BMM150 Part Review

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BMM150 Part Review

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Date: 2026-07-20 Reviewed the available Flux part information for the Bosch Sensortec BMM150, including MPN, package, pin count, description...

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Completed the BMM150 part review and saved the detailed findings in BMM150 Part Review. The symbol pin mapping matches the Bosch datasheet, but I flagged a likely blocking footprint pad scaling/rendering issue plus missing pin types/descriptions.
Open items:
  • Datasheet URL is populated, but it points to Arrow; the official Bosch PDF is recommended.
  • Footprint pads appear 1000× too small in the layout data.
  • Pin Type and Pin Description metadata should be filled in.
Suggested next steps:
  1. Update the Datasheet URL to the official Bosch PDF.
  2. Fix/rebuild the WLCSP footprint pad geometry.
  3. Add datasheet-backed pin types and descriptions for all 12 terminals.
Fix metadata and footprint
Update datasheet URL
Add pin metadata
Fix WLCSP footprint
Run DRC/ERC

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BMM150 Part Review
Date: 2026-07-20
Scope
Reviewed the available Flux part information for the Bosch Sensortec BMM150, including MPN, package, pin count, description, project properties, schematic symbol terminals, footprint geometry, and datasheet-derived specifications.
Datasheet Source
Current part/project Datasheet URL property:
  • https://www.arrow.com/en/products/bmm150/bosch
Official datasheet found during review:
  • Bosch Sensortec BMM150 datasheet, document BST-BMM150-DS001-05, revision 1.4, April 2020
  • https://www.bosch-sensortec.com/media/boschsensortec/downloads/datasheets/bst-bmm150-ds001.pdf
The Datasheet URL property was already populated, so the conditional “if no datasheet URL is already set” did not strictly require an update. However, the current URL is a distributor product page, not the official Bosch PDF; replacing it with the Bosch PDF is recommended.
Current Part Metadata Reviewed

Table

FieldCurrent valueReview
Manufacturer Part NumberBMM150Matches datasheet
Manufacturer NameBOSCHAcceptable, but Bosch Sensortec is more precise
Package or Case CodeWLCSPMatches datasheet family; more precise package is 12-ball WLCSP, 1.56 mm x 1.56 mm x 0.6 mm
Designator PrefixICAcceptable
Pin / terminal count12Matches datasheet
Datasheet URLArrow product pageUsable as a reference link, but official Bosch PDF is preferred
DescriptionBoard-mount Hall Effect / magnetic sensor, 3-axis, 1.56 mm x 1.56 mm WLCSP-12 geomagneticBroadly correct; “3-axis geomagnetic/magnetometer sensor” is the more precise datasheet wording
Key Datasheet Specs

Table

ParameterDatasheet value
Device typeBosch Sensortec BMM150 3-axis geomagnetic / magnetometer sensor
TechnologyBosch FlipCore geomagnetic sensor
Package12-pin / 12-ball WLCSP
Body size1.56 mm x 1.56 mm x 0.6 mm nominal
Ball diameter250 um nominal
Land diameter recommendation0.200 mm circular lands
Ball / land pattern pitch0.283 mm orthogonal grid increments, equivalent to 0.4 mm diagonal pitch
VDD supply1.62 V to 3.6 V, 2.4 V typical
VDDIO supply1.2 V to 3.6 V, 1.8 V typical
InterfacesI2C, 4-wire SPI, 3-wire SPI
Protocol selectPS = 0 selects SPI; PS = 1 selects I2C
I2C address mode7-bit only
I2C addresses0x10, 0x11, 0x12, 0x13 based on CSB/SDO
Default I2C address0x10 when CSB = GND and SDO = GND
I2C max bus capacitance400 pF
SPI max clock10 MHz
Magnetic range X/YTyp. +/-1300 uT
Magnetic range ZTyp. +/-2500 uT
Heading accuracyTyp. +/-2.5 deg under datasheet conditions
Low-power currentTyp. 170 uA at 10 Hz low-power preset
Suspend currentTyp. 3 uA
Operating temperature-40 C to +85 C
Absolute max VDD/VDDIO-0.3 V to +4.0 V
Logic pad absolute max-0.3 V to VDDIO + 0.3 V
ESD2 kV HBM, 500 V CDM
Symbol / Pin Mapping Cross-Check
The schematic symbol is implemented as 12 terminal components. Terminal names and pin numbers match the Bosch datasheet pin table.

