The re-imported FP_XDCR_BMM150 source geometry is correctly scaled:
- 12 circular pads, 0.200 mm diameter
- 0.566 mm pitch
- Outer pad-center span: 1.132 × 1.132 mm
- Body outline: 1.56 × 1.56 mm
- Pin-1 marker is present
However, the effective footprint is still incorrect because stale per-pad overrides from my previous attempt remain active and are still being interpreted at 0.001× scale. The imported footprint also specifies a large 0.102 mm solder-mask expansion, producing approximately 0.404 mm mask openings, which should be reviewed for this fine-pitch WLCSP.