The part was checked against the official Texas Instruments TMAG5231 Low-Power, Hall Effect Switch, Rev. D (SLYS042D) datasheet. The live project initially had no usable datasheet_url; the official URL was set to:
Average supply current for D version at 3 V: 2 µA typical, 3 µA maximum
Sampling rate: 20 Hz typical (13–29 Hz)
Typical operate threshold: ±3 mT
Typical release point: ±2.2 mT at 25°C
Typical magnetic hysteresis: ±0.8 mT
Operating temperature: −40°C to +125°C
Package: DBZ, 3-pin SOT-23, 1.12 mm maximum height
Nominal body: 2.92 mm × 1.30 mm
Tape-and-reel quantity: 3000
Symbol and pin audit
Table
Pin
Symbol name
Symbol type
Datasheet function
Result
1
VCC
Power In
1.65–5.5 V supply; connect at least 0.1 µF ceramic to GND
Number/name correct; description missing
2
OUT
Output
Omnipolar output responding to north and south poles
Correct; description missing
3
GND
Power In
Ground reference
Number/name correct; description missing; Ground type would be clearer
The schematic symbol contains exactly three terminals and the pin mapping matches the DBZ top-view pinout.
Footprint audit
Footprint source: SOT95P237X112-3N.kicad_mod
Table
Feature
Effective footprint
TI recommended land pattern
Result
Pad count
3
3
Correct
Pad size
1.24 × 0.59 mm
1.30 × 0.60 mm
Slightly undersized by 0.06 × 0.01 mm
Two-pin-side pitch
0.95 mm
0.95 mm
Correct
Two-pin center separation
1.90 mm
1.90 mm
Correct
Opposing-side center span
2.11 mm
2.10 mm
+0.01 mm, negligible
Fab body
2.92 × 1.30 mm
Nominal 2.92 × 1.30 mm
Correct
Solder paste
Present, nominally 1:1
Stencil example matches pad geometry
Acceptable
Solder mask
+0.102 mm expansion
TI example shows 0.07 mm clearance
Larger than TI example; verify against fab capability
Pad mapping is correct: pad 1 VCC, pad 2 OUT, pad 3 GND. The footprint is broadly compatible with DBZ0003A but does not exactly reproduce TI’s recommended pad and mask dimensions.
Description/property mismatches
Package case code is SOT-23-5, but this device is a 3-pin SOT-23, TI DBZ package.
The description says “±0.8 mT typical release point.” This is incorrect: ±0.8 mT is the typical hysteresis; the typical release point is ±2.2 mT at 25°C.
Pin descriptions are absent for all three terminals.
GND is electrically typed Power In rather than Ground.
Footprint pads are slightly smaller than TI’s example land pattern, and mask expansion is larger.
Overall assessment
The pinout, pin count, nominal package body, pitch, and functional identity are correct. The part is usable with caution, but the package metadata and description should be corrected, and the footprint dimensions should be reviewed against the intended assembly process before production.
Result
Part metadata
Variant key specifications
Symbol and pin audit
Footprint audit
Description/property mismatches
Overall assessment
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