Part Datasheet Audit


Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, source the official datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against it.
Audit complete. Added the official NXP datasheet, verified all 17 terminals, and corrected the symbol pin names/types/descriptions and HLQFN16/SOT1688-3 footprint geometry.
  • Key specs: dual-axis XY medium-g accelerometer, ±15.5 g to ±150 g, SPI/DSI3 interfaces, −40°C to +125°C, 4 × 4 × 1.45 mm wettable-flank package, 0.8 mm pitch.
  • Corrected mismatches: pins 11, 12, 14, and 17; functional pin grouping; oversized/offset footprint lands.
  • Open item: copper geometry is verified, but solder-paste apertures should be optimized for the assembler’s stencil process. The imported footprint filename still misleadingly references a 5.15 mm outline.
Fix paste and verify
Optimize paste apertures
Rename footprint asset
Run final review
Export verified part

Name
Pin #
Type
Part Type
Pin Description
Pin Group
VCC_1
1
Power In
Terminal
Supply; NXP recommends connection to VCC, but this pin may optionally be left unterminated.
Power
PCM1/ARM1
2
Output
Terminal
Multiplexed channel 1 PCM digital output or configurable channel 1 arming output.
Sensor Outputs
TEST0
3
Passive
Terminal
Test pin; leave unterminated as recommended, or optionally tie to VSS.
Test
TEST1
4
Passive
Terminal
Test pin; leave unterminated as recommended, or optionally tie to VSS.
Test
TEST2
5
Passive
Terminal
Test pin; leave unterminated as recommended, or optionally tie to VSS.
Test
TEST3
6
Passive
Terminal
Test pin; leave unterminated as recommended, or optionally tie to VSS.
Test
VSS
7
Ground
Terminal
Supply return node.
Ground
SS_B
8
Input
Terminal
SPI slave-select input with internal pull-up; in I2C mode pull up externally to VBUF.
Serial Interface
SCLK/SCL
9
Input
Terminal
SPI serial-clock or I2C serial-clock input; I2C mode requires an external pull-up to VBUF.
Serial Interface
MOSI
10
Input
Terminal
SPI serial-data input with internal pull-down; leave unterminated or optionally tie to VSS in I2C mode.
Serial Interface
MISO/SDA
11
Bi-Directional
Terminal
SPI serial-data output or I2C serial-data input/output; I2C mode requires an external pull-up to VBUF.
Serial Interface
PCM0/ARM0
12
Output
Terminal
Multiplexed channel 0 PCM digital output or configurable channel 0 arming output.
Sensor Outputs
VCC_2
13
Power In
Terminal
Device supply; connect an external capacitor between this pin and VSS.
Power
VSS_2
14
Ground
Terminal
Supply return node.
Ground
VCC_4
15
Power In
Terminal
Device supply; connect an external capacitor between this pin and VSS.
Power
VCC_5
16
Power In
Terminal
Device supply; connect an external capacitor between this pin and VSS.
Power
PAD
17
Ground
Terminal
Exposed die-attach pad; must be connected to VSS.
Ground

NXLS95322AESR2