Organized and verified all 77 terminals across nine functional groups. Section matches Pin Group throughout; Power is Top/order 1, Ground is Bottom/order 10, and Bluetooth, WLAN/SDIO, USB, GPIO, RF, debug, and NC groups use consistent Left/Right orientations and ordering.
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Pin electrical types remain Unspecified; they were outside this requested edit.
I’ll map every terminal’s electrical type from the Murata pin table, add concise datasheet-derived descriptions, then verify all 77 pins without changing their numbering or grouping.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
Bluetooth, WiFi 802.11a/b/g/n/ac, Bluetooth v5.2 Transceiver Module 2.412GHz ~ 2.472GHz, 5.18GHz ~ 5.825GHz Surface Mount
Wi-Fi + Bluetooth® module for wireless connectivity, supporting IEEE 802.11a/b/g/n/ac dual-band operation at 2.4 GHz and 5 GHz along with Bluetooth® 5.2 BR/EDR/LE functionality. The LBEE5PK2AE-564 integrates the Infineon CYW4373E chipset, supports SDIO 3.0 and USB 2.0 (shared) interfaces for WLAN, HCI UART/USB 2.0 (shared) and PCM for Bluetooth, operates over a -40°C to +85°C temperature range, and is housed in an 8.0 × 7.8 × 1.15 mm surface-mount module. Up to 433 Mbps data rates are supported using 802.11ac SISO operation with 20 MHz, 40 MHz, and 80 MHz channels.