Part Audit Report
Thought for 7 sec
I’ll audit the part metadata, locate the official ST datasheet if needed, then compare the symbol pins, footprint, and descriptions against the manufacturer documentation.
Worked for 5 mins 16 sec
Created a project doc
Part Audit Report
Part Audit Report
Sources
- Official product page: https://www.st.com/en/mems-and-sensors/ism330bx.html
- Official datasheet: https://www.st.com/resource/en/datasheet/ism330bx.pdf
- ST LGA mounting guidance (TN0018): https://www.st.com/resource/en/technical_note/tn0018-surface-mounting-guidelines-for-mems-sensors-in-an-lga-package-stmicroelectronics.pdf
- Datasheet reviewed: DS14588 Rev 2.
Suggested description: 6-axis industrial IMU with 3-axis accelerometer, 3-axis gyroscope, embedded AI/sensor fusion, SPI/I2C/MIPI I3C and TDM interfaces, LGA-14L.
Key specifications
- 3-axis accelerometer full scale: ±2/±4/±8 g
- 3-axis gyroscope full scale: ±125/±250/±500/±1000/±2000/±4000 dps
Audit complete. The 14-pad LGA footprint and pin numbering match ST’s datasheet, but the part has missing metadata, no pin descriptions, and incorrect electrical types for GND and INT2.
- Open item: The official datasheet is
https://www.st.com/resource/en/datasheet/ism330bx.pdf, but root part-property editing was unavailable, so the Datasheet URL remains unset. - Full findings: Part Audit Report
Fix metadata and pins
Correct part metadata
Review 3D model fit
Create application guidance
Refine this doc
Ask about this doc
Part Audit Report
Sources
- Official product page: https://www.st.com/en/mems-and-sensors/ism330bx.html
- Official datasheet: https://www.st.com/resource/en/datasheet/ism330bx.pdf
- ST LGA mounting guidance (TN0018): https://www.st.com/resource/en/technical_note/tn0018-surface-mounting-guidelines-for-mems-sensors-in-an-lga-package-stmicroelectronics.pdf
- Datasheet reviewed: DS14588 Rev 2.
Existing part metadata
Table
| Field | Current value | Assessment |
|---|---|---|
| Project/part name | ISM330BXTR | Correct ordering code |
| Manufacturer Part Number | ISM330BXTR | Correct |
| Manufacturer | STMicroelectronics | Correct |
| Pin count | 14 | Correct |
| Datasheet URL | Missing | Must be set to the official PDF above |
| Part Type | Missing | Should be Sensor (6-axis inertial measurement unit / IMU) |
| Package property | Missing | Should identify LGA-14L, 2.5 x 3.0 x 0.74 mm max |
| Description | 0.74mm DIZAR Manufacturer Recommendations 2 STMicroelectronics | Malformed/incomplete; does not describe the device |
Suggested description: 6-axis industrial IMU with 3-axis accelerometer, 3-axis gyroscope, embedded AI/sensor fusion, SPI/I2C/MIPI I3C and TDM interfaces, LGA-14L.
