Part Datasheet Audit
Thought for 6 sec
I’ll audit the part metadata, obtain the official TI datasheet if needed, then cross-check the symbol pins, footprint, and descriptions. I’ll update only the Datasheet property and report any library-quality mismatches.
Thought for 19 sec
The official TI datasheet is already attached, so no property update is needed. I found a 9-pad PowerPAD SOIC footprint and am now validating its pin mapping, dimensions, and metadata against TI’s package and pin tables.
Thought for 2 mins 6 sec
Reviewed the complete part against TI’s official DRV8871-Q1 datasheet; the existing Datasheet URL is official, so it was not changed. Pin-to-pad mapping and the DDA 8-pin PowerPAD footprint are correct, including the exposed thermal pad; key specs are 6.8–45 V, 3.6 A peak, 200 kHz maximum PWM, −40 to 125 °C ambient, and 565 mΩ typical bridge RDS(on).
Flagged metadata issues: Part Type is blank; all symbol pin types are “Unspecified”; pin descriptions are missing; and the exposed pad is labeled
GND_2/pin 9 rather than PAD/thermal ground. The library’s 9-terminal count is acceptable only as 8 leads plus the exposed pad—TI specifies the package as 8-pin DDA.Fix symbol metadata
Complete part properties
Validate thermal footprint
Review 3D model
