Part Datasheet Audit

A

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll audit the part metadata, obtain the official TI datasheet if needed, then cross-check the symbol pins, footprint, and descriptions. I’ll update only the Datasheet property and report any library-quality mismatches.

flux

The official TI datasheet is already attached, so no property update is needed. I found a 9-pad PowerPAD SOIC footprint and am now validating its pin mapping, dimensions, and metadata against TI’s package and pin tables.

flux

Reviewed the complete part against TI’s official DRV8871-Q1 datasheet; the existing Datasheet URL is official, so it was not changed. Pin-to-pad mapping and the DDA 8-pin PowerPAD footprint are correct, including the exposed thermal pad; key specs are 6.8–45 V, 3.6 A peak, 200 kHz maximum PWM, −40 to 125 °C ambient, and 565 mΩ typical bridge RDS(on).
Flagged metadata issues: Part Type is blank; all symbol pin types are “Unspecified”; pin descriptions are missing; and the exposed pad is labeled GND_2/pin 9 rather than PAD/thermal ground. The library’s 9-terminal count is acceptable only as 8 leads plus the exposed pad—TI specifies the package as 8-pin DDA.
Fix symbol metadata
Complete part properties
Validate thermal footprint
Review 3D model
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Files

Pins

Symbol

Layout

3D View

IN2
Pin Number
2
IN1
Pin Number
3
GND_1
Pin Number
1
ILIM
Pin Number
4
Name
Pin #
Type
Section
Pin Group
Orientation
Order
Sub-symbol
GND_1
1
Unspecified
Bottom
IN2
2
Unspecified
IN1
3
Unspecified
ILIM
4
Unspecified
VM
5
Unspecified
OUT1
6
Unspecified
PGND
7
Unspecified
Bottom
OUT2
8
Unspecified
GND_2
9
Unspecified
Bottom

DRV8871DDARQ1