BMM150 Part Review


The re-imported FP_XDCR_BMM150 source geometry is correctly scaled:
  • 12 circular pads, 0.200 mm diameter
  • 0.566 mm pitch
  • Outer pad-center span: 1.132 × 1.132 mm
  • Body outline: 1.56 × 1.56 mm
  • Pin-1 marker is present
However, the effective footprint is still incorrect because stale per-pad overrides from my previous attempt remain active and are still being interpreted at 0.001× scale. The imported footprint also specifies a large 0.102 mm solder-mask expansion, producing approximately 0.404 mm mask openings, which should be reviewed for this fine-pitch WLCSP.
Fix the footprint by removing all stale per-pad overrides and correcting the 0.001× scale. Review and adjust the 0.102 mm solder-mask expansion to ensure the resulting ~0.404 mm mask openings are appropriate for the fine-pitch WLCSP.
I’ll remove every stale pad-level rule, normalize the imported footprint so its effective geometry is 0.200 mm pads on the 0.566 mm array, then set a tighter mask expansion and verify the resulting mask web.
Stale rules are cleared. I’m now applying the corrected source-pad coordinates and a 0.050 mm mask expansion, giving 0.300 mm mask openings and 0.266 mm minimum mask web at 0.566 mm pitch.
Footprint corrected and verified:
  • Removed all 24 stale per-pad rulesets and prior direct overrides.
  • Effective pad diameter: 0.200 mm
  • Effective pitch: 0.566 mm in both axes
  • Effective outer-center span: 1.132 × 1.132 mm
  • Solder-mask expansion reduced to 0.050 mm
  • Resulting mask opening: 0.300 mm diameter
  • Minimum mask web: 0.266 mm
All 12 pads now have the expected effective coordinates, circular geometry, and signal-to-ball mapping.

Name
Pin #
Type
Section
Pin Group
Orientation
Order
Sub-symbol
PS
A1
Unspecified
SCK
A3
Unspecified
CSB
A5
Unspecified
VDDIO
B2
Unspecified
SDI
B4
Unspecified
SDO
C1
Unspecified
GND_1
C5
Unspecified
INT
D2
Unspecified
DRDY
D4
Unspecified
GND_2
E1
Unspecified
GND_3
E3
Unspecified
VDD
E5
Unspecified

BMM150