project properties | Optional if Datasheet URL works | Informational |
| Description | Project description identifies Renesas RA8T2 dual-core Cortex-M85/M33 MCU with 1 MB MRAM / 2 MB SRAM, EtherCAT, LFBGA-289, 0 to 95 °C junction | Matches datasheet for this L temperature-code variant | OK |
| Pin / pad count | 289 schematic terminals; 289 footprint pads | 289 balls | OK |
Key datasheet specs
Table
| Spec | Datasheet value |
|---|---|
| Family | Renesas RA8T2 Group |
| Exact product | R7KA8T2LFLCAC / orderable R7KA8T2LFLCAC#UC0 |
| CPU | Arm Cortex-M85 up to 1 GHz + Arm Cortex-M33 up to 250 MHz for this dual-core feature set |
| Feature set | L: dual core, EtherCAT slave controller available |
| Memory | 1 MB Code MRAM; 2 MB SRAM; no Flash for standard F MRAM product |
| Connectivity highlights | Layer 3 Ethernet Switch Module, Gigabit Ethernet, EtherCAT slave controllers, USB 2.0 FS, CAN FD, I3C, Octal SPI, SDHI/MMC, serial interfaces, timers, ADC/DAC/comparators |
| Package | 289-pin BGA; Renesas code PLBG0289JA-A |
| JEITA package code | P-LFBGA289-12x12-0.65 |
| Body size | 12.00 mm × 12.00 mm nominal |
| Ball array span | D1/E1 = 10.40 mm nominal |
| Pitch | 0.65 mm nominal |
Ball diameter b | 0.31 mm min / 0.36 mm nom / 0.41 mm max |
| Mass | 0.38 g typical |
Operating junction temperature for L code | 0 °C to 95 °C |
| Recommended VCC/VCC_DCDC | 1.62 to 3.63 V generally; 2.70 to 3.60 V when EtherCAT ESC is used; 2.30 to 3.63 V when ESWM is used; 3.00 to 3.63 V when SDRAM is used |
| Recommended VCC_USB | 1.62 to 3.63 V when USB is not used; 3.00 to 3.60 V when USB is used |
| Recommended VBATT | 1.62 to 3.63 V |
| Recommended AVCC0 | 1.62 to 3.63 V generally; 2.70 to 3.63 V when channel dedicated sample-and-hold circuit is used |
| Absolute max VCC/VCC_DCDC | -0.3 to +4.0 V |
| Absolute max VCC_USB / AVCC0 / VBATT | -0.3 to +4.0 V |
| 5 V tolerant ports noted by datasheet | P204, P205, P303, P407-P413, P511, P512, P514, P515, P708-P715 |
Schematic symbol cross-check
Table
| Check | Result |
|---|---|
| Terminal count | 289 terminal components; matches BGA289 ball count |
| Pin-number coverage | BGA rows A, B, C, D, E, F, G, H, J, K, L, M, N, P, R, T, U and columns 1-17 are represented, matching the 17 × 17 BGA scheme without I/O/Q/S row letters |
| Ball-map check | The observed terminal-to-ball mapping matches datasheet Figure 1.3 across the inspected pin table; no mismatched ball coordinate/designator was found in the 289-terminal sweep |
| Sample mappings | A1=P609, A2=P113, A17=P207, D5=RES, E6=P201/MD, C6=P210/TMS/SWDIO, D6=P211/TCK/SWCLK, E7=P209/TDO, K16=P213/XTAL, K17=P212/EXTAL, L16=P214/XCOUT, L17=P215/XCIN/EXCIN, T16=P815/USB_DM, T17=VSS_USB, U16=P814/USB_DP, U17=VCC_USB all match the datasheet |
| Pin descriptions | Terminal properties currently do not expose Pin Description entries |
| Pin grouping / sections | Terminal properties currently do not expose Pin Group or Section entries |
| Pin electrical types | All sampled/current terminals show Pin Type: Unspecified, including power, ground, reset, clock, debug, USB, and analog/reference pins |
The schematic symbol is therefore correct in count and ball mapping, but weak in metadata: it lacks the functional descriptions, group/section labels, and electrical pin typing that would make the 289-ball MCU easier to review and more useful for ERC.
Footprint cross-check
Table
| Check | Current project footprint | Datasheet / expected value | Status |
|---|---|---|---|
| Footprint asset | BGA289C65P17X17_1200X1200X138.kicad_mod | Name encodes BGA289, 0.65 mm pitch, 17 × 17, 12 × 12 mm body, 1.38 mm max height | Nominally correct asset identity |
| Pad count | 289 pads | 289 balls | OK |
| Pad layer/shape | Top circular SMD pads | BGA lands expected on top copper | Concept OK |
| Adjacent pad pitch | P609/A1 x=-0.0052 mm and P113/A2 x=-0.00455 mm, delta = 0.00065 mm | 0.65 mm | Critical mismatch: 1000× too small |
| Array half-span | A1 at x=-0.0052 mm to A17/P207 at x=+0.0052 mm, span = 0.0104 mm | D1/E1 ball-array span = 10.40 mm | Critical mismatch: 1000× too small |
| Pad diameter/size | Computed pad size = 0.000338 mm | Ball diameter b = 0.31/0.36/0.41 mm; land pattern should be in this scale | Critical mismatch: 1000× too small |
| Silkscreen/fab SVG values | SVG outline uses coordinates like ±0.006 and ±0.007 with computed unit mm | Body outline should be about 12 mm × 12 mm, with silkscreen/courtyard in similar mm scale | Appears affected by same unit scaling |
| 3D model asset | R7KA8T2LFLCAC#UC0.stp present | 12 × 12 mm LFBGA model expected | Not fully dimension-verified in this audit |
The footprint topology and asset naming match the Renesas package, but the computed geometry is numerically 1000× too small. This looks like a CAD unit conversion/import defect, not a wrong package selection. The layout footprint is not manufacturable until the pad array and outline geometry are regenerated or rescaled correctly.
Mismatches / issues flagged
- Critical / blocking: footprint unit scaling defect. The BGA pad array and outline values are interpreted in millimeters while their numeric values are 1000× too small. Adjacent balls show 0.00065 mm pitch instead of 0.65 mm, and pad size is 0.000338 mm instead of approximately 0.338 mm.
- Medium: pin electrical types are unspecified. All terminals inspected show
Pin Type: Unspecified, including power/ground/special-function pins. This limits ERC and downstream schematic validation. - Medium: terminal descriptions and functional grouping are missing. No
Pin Description,Pin Group, orSectionproperties are exposed on the current terminal components. This does not prove a pinout error, but it reduces reviewability for a complex MCU. - Informational: package metadata could be more explicit.
289-LFBGAis broadly correct, but adding or retainingPLBG0289JA-A/P-LFBGA289-12x12-0.65in a property or description would make the package identity unambiguous.
Recommended next actions
- Reimport or rescale the BGA footprint geometry by 1000× so pitch = 0.65 mm, array span = 10.40 mm, and pad size is in the ~0.3 mm class.
- Populate terminal metadata from datasheet Table 1.15: Pin Description, broad Pin Group, Section, and suitable Pin Type for every terminal.
- Preserve the current positive metadata: MPN, Renesas manufacturer, Microcontroller part type, 289-LFBGA package, and existing Datasheet URL.
- Re-run a part QA pass after footprint geometry and terminal metadata are corrected.
Sources
Current project metadata observed
Key datasheet specs
Schematic symbol cross-check
Footprint cross-check
Mismatches / issues flagged
Recommended next actions
