Part Audit Review


Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata and existing assets, locate the official TE Connectivity datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against the source.
I’m inspecting the current metadata, terminal definitions, rendered symbol, and all 17 footprint pads before comparing them with the manufacturer drawing.
Created a project doc

Part Audit Report

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Part Audit Report Scope
Audit of TE Connectivity MPN 2311763-1, covering project properties, schematic symbol, 17 terminals, PCB footprint, and available 3D/CAD assets.
Identity and key specifications
The official TE product page identifies the device as a 15-position, shell-size-1, board-mount receptacle for signal use. The TE customer drawing URL was successfully resolved using document ENG_CD_2311763_D.pdf; however, the datasheet extraction returned OCR text without immutable citation provenance, so drawing-derived dimensions below should be treated as independently checked but not citation-backed in Flux.
Existing project metadata
No Datasheet property update was made because a value is already present, per the requested condition. It should nevertheless be corre...
Audit complete. The Part Audit Report contains the full specification and geometry cross-check.
  • Core footprint geometry and 17-pad count broadly match the TE connector.
  • Major issues: corrupted symbol rendering, missing pin descriptions/types, incorrect TO package and Standard mount metadata, incomplete Datasheet URL, and unverified drill diameters.
  • The Datasheet property was not changed because it was already populated, although its URL is incomplete.
  • A part-quality ticket was filed for Flux review.
Repair metadata and symbol
Verify footprint drills
Fix all part issues

Part Audit Report
Scope
Audit of TE Connectivity MPN 2311763-1, covering project properties, schematic symbol, 17 terminals, PCB footprint, and available 3D/CAD assets.
Identity and key specifications

Table


ItemAudited value
ManufacturerTE Connectivity
MPN2311763-1
Product familyAMPLIMITE HD-22 high-density D-sub
Connector15-position receptacle, right-angle, through-hole PCB mount
Rows3
Signal contact rating3 A maximum
Contact pitch2.29 mm (0.09 in)
Contact row spacing at mating interface1.98 mm (0.078 in)
Contact styleRound socket
HousingBlack, PBT GF
LifecycleActive
Project terminals17 total: contacts 1–15 plus boardlocks MH1 and MH2
The official TE product page identifies the device as a 15-position, shell-size-1, board-mount receptacle for signal use. The TE customer drawing URL was successfully resolved using document ENG_CD_2311763_D.pdf; however, the datasheet extraction returned OCR text without immutable citation provenance, so drawing-derived dimensions below should be treated as independently checked but not citation-backed in Flux.
Existing project metadata

Table


PropertyCurrent valueAssessment
Manufacturer Part Number2311763-1Correct
Manufacturer NameTE ConnectivityCorrect
Part TypeConnectorsAcceptable, though singular Connector would be cleaner
Datasheet URLhttps://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdocMalformed/incomplete: official domain, but missing document parameters and does not uniquely open the drawing
Designator PrefixJCorrect
MountStandardMismatch: should identify through-hole / board mount rather than Standard
Package or Case CodeTOMismatch: TO is a transistor-package convention and is inappropriate for this D-sub connector
DescriptionLong attribute string in library recordPartially useful but truncated at “PCB Mount Retention Type”; should be replaced with a concise complete description
Explicit pin-count propertyNot setMissing; physical contacts are 15, while the project has 17 terminals including two boardlocks
No Datasheet property update was made because a value is already present, per the requested condition. It should nevertheless be corrected to the complete official TE document-delivery URL.
Schematic symbol and terminals
What matches
  • Exactly 15 numbered electrical contacts are present.
  • Two additional terminals, MH1 and MH2, correspond to the two boardlocks represented by footprint pads.
  • Pin numbers 1 through 15 map one-to-one to footprint pads 1 through 15.
Mismatches and quality issues
  • All 17 terminals use Pin Type = Unspecified; connector contacts should normally be passive, while mounting/boardlock terminals should be mechanical or excluded from electrical checks when the platform supports it.
  • Pin descriptions are absent. Contacts should at least be identified as signal contacts, and MH1/MH2 as boardlocks/mechanical retention.
  • No exclusion state is defined for MH1 and MH2, creating a risk that mechanical pads appear as electrical pins or generate ERC noise.
  • The rendered symbol is visually corrupted or unusable: instead of readable pin numbers/names, it displays many empty rectangular glyphs and overlapping text-like blocks.
  • The symbol arranges pins 1–9 on the left and 10–15 plus mounting holes on the right, rather than depicting the physical 5/5/5 row arrangement. A logical connector symbol may be non-physical, but this representation is difficult to cross-check and does not communicate mating-face numbering.
Footprint cross-check
Confirmed from project geometry
  • 17 pads exist: 1–15, MH1, MH2.
  • Contact pads are on a 2.29 mm horizontal grid with 1.145 mm stagger offsets between rows.
  • PCB-tail rows are separated by 2.54 mm in the footprint.
  • Boardlock centers are 25.00 mm apart.
  • Signal pad outer size is 1.785 mm; pad 1 is rectangular for orientation and pads 2–15 are circular.
  • Boardlock pad outer size is 4.77 mm.
  • The footprint includes fabrication and silkscreen outlines and a STEP model.
Drawing-based checks
OCR extraction of the TE drawing indicates nominal contact holes of about 1.19 mm and boardlock holes of about 3.05 mm, with 25.00 mm boardlock spacing. The project inspection did not expose drill diameters, so hole sizes remain unverified. The confirmed 25.00 mm spacing matches.
Footprint concerns
  • Drill diameters could not be read from the current layout inspection and must be verified directly in the footprint asset before manufacturing.
  • Reference and value text appear coincident at the same coordinates, which may cause silkscreen overlap.
  • No courtyard or separately indexed mechanical-outline asset was found.
Assets
  • 2311763-1 Symbol.svg — default/thumbnail symbol asset; rendered output is currently corrupted.
  • 23117631.kicad_mod — KiCad footprint source.
  • 2311763-1.stp — STEP model, placed with rotation 90 0 0.
  1. Replace the incomplete Datasheet URL with the complete official TE customer-drawing URL for ENG_CD_2311763_D.pdf.
  2. Change Mount to Through Hole / Board Mount using the closest supported taxonomy.
  3. Replace Package or Case Code TO with a connector-specific value such as HD-15 right-angle THT or leave it blank if the taxonomy has no valid equivalent.
  4. Repair/rebuild the schematic symbol so pin numbers render clearly; set contacts 1–15 to passive and identify MH1/MH2 as mechanical/excluded.
  5. Add terminal descriptions and a clear pin-numbering orientation note.
  6. Verify footprint drill diameters against the official drawing: approximately 1.19 mm for signal contacts and 3.05 mm for boardlocks, subject to drawing tolerance confirmation.
  7. Separate reference/value text and add/verify courtyard clearance.
Overall disposition
Not ready for trusted reuse without correction. The basic identity, terminal count, footprint pad count, pitch pattern, and boardlock spacing are broadly consistent with the TE part, but the metadata taxonomy, incomplete Datasheet URL, missing terminal semantics, corrupted symbol rendering, and unverified drill sizes are material quality issues.
  • Scope

  • Identity and key specifications

  • Existing project metadata

  • Schematic symbol and terminals

  • What matches

  • Mismatches and quality issues

  • Footprint cross-check

  • Confirmed from project geometry

  • Drawing-based checks

  • Footprint concerns

  • Assets

  • Recommended corrections

  • Overall disposition