Schematic Import and Component Mapping
- Import the supplied KiCad schematic into the project.
- Map the schematic symbols to appropriate library parts with their MPNs and update the schematic with the correct links for production.
- Run ERC to verify and resolve any schematic errors.
PCB Stackup and Configuration
- Configure the PCB layout for a 2-layer stackup (Top and Bottom copper layers).
- Define the board outline and establish mounting and mechanical constraints.
- Set up design rules including trace widths, clearances, and via sizes that cater to RF paths, battery power, and ESD safety.
Component Placement and Critical Areas Identification
- Floorplan and place key components including the RF module, MCU, power management ICs, battery circuitry, charging connectors, and any ESD protection units.
- Mark and define RF keepout areas and ensure short, controlled RF paths.
- Incorporate appropriate decoupling near power inputs and critical ICs.
Routing and Layout Execution
- Establish a ground-first strategy with a solid bottom GND pour and use stitching vias.
- Route critical RF paths using controlled impedance and minimal via usage.
- Employ Auto-Layout for initial trace routing then hand-route key traces (RF, power) to ensure compliance with design constraints.
- Validate the design with a complete DRC to ensure no rule violations occur.
Finalization and Documentation
- Finalize silkscreen markings and part placements.
- Verify all parts and connectivity for manufacturability and system requirements.
- Generate Gerber files, the Bill of Materials (BOM), and the pick-and-place files.