Part Datasheet Review
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Created a project doc
APS6408L-3OBM-BA Part Review
Date: 2026-07-21 Reviewed the available part information in Flux for the published part project silicon-yard/aps6408l-3obm-ba, checked the e...
Completed the part review and saved the detailed cross-check in APS6408L-3OBM-BA Part Review.
Open items:
- Datasheet URL already existed, so I did not change it; the report notes the official AP Memory PDF URL as a preferable source.
- Pinout and footprint match the datasheet.
- Main mismatches are metadata quality: subtype/logic function are wrong, pin electrical types/descriptions are missing, and
DQS/_DMnaming should be cleaned up.
Suggested next steps:
- Update part metadata to PSRAM/memory instead of Logic/AND.
- Add pin electrical types and datasheet-backed pin descriptions.
- Optionally replace the distributor-hosted Datasheet URL with the official AP Memory URL.
Fix metadata and pins
Fix metadata issues
Add pin descriptions
Use official datasheet
Run final review
Refine this doc
Ask about this doc
APS6408L-3OBM-BA Part Review
Date: 2026-07-21
Scope
Reviewed the available part information in Flux for the published part project
silicon-yard/aps6408l-3obm-ba, checked the existing Datasheet URL, and cross-checked the schematic terminals, pin/ball assignments, footprint geometry, and pin descriptions against the AP Memory datasheet.Existing Flux Part Information
Table
| Field | Flux value | Review |
|---|---|---|
| Project / part name | APS6408L-3OBM-BA | Matches MPN. |
| Manufacturer Part Number | APS6408L-3OBM-BA | Matches datasheet ordering table. |
| Manufacturer Name | AP Memory | Matches datasheet. |
| Description | DRAM IoT RAM 64Mb OPI (x8) DDR 133MHz, 3V, Ind. Temp., BGA24 | Functionally matches datasheet, though the device is more specifically AP Memory DDR OPI / Xccela PSRAM. |
| Part Type | Integrated Circuits | Acceptable broad category, but not specific. A more precise type would be PSRAM / pSRAM / memory IC. |
| Library part subtype | Logic | Mismatch: this is a memory IC / PSRAM, not a logic gate. |
| Logic Function | AND | Mismatch: unrelated to this part. |
| Designator Prefix | IC | Acceptable. |
| Terminal count | 24 | Matches 24-ball package. |
| Datasheet URL | https://www.mouser.jp/datasheet/2/1127/APM_PSRAM_OPI_Xccela_APS6408L_3OBMx_v3_5b_PKG-1954852.pdf | Present, so no missing-datasheet update was required. This is a distributor-hosted datasheet. Official AP Memory URL found: https://www.apmemory.com/wp-content/uploads/APS6408L-3OBM.pdf |
| Package / footprint asset | BGA24C100P5X5_600X800X120 / mini-BGA 24B | Matches 6 x 8 x 1.2 mm, 1.0 mm pitch, 24-ball BA package. |
Datasheet Sources Checked
- Existing Flux Datasheet URL: Mouser-hosted AP Memory datasheet, Rev. 3.5b, Dec. 13, 2019.
- Official AP Memory datasheet found by web search:
APS6408L-3OBMx DDR OPI Xccela PSRAM, Rev. 3.8, Aug. 15, 2022, hosted atapmemory.com.
Because a Datasheet URL was already present, I did not change the part property. If the project should point only to the manufacturer-hosted PDF, update
Datasheet URL to the official AP Memory URL above.Key Datasheet Specs
Table
| Spec | Datasheet value |
|---|---|
| Manufacturer | AP Memory |
| Part number | APS6408L-3OBM-BA |
| Memory type | Double-Data-Rate OPI / Xccela PSRAM |
| Density / organization | 64 Mb, 8M x 8-bit |
| Interface | Octal SPI, DDR Xccela mode |
| Max clock | 133 MHz |
| Max throughput | 266 MB/s read/write |
| Supply voltage | VDD = 2.7 to 3.6 V; VDDQ = 2.7 to 3.6 V |
| Temperature range for APS6408L-3OBM-BA | Tc = -40 °C to +85 °C |
| Extended-temp sibling | APS6408L-3OBMX-BA, -40 °C to +105 °C |
| Package | mini-BGA 24L, package code BA |
| Package body | 6.0 x 8.0 x 1.2 mm nominal |
| Ball pitch | 1.0 mm |
| Ball diameter | 0.40 mm nominal, 0.35 to 0.45 mm |
| Standby current | 250 µA standard-temp max; 140 µA room typical/limit per table context |
