I’ll review the oscillator part metadata, find and set the official datasheet URL if it’s missing, then cross-check symbol, footprint, and pin descriptions against the datasheet.
Key result: MPN, package, 4-pin symbol mapping, and embedded footprint payload match the ECS datasheet. Flagged items: pin types/descriptions are missing, the Datasheet URL points to a stored copy instead of the official ECS URL, and the layout tree shows a possible 1000x computed pad-geometry scaling anomaly that should be visually verified before publishing.
Note: The part already had a Datasheet URL property set, so the project property was not changed. The official ECS PDF was used as the cross-check reference.
Datasheet-Derived Key Specs
Source: ECS-2520MVLC official datasheet, ECS Inc. International.
Soldering: peak +260 C +/-5 C, 10 s +/-5 s max, 2 cycles max
MSL: 1
Tape/reel option TR: 1,000 pieces per reel
Datasheet Pinout
Table
Pin
Datasheet name
Function
1
Tri-state
Output enable / standby control; high or NC = active, low = high impedance
2
GND
Ground
3
Output
CMOS oscillator output
4
Vdd
Supply voltage
Standby thresholds from datasheet:
Pin 1 >= 0.7 x Vdd or NC: output active
Pin 1 <= 0.3 x Vdd: output high impedance
Schematic Symbol Cross-Check
Current symbol terminals:
Table
Symbol terminal
Pin number property
Datasheet check
TRI-STATE
1
Matches pin 1 Tri-state
GND
2
Matches pin 2 GND
OUTPUT
3
Matches pin 3 Output
VDD
4
Matches pin 4 Vdd
Result: Symbol pin names and pin numbers match the datasheet pinout.
Symbol issues / cleanup opportunities:
All terminal Pin Type properties are currently Unspecified. Recommended types: TRI-STATE = Input, GND = Ground, OUTPUT = Output, VDD = Power In.
Explicit Pin Description properties are not populated. Recommended descriptions are the functions listed in the datasheet pinout table above.
Footprint Cross-Check
Datasheet package dimensions:
Body: 2.5 mm x 2.0 mm x 0.8 mm
Package tolerance noted in datasheet extraction: +/-0.1 mm on body dimensions
Bottom pad / package detail includes C0.3 chamfer/edge detail and side metallization detail
Datasheet suggested land pattern, from available extraction:
Land pad: about 0.9 mm x 0.8 mm
Pad spacing / center-related dimension: 0.95 mm shown in the land pattern figure
Vertical gap between upper/lower land pads: about 0.65 mm
Current imported KiCad footprint payload:
Fabrication outline: 2.5 mm x 2.0 mm, matching datasheet body size
Pad count: 4, matching datasheet
Pad size in footprint payload: 0.800 mm x 0.900 mm, rotated 90 degrees; this corresponds to the datasheet's ~0.9 mm x 0.8 mm land pads
Pad centers in footprint payload:
Pad 1: (-0.925, +0.725) mm
Pad 2: (+0.925, +0.725) mm
Pad 3: (+0.925, -0.725) mm
Pad 4: (-0.925, -0.725) mm
This gives center-to-center spacing of 1.85 mm horizontally and 1.45 mm vertically, consistent with a 2.5 mm x 2.0 mm oscillator land pattern with 0.8/0.9 mm pads and about 0.65 mm internal gap.
Result: The embedded KiCad footprint payload appears consistent with the datasheet land pattern and 4-pad package.
Footprint issues / risks:
The layout tree's computed child pad rules report pad sizes and positions as 0.0008/0.0009 and 0.000925-scale coordinates while the embedded KiCad footprint payload uses 0.800/0.900 mm and 0.925 mm. This looks like a unit display/extraction scaling anomaly. If the actual PCB editor renders the footprint at micron scale, the footprint must be fixed before release; if the editor uses the KiCad payload dimensions, the footprint is acceptable.
Courtyard in the imported footprint is 4.75 mm x 4.25 mm, much larger than the 2.5 mm x 2.0 mm body. This is conservative rather than electrically wrong, but may waste placement area.
Mismatch Summary
Confirmed matches:
MPN matches ECS part-numbering structure.
Frequency code 081.92 matches 8.192 MHz.
Stability code C matches +/-25 ppm.
Temperature code N matches -40 C to +85 C.
TR packaging matches 1,000/reel.
Symbol pin numbers and names match the datasheet pinout.
Footprint pad count, body outline, and pad land dimensions in the embedded KiCad footprint payload match the datasheet.
Flagged mismatches / concerns:
Pin electrical types are all Unspecified instead of functional types.
Pin descriptions are missing, though terminal labels are correct.
The layout tree reports computed pad geometry at 1000x smaller numerical scale than the KiCad footprint payload; verify actual PCB rendering before publishing or manufacturing.
CMOS Crystal Oscillator (XO) – 8.192 MHz CMOS clock oscillator with enable/disable function for precision clock generation. Operates from a 1.6 V to 3.6 V supply, features ±25 ppm frequency stability, 1.8 mA maximum supply current, 45/55% duty cycle, 7 ns maximum rise/fall time, and 5 ms maximum startup time. Specified for operation over a −40°C to +85°C temperature range and housed in a 4-pad 2.5 × 2.0 mm surface-mount package with a 0.9 mm maximum height.