The project description says both “surface-mounting” and “PCB terminal”; for Omron this is ambiguous/conflicting. The exact MPN G6S-2 DC5 corresponds to PCB terminals, not the SMT -2F or -2G versions.
Coil
Rated coil voltage: 5 VDC
Rated coil current: 28.1 mA
Coil resistance: 178 ohm, ±10% at 23 °C
Must operate voltage: 75% max. of rated voltage = 3.75 V max.
Must release voltage: 10% min. of rated voltage = 0.5 V min.
Longitudinal terminal pitch sequence: 5.08 mm, 2.54 mm, 2.54 mm
For G6S-2 PCB-terminal version:
8 PCB holes, 1.0 mm diameter
Row pitch: 5.08 ±0.1 mm
Footprint view: bottom view
For SMT G6S-2F / G6S-2G:
8 rectangular pads, 1.0 mm × 2.2 mm
Same X positions: 0, 5.08, 7.62, 10.16 mm
Outside-L -2F: top/bottom pad outside-to-outside dimension 8.0 mm
Inside-L -2G: top/bottom pad outside-to-outside dimension 6.1 mm
Footprint view: top view
Symbol pin cross-check
Project terminal mapping:
Table
Project terminal
Project pin number
Datasheet function
Status
COIL+
1
Coil +
OK
COIL_-
12
Coil −
OK
N.C._1
3
Pole A NC, connected to pin 4 when de-energized
OK
COM_1
4
Pole A common
OK
N.O._1
5
Pole A NO, connected to pin 4 when energized
OK
N.O._2
8
Pole B NO, connected to pin 9 when energized
OK
COM_2
9
Pole B common
OK
N.C._2
10
Pole B NC, connected to pin 9 when de-energized
OK
Symbol pin numbering and function labels match the datasheet.
Footprint cross-check
Observed PCB pad positions/rules from the layout tool:
Table
Pad
Observed position
Observed size
Observed shape
COIL+
x=0, y=0
0.0015 × 0.0015 mm
rectangle
COIL_-
x=0, y=0.00508
0.0015 × 0.0015 mm
circular
N.C._1
x=0.00508, y=0
0.0015 × 0.0015 mm
circular
N.C._2
x=0.00508, y=0.00508
0.0015 × 0.0015 mm
circular
COM_1
x=0.00762, y=0
0.0015 × 0.0015 mm
circular
COM_2
x=0.00762, y=0.00508
0.0015 × 0.0015 mm
circular
N.O._1
x=0.01016, y=0
0.0015 × 0.0015 mm
circular
N.O._2
x=0.01016, y=0.00508
0.0015 × 0.0015 mm
circular
The position numbers appear scaled as meters or otherwise unit-misinterpreted relative to the expected millimeter footprint. If interpreted literally as millimeters, the pad spacing is 0.00508 mm / 0.01016 mm, not the datasheet’s 5.08 mm / 10.16 mm. The pad size is also far too small for either the through-hole or SMT version.
Expected by exact MPN G6S-2 DC5:
Through-hole / PCB-terminal footprint, not SMT pads.
8 holes, each 1.0 mm diameter.
Row pitch 5.08 mm.
X positions 0, 5.08, 7.62, 10.16 mm.
Expected if the intended part is actually SMT:
MPN should be G6S-2F DC5 or G6S-2G DC5, not G6S-2 DC5.
Pads should be rectangular, 1.0 × 2.2 mm.
Row spacing should match the selected SMT variant: 8.0 mm outside-to-outside for -2F, or 6.1 mm outside-to-outside for -2G.
Mismatches / issues flagged
MPN vs description/mount conflict: Project MPN is G6S-2 DC5, which the datasheet identifies as PCB-terminal through-hole. Project description and Mount property say surface-mount. If SMT is intended, the MPN should likely be G6S-2F DC5 or G6S-2G DC5.
Footprint pad geometry mismatch: Current footprint pads are effectively 0.0015 mm and circular except pin 1, which does not match either the through-hole 1.0 mm holes for G6S-2 or the SMT 1.0 × 2.2 mm rectangular pads for G6S-2F/G.
Footprint scale mismatch: Pad positions appear to use 0.00508 and 0.01016 where datasheet dimensions require 5.08 mm and 10.16 mm, suggesting a 1000× unit scaling issue.
Pin descriptions missing: Terminals have no useful Pin Description; all have Pin Type: Unspecified. The pin numbers and labels are correct, but descriptions/types should be populated from the datasheet for clarity and ERC quality.
Part Type is generic/nonstandard for relay: Project Part Type is Electromechanical Components; a more specific relay classification would be clearer if supported by the property system.
Recommended next action
Decide intended physical variant first:
If exact MPN G6S-2 DC5 is required: change the part metadata to through-hole / PCB terminal and rebuild the footprint with 8 through-hole pads/holes per datasheet.
If surface-mount is required: change the MPN to either G6S-2F DC5 or G6S-2G DC5 and rebuild the footprint using the correct SMT pad row spacing.
After that, update terminal pin descriptions and pin types from the datasheet.