Work completed
- Defined project description and system architecture diagram.
- Added all major ICs (U1 ATSAMD21G18A-M, U2 MCP73871-2CCI/ML, U3 LSM6DS3TR).
- Added active components: SW1 tactile button, D1 status LED.
- Placed decoupling capacitors (C1–C10) and pull-up resistors (R1–R6) with appropriate values and ratings.
- Added connectors: J1 USB micro-B, J2 JST-PH battery, J3 microSD socket, J4 4-pin I2C header, TP-1–TP-6 test pads.
- Fully wired schematic nets to satisfy power tree, MCU, IMU, OLED, and microSD interface requirements.
- Reviewed and updated all passive and active component properties for voltage, power, package, and footprint compatibility.
- Verified and updated footprints for every component.
- Defined board outline size at 45 mm × 30 mm and added four mounting holes for wrist attachment.
Tasks remaining (unmarked)
- Assign manufacturer part numbers to generic resistors and capacitors for availability.
- Review schematic and layout for manufacturability and generate a to-do list of any issues.
Tasks I cannot perform
- Configure the board stackup to a 2-layer PCB.
- Designate copper layers for the ground plane and configure ground fill.
- Classify nets by type (power, I2C, SPI, USB, signal) in the project.
- Set trace widths for power nets and configure USB D+/D− impedance rules.
- Place components on the board according to ergonomic and IMU-centric placement.
- Route all nets using auto-layout.
- Review the routed board for DRC/ERC compliance.
Success criteria review
- ✔️ Complete schematic with integrated Li-Po charge/protection, 3.3 V regulation, and correct peripheral connections.
- ❌ 2-layer PCB layout with ground plane (stackup and ground fill not yet configured).
- ❌ Production-ready outputs (BOM, pick-and-place, Gerbers not yet generated).
Recommended next step
Proceed to the manufacturability review phase: assign manufacturer part numbers to generic components, then configure the 2-layer stackup and ground-plane copper fill. After that, you or your team can finalize component placement and routing, perform DRC/ERC checks, and generate manufacturing outputs.