Table

Current terminalCurrent ballDatasheet functionResult
PSA1Protocol select inputMatch
SCKA3Serial clock, SPI SCK / I2C SCLMatch
CSBA5SPI chip select / I2C address selectMatch
VDDIOB2I/O-domain supplyMatch
SDIB4SPI SDI/MOSI, 3-wire bidirectional data, or I2C SDAMatch
SDOC1SPI SDO/MISO, or I2C address selectMatch
GND_1C5GroundMatch
INTD2Interrupt outputMatch
DRDYD4Data-ready outputMatch
GND_2E1GroundMatch
GND_3E3GroundMatch
VDDE5Core/internal-domain supplyMatch
Symbol Metadata Issues
No pin-number/name mapping mismatches were found, but the terminal metadata is incomplete.

Table

BallNameCurrent Pin TypeRecommended Pin TypeRecommended Pin Description
A1PSUnspecifiedInputProtocol select: 0 = SPI, 1 = I2C
A3SCKUnspecifiedInputSerial clock: SPI SCK or I2C SCL
A5CSBUnspecifiedInputSPI chip select; in I2C mode selects address bit 1
B2VDDIOUnspecifiedPowerI/O-domain supply, 1.2 V to 3.6 V
B4SDIUnspecifiedBidirectionalSPI SDI/MOSI, 3-wire SPI bidirectional data, or I2C SDA
C1SDOUnspecifiedOutputSPI SDO/MISO; in I2C mode selects address bit 0
C5GNDUnspecifiedPower / GroundGround
D2INTUnspecifiedOutputInterrupt output; may be left DNC if unused per datasheet
D4DRDYUnspecifiedOutputData-ready output; may be left DNC if unused per datasheet
E1GNDUnspecifiedPower / GroundGround
E3GNDUnspecifiedPower / GroundGround
E5VDDUnspecifiedPowerInternal/core-domain supply, 1.62 V to 3.6 V
Recommended cleanup: add Pin Type and Pin Description for every terminal. This will improve ERC behavior and make the part easier to use correctly.
Footprint Cross-Check
Datasheet Geometry
Bosch recommends a 12-land WLCSP footprint with:
  • 0.200 mm circular landing pads
  • 0.283 mm orthogonal spacing between staggered grid locations
  • 1.56 mm package body dimension
  • 100 um recommended solder paste thickness
  • NSMD or SMD land strategy may be used depending on PCB process
Footprint Asset Intent
The embedded KiCad footprint text includes the expected 12 pads:

