Part Audit Review
Thought for 12 sec
I’ll audit the part metadata, source the official Samtec datasheet if needed, verify the symbol/pin mapping and 88-pad footprint against it, then report and flag any discrepancies.
Worked for 5 mins 54 sec
The official-document and geometry cross-check is still running; I’m waiting for the full pin and footprint comparison before finalizing the audit.
Worked for 1 min 55 sec
Audit complete. The Datasheet property was already populated, so it was not changed.
- Critical footprint mismatch: signal pads are 0.28 × 2.27 mm instead of Samtec’s recommended 0.28 × 0.43 mm; row spacing is 5.74 mm instead of 4.70 mm.
- Metadata issues: package code
TOis incorrect; mount/type classifications are weak. - Symbol issues: all 88 terminals exist and map correctly, but lack pin types, descriptions, pair/bank grouping, and ground-plane identification.
- Verified: 80 signals, 8 ground-plane tails, 2 alignment holes, 0.50 mm pitch, and correct overall body envelope.
Full evidence and official Samtec sources are in the Comprehensive Part Audit. I also filed a part-quality report with the Flux engineering team.
Fix footprint and symbol
Fix footprint issues
Improve symbol metadata
Update metadata fields
Recheck after fixes
Refine this doc
Ask about this doc
QSH-040-01-F-D-DP-A-K-TR Comprehensive Part Audit
Audit date: 2026-07-27
Status
- Metadata audit — completed
- Datasheet-property action — unattempted by design: the
Datasheet URLproperty was already populated, so the instruction to update it only if missing did not apply. No part metadata, symbol, or footprint geometry was changed. - Schematic symbol audit — completed
- PCB footprint audit — completed
Authoritative sources
- Samtec exact-MPN product page: https://www.samtec.com/products/qsh-040-01-f-d-dp-a-k-tr
- Samtec QSH-DP product drawing: https://suddendocs.samtec.com/prints/qsh-xxx-xx-x-d-dp-xxx-x-xx-mkt.pdf
- Samtec QSH-DP recommended PCB/stencil layout: https://suddendocs.samtec.com/prints/qsh-xxx-01-x-d-dp-xx-footprint.pdf
- Samtec QSH catalog page: https://suddendocs.samtec.com/catalog_english/qsh.pdf
- Samtec QSH/QTH product specification: https://suddendocs.samtec.com/productspecs/qsh-qth.pdf
Verified manufacturer specifications
The exact MPN is a Samtec QSH-DP 0.50 mm-pitch high-speed ground-plane SMT receptacle/socket connector. Ordering code:
QSH socket series; 040 = 40 positions per row / 40 differential pairs total; 01 lead style; F = gold flash in contact area with matte-tin tail; D-DP = double-row differential-pair version; A = alignment pins; K = polyimide pick-and-place pad; TR = tape-and-reel.Key documented specs include 80 signal contacts (40 per row), 0.50 mm signal pitch, two 20-pair banks, black LCP insulator, phosphor-bronze contacts and ground plane, -55 °C to +125 °C, 2 A per signal contact under Samtec's stated test condition, 25 A per ground plane under the stated test condition, 175 VAC / 247 VDC, and up to 100 mating cycles. The exact product page describes 40 pair, 2 row, 5–30 mm mating heights, A alignment pins, K pick-and-place pad, and tape-and-reel packaging.
Metadata audit
Matches
- Project/part name and Manufacturer Part Number exactly match
QSH-040-01-F-D-DP-A-K-TR. - Manufacturer Name = Samtec is correct.
- Designator Prefix = J is suitable for a connector.
- Description correctly identifies the QSH high-speed differential-pair board-to-board socket family, 0.50 mm pitch, two signal rows, 80 signal contacts, ground-plane construction, alignment pins, LCP, phosphor bronze, operating temperature, and tape-and-reel packaging.
Datasheet URLis populated and resolves to an uploaded PDF asset:https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/96b3b968273362a2bae35b4f572128cc6d8cef6151f8e81b0417613bf5aa0ce9.pdf.
Mismatches / weak metadata
- Package or Case Code =
TOis incorrect.TOconventionally denotes a transistor-outline package and does not describe this 0.50 mm SMT mezzanine connector. Samtec identifies it as a QSH-DP surface-mount receptacle/socket strip. - Mount =
Socketdescribes connector gender/style, not PCB mounting technology. The documented PCB mounting method is SMT/surface mount. A separate connector-gender field would be preferable, but no metadata was changed because the task permitted only a missing Datasheet update. - Part Type =
Connectorsis broadly correct, but the library-derived subtype seen during audit wasRF / Coaxial Connectors, which is not appropriate for this board-to-board mezzanine connector. - Useful structured connector fields are absent: connector pitch, rows, signal positions/pairs, connector gender, and explicit SMT mount classification.
