Audit of project metadata, schematic symbol terminals, and PCB footprint against Texas Instruments BQ7961x-Q1 datasheet Rev. F (June 2026) and PAP0064F package information.
Audit complete. The existing datasheet is official TI content, so it was not replaced; critical issues include an invalid/questionable MPN, incorrect TO package metadata, numeric-only untyped symbol pins, and an oversized exposed pad.
Full specifications, 65-pad mapping, and footprint comparison are in Part Audit Report. I also filed an internal part-quality report for review.
I’ll apply the TI-backed metadata, fully define all 65 terminals, correct the PowerPAD geometry, then re-inspect the symbol and footprint against PAP0064F.
Updated the part to TI’s BQ79616PAPRQ1 data: official datasheet, PAP0064F package metadata, and all 65 terminals now have correct names, electrical types, descriptions, grouping, and pin numbers. The centered PowerPAD is corrected to 6.5 × 8.0 mm, with reduced paste coverage.
Open item: Paste is a reduced single 3.5 × 5.0 mm aperture; segmented stencil apertures require rebuilding/augmenting the footprint geometry.
Verification confirms 65 unique terminals, 65 mapped pads, and no reported part-review findings.