Table

PadPosition in footprint textSize
A1+0.566, -0.566 mm0.200 mm circular
A3+0.566, 0 mm0.200 mm circular
A5+0.566, +0.566 mm0.200 mm circular
B2+0.283, -0.283 mm0.200 mm circular
B4+0.283, +0.283 mm0.200 mm circular
C10, -0.566 mm0.200 mm circular
C50, +0.566 mm0.200 mm circular
D2-0.283, -0.283 mm0.200 mm circular
D4-0.283, +0.283 mm0.200 mm circular
E1-0.566, -0.566 mm0.200 mm circular
E3-0.566, 0 mm0.200 mm circular
E5-0.566, +0.566 mm0.200 mm circular
If interpreted as millimeters, this intended pad pattern matches the datasheet landing pattern.
Footprint Implementation Concern
The Flux layout tree reports the generated pad nodes with computed positions and sizes around:
  • Pad positions: 0.000566 mm, 0.000283 mm, etc.
  • Pad size: 0.0002 mm
These are 1000x smaller than the intended 0.566 mm / 0.283 mm coordinates and 0.200 mm pad diameter. The flat layout view shows the outline/silk at approximately the expected millimeter scale but does not show visible pads, consistent with the pad nodes being effectively microscopic or not rendered as usable copper pads.
This is the primary blocking mismatch: the footprint asset text contains the right geometry, but the actual layout pad nodes appear to be scaled incorrectly or missing from the rendered footprint.
Mismatches / Issues Flagged
High Severity
  1. Footprint pad scale / visibility issue
    • Expected: 0.200 mm circular pads at +/-0.566 mm and +/-0.283 mm offsets.
    • Observed in layout tree: pads at approximately 0.0002 mm size and 0.000566 mm offsets.
    • Impact: footprint may be non-manufacturable and non-connectable unless pad scaling is corrected.
  2. Datasheet URL is not the official Bosch PDF
    • Current property points to an Arrow product page.
    • Recommended replacement: https://www.bosch-sensortec.com/media/boschsensortec/downloads/datasheets/bst-bmm150-ds001.pdf.
Medium Severity
  1. All terminal Pin Type fields are Unspecified
    • The datasheet provides clear I/O and supply types.
    • This weakens ERC and automated design checks.
  2. Pin Description fields are missing
    • Especially important for SDI/SDO/CSB because their functions change between SPI and I2C.
Low Severity
  1. Manufacturer name could be more precise
    • Current: BOSCH
    • Preferred: Bosch Sensortec
  2. Description could be tightened
    • Preferred wording: “Bosch Sensortec BMM150 ultra-low-power 3-axis geomagnetic/magnetometer sensor with I2C/SPI interface in 12-ball WLCSP.”
  3. Silkscreen/refdes may be oversized for a 1.56 mm WLCSP
    • The footprint text is much larger than the package body. Consider moving refdes/fab text outside the package or using assembly/fab-only marking.
Conclusion
The BMM150 part metadata is mostly correct, and the schematic pin-number mapping matches the Bosch datasheet. The main quality issues are incomplete terminal metadata and a likely 1000x footprint pad scaling/rendering problem in the actual layout pad nodes. The official Bosch PDF should be used for the Datasheet URL, even though a distributor URL is already present.

  • Scope

  • Datasheet Source

  • Current Part Metadata Reviewed

  • Key Datasheet Specs

  • Symbol / Pin Mapping Cross-Check

  • Symbol Metadata Issues

  • Footprint Cross-Check

  • Datasheet Geometry

  • Footprint Asset Intent

  • Footprint Implementation Concern

  • Mismatches / Issues Flagged

  • High Severity

  • Medium Severity

  • Low Severity

  • Conclusion

Documents

Assets

BMM150-thumb.png

BMM150-thumb.png

BMM150-thumbThumbnail

BMM150

BMM150.kicad_modFootprint
BMM150

BMM150

BMM150.stp3D Model

BMM150

BMM150 Symbol.svgDefault

BMM150

BMM150 thumbnail
3-Axis Geomagnetic Sensor – Ultra-low-power 3-axis digital magnetometer based on Bosch FlipCore® technology for electronic compass, navigation, motion tracking, and augmented reality applications. Operates from a 1.62 V to 3.6 V core supply and 1.2 V to 3.6 V I/O supply, features 13-bit magnetic field resolution, I²C and SPI digital interfaces, and measures magnetic fields up to ±1300 µT (X/Y) and ±2500 µT (Z). Supports programmable output data rates up to 30 Hz (normal mode), consumes as little as 3 µA in suspend mode and 170 µA typical in low-power mode (10 Hz), and includes programmable interrupts, self-test, and integrated temperature compensation. Specified for operation over a −40°C to +85°C temperature range and housed in a 12-ball WLCSP (1.56 × 1.56 mm) package.
#BoschSensortec #BMM150 #Magnetometer #GeomagneticSensor #3AxisSensor #DigitalCompass #FlipCore #HallEffect #I2C #SPI #MotionTracking #Navigation #EmbeddedSystems

Properties

BMM150

BOSCH

Sensor

arrow.com/en/products/bmm150/bosch

IC

WLCSP

parametric-v1

Pricing & Availability

DPN

Stock

Qty 1

3

0

$0.00

1

0

$0.60574

1

9.4K

$1.5794

1

0

$0.00

Controls