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Part Audit Report
Scope
Audit of the CD74HC4067E part metadata, schematic symbol, terminal descriptions/types, and PCB footprint against Texas Instruments documentation.
Authoritative references
The part already had a Datasheet URL populated (https://pdf1.alldatasheet.co.kr/datasheet-pdf/view/517534/TI/CD74HC4067E.html), so no Datasheet property update was required by the requested conditional workflow. The official TI URL above is preferable for future maintenance.
Metadata review

Table


FieldProject valueDatasheet / TI valueResult
MPNCD74HC4067ECD74HC4067EMatch
ManufacturerTexas InstrumentsTexas InstrumentsMatch
PackagePDIPE suffix: 24-pin PDIP, TI package drawing NMatch, but package property could be more specific (PDIP-24 / N)
Pin count24 terminals24 pinsMatch
DescriptionProject description: “High Speed CMOS 16-Ch MUX/DEMUX 24P PDIP”; no explicit indexed Description propertyHigh-speed CMOS 16-channel analog multiplexer/demultiplexerFunctionally correct; explicit Description property appears absent
DatasheetThird-party mirror is populatedOfficial TI PDF availableNot missing, but non-authoritative URL
Designator prefixICICReasonable
Symbol and pinout cross-check
All 24 terminal numbers and names match the TI top-view pinout:

Table


PinProject terminalTI functionResult
1COMMON_INPUT/OUTPUTCommon analog input/outputMatch
2–9I7, I6, I5, I4, I3, I2, I1, I0Bidirectional switch channelsMatch
10–11S0, S1Select/address inputsMatch
12GNDGroundMatch
13–14S3, S2Select/address inputsMatch
15~EActive-low enableMatch; TI labels it E with an active-low bar
16–23I15, I14, I13, I12, I11, I10, I9, I8Bidirectional switch channelsMatch
24VCCPositive supplyMatch
Symbol metadata mismatches
  • Every terminal has Pin Type: Unspecified. TI defines pins 1–9 and 16–23 as bidirectional I/O, pins 10, 11, 13, 14, and 15 as inputs, and pins 12 and 24 as power pins.
  • Explicit Pin Description properties are absent. The names communicate the pinout, but the semantic descriptions should identify switch I/O, select/address, active-low enable, ground, and supply roles.
  • The active-low nature of pin 15 is represented by ~E; this is electrically correct, though a rendered overbar should be visually verified.
Footprint cross-check
Matching geometry
  • 24 pads are present.
  • Pad numbering follows the correct counter-clockwise DIP sequence when viewed from the top.
  • Measured pad pitch is 2.54 mm.
  • Row center spacing is 15.24 mm.
  • Pin 1 uses a rectangular marker; the other pads are circular.
  • The footprint asset name (DIP1524W53P254L3104H508Q24N.kicad_mod) is consistent with a 24-pin, 2.54-mm-pitch, 15.24-mm-row-spacing DIP and approximately 31-mm body length.
Footprint concerns
  • The inspected pad diameter resolves to approximately 1.13 mm. That is unusually small for a hand-soldered PDIP annular pad and leaves little margin around a typical DIP lead/drill. Confirm the plated-hole diameter and annular ring before publishing or manufacturing.
  • No explicit drill/hole size was exposed in the inspected pad rules. Because CD74HC4067E is through-hole, absence of a plated drill would be a critical footprint defect. This requires direct footprint-editor/Gerber verification.
  • The asset naming suggests a body-width field near 5.3 mm, which is ambiguous for the wide 15.24-mm-row PDIP. Verify the silkscreen/courtyard body outline against TI package N; pad row spacing itself is correct.
Key electrical specifications
  • Function: digitally controlled, bidirectional 16-channel analog multiplexer/demultiplexer.
  • HC supply range: 2 V to 6 V.
  • Analog switch signal range: 0 V to VCC.
  • Ambient operating range: −55 °C to +125 °C.
  • Typical on resistance: 70 Ω at VCC = 4.5 V; 60 Ω at VCC = 6 V.
  • Typical break-before-make interval: 6 ns at VCC = 4.5 V.
  • Typical −3 dB bandwidth: 89 MHz at VCC = 4.5 V.
  • Typical THD: 0.051% at 1 kHz, 4 Vpp, VCC = 4.5 V.
  • Typical off-state feedthrough: −75 dB.
  • Typical switch input capacitance: 5 pF; common capacitance: 50 pF.
  • PDIP junction-to-ambient thermal resistance: 67 °C/W.
Overall assessment
The MPN, package family, pin count, terminal names, and pin-number mapping are correct. The main quality issues are incomplete terminal semantic metadata and an unresolved footprint manufacturability concern around plated-hole/drill definition and annular-pad sizing. The official TI datasheet was found, but the existing Datasheet property was not overwritten because it was already populated.
  • Scope

  • Authoritative references

  • Metadata review

  • Symbol and pinout cross-check

  • Symbol metadata mismatches

  • Footprint cross-check

  • Matching geometry

  • Footprint concerns

  • Key electrical specifications

  • Overall assessment