LIS2DU12 Part Review

Thought for 16 sec

I’ll verify the current part metadata, locate and query the official ST datasheet, compare every symbol pin and footprint pad/land-pattern dimension, correct the datasheet property, then record the audit and any mismatches.

Thought for 4 mins 41 sec

flux

The official ST source is identified. The 12 pin numbers/names match the datasheet, while the stored manufacturer, datasheet link, description ODR range, and symbol electrical metadata need correction or qualification; I’m applying the metadata fixes and documenting the footprint comparison now.

Worked for 3 mins 6 sec

Created a project doc

Part Audit

View Document

Part Audit Scope

Review of LIS2DU12TR project metadata, schematic symbol, PCB footprint, and available 3D-model metadata against STMicroelectronics LIS2DU12 datasheet DS12422 Rev. 7 (May 2025).

Official product page: https://www.st.com/en/mems-and-sensors/lis2du12.html
Official datasheet URL stored on the part: https://www.st.com/resource/en/datasheet/lis2du12.pdf
Evidence note: the official PDF URL was identified and stored, but the datasheet evidence service could not serve citation handles for this file. Detailed extraction was checked through a readable mirror of ST's DS12422 Rev. 7. Values below should be revalidated if ST publishes a newer revision.

Part information Key specifications

Supply: VDD 1.62 to 3.6 V; independent VDD_IO supply.

flux

Reviewed the LIS2DU12TR metadata, all 12 symbol pins, footprint geometry, and model metadata. I updated the manufacturer to STMicroelectronics, set the official ST datasheet URL, added the LGA-12L package, and corrected the description to 1.6–800 Hz ODR.

Flagged issues

All symbol electrical pin types are unspecified and pin descriptions are missing.
Footprint is incorrectly tagged through_hole despite using SMD pads.
Exact mask/paste compliance still needs validation against ST TN0018.
Pin-1 visibility and STEP-model alignment should be visually confirmed.

Full results: Part Audit.

Files

Pins

Symbol

Layout

3D View

Part Audit

Scope

Review of LIS2DU12TR project metadata, schematic symbol, PCB footprint, and available 3D-model metadata against STMicroelectronics LIS2DU12 datasheet DS12422 Rev. 7 (May 2025).

Official product page: https://www.st.com/en/mems-and-sensors/lis2du12.html
Official datasheet URL stored on the part: https://www.st.com/resource/en/datasheet/lis2du12.pdf
Evidence note: the official PDF URL was identified and stored, but the datasheet evidence service could not serve citation handles for this file. Detailed extraction was checked through a readable mirror of ST's DS12422 Rev. 7. Values below should be revalidated if ST publishes a newer revision.

Part information

Table

Field	Reviewed value	Status
Manufacturer part number	LIS2DU12TR	Match
Manufacturer	STMicroelectronics	Corrected; previously incorrectly set to `LIS2DU12TR`
Part type	Sensor	Acceptable
Function	Ultralow-power 3-axis digital accelerometer with antialiasing and motion detection	Match
Package	LGA-12L, 2.0 x 2.0 x 0.74 mm max	Match; package property added
Pin count	12	Match
Packing	Tape and reel (`TR`)	Match
Temperature range	-40 to +85 C	Match datasheet
Datasheet property	Official ST PDF URL	Corrected; previously pointed to SnapEDA

Key specifications

Supply: VDD 1.62 to 3.6 V; independent VDD_IO supply.
Measurement ranges: +/-2 g, +/-4 g, +/-8 g, +/-16 g.
Output data rate: 1.6 Hz to 800 Hz.
Digital interfaces: I2C, SPI (3-wire/4-wire), and MIPI I3C.
Normal-mode current: approximately 6.1 uA at the stated datasheet condition; ultralow-power mode approximately 0.47 uA; power-down approximately 0.02 uA.
Integrated temperature sensor, self-test, motion/event detection, and FIFO.
Package: 12-lead LGA, nominal 2.0 x 2.0 mm, 0.74 mm maximum height.