Key specifications
- 3-axis accelerometer full scale: ±2/±4/±8 g
- 3-axis gyroscope full scale: ±125/±250/±500/±1000/±2000/±4000 dps
- Accelerometer ODR: 1.875 Hz to 3.84 kHz; gyroscope ODR: 7.5 Hz to 3.84 kHz
- Accelerometer bandwidth: approximately 1.8 kHz (-3 dB) over SPI/I2C/I3C; wide-band response marketed up to 2 kHz
- Noise: 70 µg/√Hz typical accelerometer over SPI/I2C/I3C; 30 µg/√Hz over TDM; 4.5 mdps/√Hz gyroscope
- Supply: VDD 1.71–3.6 V; VDDIO 1.08–3.6 V
- Typical current: 0.6 mA accelerometer + gyroscope high-performance; 190 µA accelerometer-only high-performance
- Operating temperature: -40°C to +85°C
- Interfaces: SPI, I2C, MIPI I3C v1.1, TDM
- FIFO: 1.5 KB physical, up to 4.5 KB effective with compression
- Package: LGA-14L, 2.50 ±0.05 mm x 3.00 ±0.05 mm x 0.74 mm max
Symbol and pin audit
Pin numbers and names match the datasheet for all 14 pins. The symbol has no
Pin Description properties, so all datasheet functions and required tie-off guidance are currently absent.Table
| Pin | Name | Current type | Datasheet function | Assessment |
|---|---|---|---|---|
| 1 | SDO/TA0 | Bi-Directional | SPI SDO; I2C address LSB strap | Acceptable compromise, but description required |
| 2 | TDMOUT | Output | TDM output in Mode 2; tie to GND or VDDIO in Mode 1 | Type is incomplete for dual-use pin; description required |
| 3 | BCLK | Input | TDM bit clock; tie to GND or VDDIO in Mode 1 | Correct, description required |
| 4 | INT1 | Output | Programmable interrupt 1 | Correct, description required |
| 5 | VDDIO | Power In | I/O supply; 100 nF filter capacitor recommended | Correct, description required |
| 6 | AH1/QVAR1 | Input | Analog hub input 1 / Qvar electrode 1; tie to VDD or GND when disabled | Correct, description required |
| 7 | GND | Power In | 0 V supply | Mismatch: should use Ground pin type |
| 8 | VDD | Power In | Main supply; 100 nF filter capacitor recommended | Correct, description required |
| 9 | AH2/QVAR2 | Input | Analog hub input 2 / Qvar electrode 2; tie to VDD or GND when disabled | Correct, description required |
| 10 | INT2 | Bi-Directional | Programmable interrupt 2 | Mismatch: should be Output |
| 11 | WCLK | Input | TDM word clock; tie to VDDIO or leave unconnected in Mode 1 | Correct, description required |
| 12 | CS | Input | I2C/I3C vs SPI mode selection | Correct, description required |
| 13 | SCL | Input | I2C/I3C clock; SPI clock | Correct, description required |
| 14 | SDA | Bi-Directional | I2C/I3C data; SPI SDI; 3-wire SPI bidirectional data | Correct, description required |
Footprint audit
The footprint contains 14 pads and matches the datasheet package geometry:
- Body outline: 3.0 mm x 2.5 mm
- Pad pitch: 0.5 mm
- Package pad size: 0.475 mm x 0.25 mm
- Pad numbering proceeds correctly around the four sides and includes a pin-1 marker
- Courtyard: 3.5 mm x 3.0 mm
The copper lands are the same size as the package pads. This is consistent with TN0018 because the adjacent-pad spacing is 0.025 mm (≤ 0.2 mm), for which ST recommends PCB land length and width equal to the LGA solder-pad dimensions. The footprint’s solder-mask openings are 0.1 mm larger in each dimension, also matching TN0018 guidance.
No footprint geometry or pin-number mismatch was found.
Flagged issues
- Datasheet URL missing. Intended value: https://www.st.com/resource/en/datasheet/ism330bx.pdf
- Part Type missing; should be Sensor / IMU.
- Package metadata missing; footprint itself is correct for LGA-14L 2.5 x 3.0 x 0.74 mm max.
- Description is malformed and incomplete.
- Pin 7 GND electrical type is incorrect (
Power Ininstead ofGround). - Pin 10 INT2 electrical type is incorrect (
Bi-Directionalinstead ofOutput). - Pin 2 TDMOUT type does not capture its Mode 1 strap/tie-off requirement.
- All 14 terminals lack pin descriptions.
Datasheet-property update status
The official URL was verified, but the available project-editing interface in this session does not expose mutation of root part properties such as
Datasheet URL. No incorrect terminal-level workaround was applied. The property remains unset and should be entered on the part root as:https://www.st.com/resource/en/datasheet/ism330bx.pdfSources
Existing part metadata
Key specifications
Symbol and pin audit
Footprint audit
Flagged issues
Datasheet-property update status