- The existing Datasheet URL is not the direct authoritative Samtec URL. Because it was not missing, it was deliberately left unchanged per the user's mutation constraint. The authoritative product drawing is source 2 above.
Schematic symbol audit
Matches
- The symbol has 88 terminals, matching the footprint's 80 numbered signal pads plus 8 solderable ground-plane tail pads (
MP1–MP8). - Signal terminal numbers
1through80exist exactly once. - Ground-plane-tail terminals
MP1throughMP8exist exactly once and map to the identically numbered footprint pads. - The two NPTH alignment holes (
MH1,MH2) are correctly absent from the electrical symbol. - The generated symbol places terminals 1–44 on one side and 45–80 plus MP1–MP8 on the other; all physical terminals are present once.
Mismatches / deficiencies
- Every terminal's Pin Type is
Unspecified. For a passive connector, signal contacts should normally be passive/bidirectional connector pins, while MP ground-plane tails should be identified as ground/passive shield contacts. - Terminals have no pin names beyond their designator/number and no Pin Description. The 80 signal terminals are therefore not identified by row/bank/pair context, and MP1–MP8 are not described as ground-plane solder tails.
- There is no Pin Group, Section, Functional Group, Pin Role, Bus Type, differential-pair pairing, or electrical grouping metadata. Consequently, the symbol does not encode the documented two banks, signal rows, differential pairs, or ground-plane group.
- The symbol uses a single sequential
1–80scheme. The footprint uses the same scheme and is internally consistent; however, Samtec's drawing primarily indicates row-start identifiers01and02and physical row/bank geometry rather than supplying semantic signal names. The lack of row/pair descriptions makes orientation and pair interpretation unnecessarily ambiguous to users.
PCB footprint audit
Matches
- Total pad objects = 90: 80 numbered signal SMT pads, 8 ground-plane SMT pads (
MP1–MP8), and 2 NPTH alignment holes (MH1,MH2). Electrical terminal/pad mapping is therefore 88 of 88, with two intentionally non-electrical holes. - Signal numbering
1–80is unique and alternates between the two physical rows. - Along-row signal pitch is 0.50 mm.
- The footprint contains two banks separated on a 20.00 mm bank pitch, consistent with
040/ two 20-pair banks. - Signal pad width is 0.28 mm, matching Samtec's
.0110 in [0.28 mm]recommendation. - Eight ground-plane solder pads are present. Their 0.43 mm narrow dimension and 2.54 mm / 4.70 mm long dimensions correspond to the recommended central ground-plane land features, and their repeated locations are consistent with the banked layout.
- Two 1.02 mm NPTH alignment holes are present for the
-Aoption. Their center spacing is 40.136 mm, matching the Samtec formula for040; their Y offset is 2.67 mm. - Fabrication outline is 41.276 mm × 7.24 mm, matching the product drawing's reference body envelope for
040. - Pads are top-side SMT copper/paste/mask, while alignment holes are NPTH through holes. A STEP model is attached.
Critical footprint mismatches
- Signal pad length is wrong: current signal pads are
0.28 mm × 2.27 mm; Samtec's recommended PCB layout specifies approximately 0.28 mm × 0.43 mm signal lands. The footprint appears to have mistaken the drawing's 2.27 mm location/reference dimension for pad length. - Signal row spacing is wrong: current signal rows are centered at Y = ±2.87 mm, giving 5.74 mm row-to-row spacing. Samtec's recommended PCB layout calls out 4.70 mm row-to-row spacing (approximately Y = ±2.35 mm about center).
- Because of items 1 and 2, the signal lands extend much farther toward the connector center and outside than the official land pattern. This is a major solderability/fit discrepancy even though count, numbering, pitch, and body outline look plausible.
- The footprint's courtyard is approximately 44.538 mm × 10.01 mm, but the Samtec footprint drawing does not publish an explicit courtyard clearance; this cannot be directly certified against the manufacturer drawing.
- The silkscreen includes many zero-length/duplicated line primitives. These do not affect electrical mapping, but they are low-quality/non-informative geometry.
Conclusion
The part identity and the broad description are correct, and the footprint correctly represents 80 signal contacts, eight ground-plane solder tails, two alignment holes, 0.50 mm along-row pitch, two banks, and the overall connector envelope. However, the symbol lacks names, descriptions, electrical types, pair/bank grouping, and ground-plane grouping. Most importantly, the footprint's signal-pad length (2.27 mm vs 0.43 mm) and row spacing (5.74 mm vs 4.70 mm) do not match Samtec's recommended PCB layout. Per instruction, no symbol or footprint geometry was altered.
Status
Authoritative sources
Verified manufacturer specifications
Metadata audit
Matches
Mismatches / weak metadata
Schematic symbol audit
Matches
Mismatches / deficiencies
PCB footprint audit
Matches
Critical footprint mismatches
Conclusion