Symbol pin cross-check

All 12 symbol pin numbers and names map to the datasheet correctly:

Table

Pin	Symbol name	Datasheet function	Result
1	SCL/SPC	I2C/I3C clock or SPI clock	Match
2	CS	SPI versus I2C/I3C mode selection; internal pull-up	Match
3	SDO/SA0	SPI data output or I2C address bit; internal pull-up	Match
4	SDA/SDI/SDO	I2C/I3C data, SPI input, or 3-wire SPI output	Match
5	NC	Internally unconnected; may be tied to VDD, VDD_IO, or GND	Match
6	GND	Ground	Match
7	RES	Must connect to GND	Match
8	GND	Ground	Match
9	VDD	Main supply	Match
10	VDD_IO	I/O supply	Match
11	INT2	Interrupt 2; optional clock input for on-demand conversion; internal pull-down	Match
12	INT1	Interrupt 1; internal pull-down	Match

Symbol mismatches / weaknesses

Every terminal currently has Pin Type=Unspecified. This loses ERC direction and power semantics. Suggested classifications are: pins 1 and 2 input; pin 3 bidirectional; pin 4 bidirectional; pin 5 passive/no-connect; pins 6 and 8 ground/power input; pin 7 power/passive ground-required; pins 9 and 10 power input; pin 11 bidirectional or output/input; pin 12 output.
Pin descriptions are not populated with the datasheet functions or internal pull-up/pull-down notes.
RES is correctly named but the symbol metadata does not state the mandatory GND connection.
The project uses a parametric symbol, but Pin Group, Pin Orientation, and Terminal Order metadata are absent. The rendered pin positions exist, but organization metadata is incomplete.

Footprint cross-check

Current footprint

Asset: FLIS2DU12TR
Footprint value: LGA-12L_LIS2DU12_STM
12 rectangular SMD pads.
Pad pitch: 0.50 mm.
Pad size: 0.2794 x 0.3048 mm, rotated as needed around the perimeter.
Pad centers are at approximately +/-0.8001 mm on the outer axis and -0.75/-0.25/+0.25/+0.75 mm on the sequenced axis.
Fabrication outline is approximately 2.1082 x 2.1082 mm; silkscreen outline is approximately 2.07 x 2.10 mm.
STEP asset: LGA-12L_LIS2DU12_STM.step.

Footprint result

Pad count and pad-to-pin mapping match the symbol and datasheet.
The 0.50 mm pitch matches the package drawing.
Land dimensions are close to the package terminal dimensions and appear plausible for soldering, but the LIS2DU12 datasheet delegates the authoritative PCB land pattern and soldering guidance to ST TN0018. Therefore, exact copper, mask, and paste compliance is not fully verified from DS12422 alone.
The footprint's KiCad attribute is through_hole even though all twelve pads are SMD. This is a footprint metadata mismatch and should be changed to an SMD attribute in the source footprint.
Pin-1 marking is not robustly verified. A hidden fabrication * exists and the silkscreen is asymmetric, but a clearly visible, unambiguous pin-1 marker should be confirmed visually before publishing.
The 3D model is linked, but its computed package-size metadata is zero, so dimensional/model alignment could not be proven from metadata alone.

Corrective actions applied

Datasheet URL changed from the SnapEDA landing page to the official ST PDF.
Manufacturer changed from LIS2DU12TR to STMicroelectronics.
Package/case metadata added as LGA-12L 2.0x2.0x0.74 mm.
Project description corrected from 0.8-400 Hz to the current 1.6-800 Hz ODR range and expanded with interfaces/package.

Open recommendations

Populate terminal Pin Type and Pin Description properties using the table above.
Add Pin Group, Pin Orientation, and Terminal Order metadata for a deterministic parametric symbol.
Correct the footprint source attribute from through-hole to SMD.
Validate copper, solder-mask, and paste dimensions against the latest ST TN0018 guidance.
Confirm the visible pin-1 marker and inspect STEP-to-pad alignment in 3D before publishing the part.

Scope
Part information
Key specifications
Symbol pin cross-check
Symbol mismatches / weaknesses
Footprint cross-check
Current footprint
Footprint result
Corrective actions applied
Open recommendations