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ESD2CAN24DBZRQ1 Part Review
Date: 2026-07-20
Scope
Reviewed available part information for the published Flux part ESD2CAN24DBZRQ1: MPN, manufacturer, package, pin count, description, properties, schematic symbol terminals, PCB footprint, and pin metadata. The official Texas Instruments datasheet was added to the part metadata because the Datasheet URL was initially blank.
Part Metadata Found in Flux

Table


FieldCurrent ValueDatasheet / TI Source Check
Manufacturer Part NumberESD2CAN24DBZRQ1Matches TI orderable part number
Manufacturer NameTexas InstrumentsMatches datasheet
Datasheet URLhttps://www.ti.com/lit/ds/symlink/esd2can24-q1.pdfOfficial TI datasheet URL added
DescriptionC / IPC-7351B / 1.12 mm / Texas InstrumentsIncomplete; does not describe the device function
Designator PrefixDAppropriate for TVS/ESD diode array
Terminal / pin count3Matches SOT-23 (DBZ), 3-pin
PackageSOT-23 (DBZ), 1.12 mm max heightMatches TI ordering info for ESD2CAN24DBZRQ1
Datasheet Identity
Official datasheet: Texas Instruments ESD2CAN24-Q1, ESD2CANFD24-Q1, ESD2CANXL24-Q1, document SLVSFW5D, revised March 2026.
TI ordering addendum lists ESD2CAN24DBZRQ1 as:
  • Status: Active / Production
  • Package: SOT-23 (DBZ), 3 pins
  • Carrier quantity: 3000, large tape-and-reel
  • RoHS: Yes
  • Lead finish: NiPdAu
  • MSL: Level-1, 260 C unlimited
  • Operating temperature: -55 C to 150 C
  • Part marking: 1L3
Pin Cross-Check
Datasheet pin table for DBZ / DCK package:

Table


PinDatasheet NameDatasheet TypeDatasheet DescriptionFlux Current MetadataResult
1IOI/OESD protected IOPin Type: Bi-Directional; no pin descriptionFunction/type OK; description missing
2IOI/OESD protected IOPin Type: Bi-Directional; no pin descriptionFunction/type OK; description missing
3GNDGConnect to groundPin Type: Power In; no pin descriptionType mismatch; should be Ground, description missing
Symbol geometry has three terminal symbols and the schematic symbol pin numbers are present. The current symbol does not expose functional pin names/descriptions on the inspected terminal entries.
Footprint Cross-Check
Flux footprint asset: SOT95P237X112-3N.kicad_mod.
Current footprint pads from the KiCad footprint payload:

Table


PadPosition (mm)Size (mm)ShapeDatasheet Expected
1-1.055, -0.951.24 x 0.59RectDBZ land pattern: 1.3 x 0.6 mm, pitch/spacing 0.95 mm / 2.1 mm
2-1.055, 0.951.24 x 0.59RectDBZ land pattern: 1.3 x 0.6 mm, pitch/spacing 0.95 mm / 2.1 mm
31.055, 0.001.24 x 0.59RectDBZ land pattern: 1.3 x 0.6 mm, pitch/spacing 0.95 mm / 2.1 mm
Footprint outline from the KiCad payload:
  • Fab/body outline: approximately 1.30 mm x 2.92 mm, matching the datasheet body range of 1.2-1.4 mm by 2.8-3.04 mm.
  • Pin center spacing appears consistent with the datasheet example board layout: 0.95 mm spacing on the two-pin side and about 2.1 mm across the package.
  • Pad size is slightly smaller than the TI example land pattern: 1.24 x 0.59 mm vs 1.3 x 0.6 mm. TI notes that IPC-7351 may have alternate designs; the Flux description explicitly references IPC-7351B, so this is likely an IPC-derived nominal footprint rather than a critical mismatch.
Key Electrical Specs for ESD2CAN24-Q1 Variant

Table


ParameterValue
Recommended input / working voltage-24 V to +24 V
Reverse stand-off voltage, VRWM+/-24 V
Breakdown voltage, VBRF25.5 V to 35.5 V at +10 mA
Breakdown voltage, VBRR-35.5 V to -25.5 V at -10 mA
Clamping voltage, 8/20 us surge37 V typ at 5.7 A
Clamping voltage, TLP35 V typ at 16 A
Surge current, IEC 61000-4-5 8/20 us5.7 A max
Surge power, IEC 61000-4-5 8/20 us210 W max
IEC 61000-4-2 contact discharge+/-30 kV
IEC 61000-4-2 air-gap discharge+/-30 kV
ISO 10605 contact / air dischargeup to +/-30 kV, depending test capacitance
Line capacitance3 pF typ, 5 pF max at 1 MHz
Leakage current-50 nA to +50 nA at VIO = +/-24 V
Dynamic resistance0.35 ohm typ
Operating free-air temperature-55 C to 150 C
Mismatches / Issues Flagged
  1. Pin 3 type mismatch: datasheet says pin 3 is GND type G; Flux currently marks pin 3 as Power In. Recommended correction: set Pin Type to Ground and Pin Description to Connect to ground.
  2. Pin descriptions missing: pins 1 and 2 should describe ESD protected IO; pin 3 should describe Connect to ground.
  3. Part description is incomplete: current description only lists C / IPC-7351B / 1.12 mm / Texas Instruments. Recommended description: Automotive 2-channel CAN bus ESD protection diode, +/-24 V VRWM, SOT-23-3 (DBZ), AEC-Q101/Q100-oriented Q1 device family.
  4. Part Type property is blank: recommended part type is Protection or Diode depending library taxonomy preference.
  5. Footprint pad size differs slightly from TI example: current 1.24 x 0.59 mm pads are slightly smaller than TI's 1.3 x 0.6 mm example. Because TI explicitly allows IPC-7351 alternate designs and this part description cites IPC-7351B, this is flagged as a minor review note, not a blocking footprint error.
Overall Assessment
The selected MPN, manufacturer, pin count, package family, and footprint geometry are broadly consistent with the Texas Instruments datasheet for ESD2CAN24DBZRQ1. The main actionable metadata issue is the schematic terminal metadata: pin 3 should be Ground rather than Power In, and all three pins need datasheet-derived descriptions.
  • Scope

  • Part Metadata Found in Flux

  • Datasheet Identity

  • Pin Cross-Check

  • Footprint Cross-Check

  • Key Electrical Specs for ESD2CAN24-Q1 Variant

  • Mismatches / Issues Flagged

  • Overall Assessment