Audit of the GPY211C0VC part metadata, schematic symbol terminals, PCB footprint, and terminal descriptions against the official MaxLinear GPY211 datasheet.
Stored PDF is official MaxLinear document 617810, Rev. 1.4 (2021-04-27).
MaxLinear currently lists Rev. 1.5 (March 2024) for GPY211B1VC / GPY211C0VC. The official page did not expose a stable direct PDF URL through the available web extraction.
Existing Part Information
Table
Field
Current value
Assessment
Part name / MPN
GPY211C0VC
Correct
Manufacturer
MaxLinear
Correct
Part type
Ethernet
Correct but broad
Description
Ethernet ICs TRANSVR IC GPY211C0VC VQFN56 SLNW8 COMM>
Identifies the device, package, former SPEC code, and commercial grade, but is distributor-style, abbreviated, and has a stray trailing >
Terminal count
57
Correct: 56 perimeter leads plus exposed pad
Designator prefix
IC
Appropriate
Datasheet URL
Official MaxLinear Rev. 1.4 PDF
Present; no missing-URL update required. It is one revision behind the current Rev. 1.5 listing.
Package property
No explicit Package or Case Code property found
Metadata omission; footprint itself is PG-VQFN-56 / 7 mm x 7 mm
Key Specifications
Single-port 2.5G Ethernet PHY.
Line-side standards/rates: 10BASE-Te, 100BASE-TX, 1000BASE-T, and 2.5GBASE-T.
MAC interface: SGMII+/SGMII with rate adaptation.
IEEE 1588v2 precision time protocol and timestamping support.
Energy Efficient Ethernet (IEEE 802.3az), Wake-on-LAN, cable diagnostics, Auto MDI/MDI-X, and jumbo frames up to 10 kB.
Integrated DC/DC converter enables single 3.3 V input operation; optional external 1.0 V low-voltage rails.
Supply ranges: 3.3 V domains 3.13–3.46 V; 1.0 V domains 0.97–1.03 V; MDIO pad supply selectable as 1.8 V (1.71–1.89 V) or 3.3 V (3.135–3.46 V).
Commercial operating range: 0°C to 70°C; operation up to 85°C ambient is conditional on junction temperature remaining at or below 110°C.
Active ordering code GPY211C0VC; former Intel sales code 99AFC6; former SPEC code SLNW8; OTP firmware 0x886F.
Package: PG-VQFN-56, 7.0 mm x 7.0 mm, 0.4 mm pitch, 0.90 mm max height, exposed ground pad.
Symbol Cross-Check
All 56 numbered symbol terminals match the datasheet pin-number/name table. Duplicate functional pins are differentiated with schematic suffixes (DCDC_REGO_1/_2, VDD_1/_2, GND_1/_2, VDDA3V3_1/_2, VDDA0V9_1/_2/_3) while retaining the correct physical pin numbers. Pin 12 is labeled MDINT, matching the package pinout table; the detailed function table also identifies GPIO14 as its general-purpose/alternate identity.
The exposed pad is represented as terminal 57 named EP. Electrically this corresponds to datasheet EPAD / VSS and must connect to the PCB ground plane.
Symbol metadata mismatches
Every terminal has Pin Type: Unspecified; the datasheet defines input, output, bidirectional, analog, power, and ground roles.
No Pin Description properties are populated. Therefore important requirements and alternate functions are absent from the part, including HRSTN behavior, TRSTN pull-down, SGMII AC coupling, MDIO voltage selection, oscillator requirements, RCAL/RESREF resistor functions, and exposed-pad grounding.
Pin 12's symbol name MDINT is valid, but a description should preserve the GPIO14 alternate function.
Exposed-pad name EP is understandable but less explicit than datasheet naming VSS/EPAD.
Footprint Cross-Check
The footprint is QFN40P700X700X90-57N-D and describes PG-VQFN-56.
Confirmed geometry:
56 perimeter pads plus one central exposed pad: correct.
7.0 mm x 7.0 mm body: correct.
0.4 mm lead pitch: correct.
0.20 mm perimeter pad width: matches nominal lead width.
0.85 mm footprint pad length provides a normal solder land extension beyond the nominal 0.4 mm package lead length.
5.2 mm x 5.2 mm exposed pad: consistent with the package drawing/footprint convention.
Pin-1 chamfer and marker are present.
3D model asset is attached.
Footprint caveat
The datasheet provides the package outline and requires the exposed pad to be grounded, but the extracted document does not provide a complete recommended PCB land-pattern table. The footprint is dimensionally consistent with the package outline, but solder-paste segmentation and the thermal-via pattern are not encoded in this bare part footprint. MaxLinear thermal characterization references a 4-layer PCB with 16 thermal vias; the final board should implement an appropriate exposed-pad paste aperture and grounded thermal-via array according to assembler/process guidance.
Mismatches and Recommended Corrections
High priority
Populate Pin Type for all terminals from the datasheet. Current Unspecified values weaken ERC and semantic checks.
Populate Pin Description for all terminals, including alternate functions and mandatory connection notes.
Medium priority
Add explicit package metadata: Package or Case Code = PG-VQFN-56 (7 x 7 mm, 0.4 mm pitch).
Clean the description to: Single-port 2.5GBASE-T Ethernet PHY with SGMII+/SGMII, IEEE 1588v2, integrated DC/DC, PG-VQFN-56, commercial temperature.
Rename or describe exposed pad as VSS (EPAD) to make its required ground connection unambiguous.
Low priority / maintenance
The Datasheet URL is valid and official, so it was not changed under the requested missing-URL rule. It points to Rev. 1.4, while MaxLinear lists Rev. 1.5 (March 2024). Replace it when a stable official Rev. 1.5 direct PDF URL is available.
Overall Result
The core identity, MPN, manufacturer, terminal count, pin numbering/naming, and package geometry are consistent with the datasheet. The main quality issue is incomplete terminal metadata rather than an incorrect pinout or footprint.