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#Goal

- Prepare the PCB layout for the SHOWDUINO SUE 0 CORE CARRIER, REV A by finalizing the footprint assignments, board stackup, and component placement to meet both functional and mechanical requirements.

#Implementation plan

1. Package and Footprint Review

1. Review and lock down package footprints for all components including the ESP32-S3 module, CP2102N USB-UART, buck regulators, connectors, inductors, and test points.

2. Board Stackup and Rule Configuration

1. Configure the board stackup including copper thickness, layer arrangement, clearance rules, and RF reference planes.

3. Component and Mechanical Feature Placement

1. Place mechanical features such as M3 mounting holes and define appropriate RF keepout zones.

2. Add critical components like connectors, LEDs, headers, and test points in proper alignment with the mechanical and electrical requirements.

4. Silkscreen and Annotation

1. Add silkscreen labels including the board name, REV A, header pin legends, and any other necessary markings (e.g., DO NOT LOAD).

5. Design Verification

1. Run an initial DRC/airwire check to validate clearances and net connections, ensuring that the layout meets design rules.

#Success criteria

- All component footprints are correctly chosen and placed.

- The board stackup and layout rules are configured to accommodate RF and clearance requirements.

- Mechanical features and silkscreen annotations fully meet the design specifications.

- The DRC/airwire check is passed without errors.

Set Stackup to "Standard 4 Layer, 1 oz copper"

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