| Read/write current | 14 mA at 133 MHz |
| Reset pin | RESET# is active low and internally weak-pulled up; may be left floating if unused |
Pin / Ball Assignment Cross-Check
Datasheet ball map, top view, ball down:
Table
| Ball | Datasheet signal | Flux terminal | Result |
|---|---|---|---|
| A1 | No ball / omitted | Omitted | OK |
| A2 | NC | NC_1 | OK |
| A3 | CE# | CE# | OK |
| A4 | RST# / RESET# | RST# | OK; naming abbreviation acceptable. |
| A5 | NC | NC_2 | OK |
| B1 | NC | NC_3 | OK |
| B2 | CLK | CLK | OK |
| B3 | VSS | VSS | OK |
| B4 | VDD | VDD | OK |
| B5 | NC | NC_4 | OK |
| C1 | VSSQ | VSSQ_1 | OK; suffix distinguishes duplicate supply ball. |
| C2 | RSU / RFU | RSU | Acceptable if datasheet uses RSU in this revision; note earlier datasheet note says RFU reserved for 2nd CE#. |
| C3 | DQS/DM | DQS/_DM | Minor naming mismatch: extra underscore. Function and ball number match. |
| C4 | ADQ2 | ADQ2 | OK |
| C5 | NC | NC_5 | OK |
| D1 | VDDQ | VDDQ_1 | OK; suffix distinguishes duplicate supply ball. |
| D2 | ADQ1 | ADQ1 | OK |
| D3 | ADQ0 | ADQ0 | OK |
| D4 | ADQ3 | ADQ3 | OK |
| D5 | ADQ4 | ADQ4 | OK |
| E1 | ADQ7 | ADQ7 | OK |
| E2 | ADQ6 | ADQ6 | OK |
| E3 | ADQ5 | ADQ5 | OK |
| E4 | VDDQ | VDDQ_2 | OK; suffix distinguishes duplicate supply ball. |
| E5 | VSSQ | VSSQ_2 | OK; suffix distinguishes duplicate supply ball. |
Footprint Cross-Check
Table
| Footprint item | Flux footprint | Datasheet | Result |
|---|---|---|---|
| Ball count | 24 pads, A2-A5, B1-B5, C1-C5, D1-D5, E1-E5 | 24 balls, A1 omitted | OK |
| Array | 5 columns x 5 rows with A1 absent | 5 columns x 5 rows with one omitted ball | OK |
| Pitch | 1.0 mm in KiCad footprint pad coordinates | 1.0 mm BSC | OK |
| Body outline | 6.0 x 8.0 mm in footprint name and silk/fab outline | 6.0 x 8.0 x 1.2 mm nominal | OK |
| Ball / pad size | 0.37 mm circular SMD pad in KiCad footprint | Ball diameter 0.40 mm nominal, 0.35 mm solder-mask opening note | Likely OK; footprint pad size is plausible for 0.4 mm BGA balls, but land-pattern recommendation was not explicitly found in the datasheet. |
| Pin-1 / A1 indicator | Chamfer/dot near missing A1 corner | Package has omitted A1 corner / top-view orientation | OK |
| 3D model | APS6408L-3OBM-BA.stp | Package 6 x 8 x 1.2 mm | Present; exact dimensional verification from STEP was not possible from text inspection alone. |
Mismatches / Issues Flagged
- Part subtype and logic function are incorrect. Library data reports subtype
LogicandlogicFunction = AND; this part is a 64 Mb DDR OPI PSRAM/memory IC, not a logic AND device. - Pin electrical types are all
Unspecified. Datasheet defines supply pins, grounds, inputs, and bidirectional I/O. Recommended types:- VDD, VDDQ: Power In
- VSS, VSSQ: Ground
- CE#, CLK, RST#: Input
- ADQ0..ADQ7, DQS/DM: Bi-Directional / IO
- NC pins: Not Connected
- RSU/RFU: Reserved
- Pin descriptions are missing. Terminals do not include datasheet descriptions such as
Core supply 3.0 V,IO supply 3.0 V,Chip select active low,Clock signal,DQ strobe during reads / data mask during writes, etc. - Datasheet URL is distributor-hosted. A datasheet URL is present, so no mandatory update was required, but the official AP Memory PDF is available and may be preferable.
- Minor signal naming difference:
DQS/_DMin Flux vsDQS/DMin the datasheet. Function and ball assignment match; this is a naming cleanup issue, not a pinout error. - Description says “DRAM IoT RAM.” The datasheet identifies the part as DDR OPI / Xccela PSRAM. The current description is understandable but should ideally say PSRAM.
Overall Result
The schematic ball mapping and footprint geometry are consistent with the datasheet for APS6408L-3OBM-BA. The main issues are metadata quality and missing pin typing/descriptions, not pinout or footprint errors.
Scope
Existing Flux Part Information
Datasheet Sources Checked
Key Datasheet Specs
Pin / Ball Assignment Cross-Check
Footprint Cross-Check
Mismatches / Issues Flagged
Overall Result
